JP2015070184A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2015070184A JP2015070184A JP2013204822A JP2013204822A JP2015070184A JP 2015070184 A JP2015070184 A JP 2015070184A JP 2013204822 A JP2013204822 A JP 2013204822A JP 2013204822 A JP2013204822 A JP 2013204822A JP 2015070184 A JP2015070184 A JP 2015070184A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 129
- 230000002093 peripheral effect Effects 0.000 claims abstract description 63
- 230000005684 electric field Effects 0.000 claims description 92
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 4
- 229920005591 polysilicon Polymers 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 238000009413 insulation Methods 0.000 abstract 3
- 238000000034 method Methods 0.000 description 18
- 239000012535 impurity Substances 0.000 description 16
- 230000015556 catabolic process Effects 0.000 description 15
- 238000009826 distribution Methods 0.000 description 15
- 239000000758 substrate Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 7
- 150000002500 ions Chemical class 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000005468 ion implantation Methods 0.000 description 5
- 238000004088 simulation Methods 0.000 description 5
- 238000002513 implantation Methods 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000009271 trench method Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
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- H01L29/063—Reduced surface field [RESURF] pn-junction structures
- H01L29/0634—Multiple reduced surface field (multi-RESURF) structures, e.g. double RESURF, charge compensation, cool, superjunction (SJ), 3D-RESURF, composite buffer (CB) structures
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
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- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7811—Vertical DMOS transistors, i.e. VDMOS transistors with an edge termination structure
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- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
Abstract
【解決手段】素子領域及び外周領域に形成された第1導電型の半導体領域と、外周領域の半導体領域中に素子領域を囲むリング状に形成された第2導電型の複数の柱状領域と、少なくとも一部の柱状領域の上部にそれぞれ接続して外周領域の半導体領域の上面に配置された第2導電型の複数の電界緩和領域と、電界緩和領域を覆って外周領域の半導体領域上に配置された絶縁膜と、素子領域と外周領域との境界から外周領域の外縁に向かって隣接して配置された一対の電界緩和領域のうちの境界側の電界緩和領域と絶縁膜に形成された開口部で接触し、且つ、一対の電界緩和領域のうちの外縁側の電界緩和領域と絶縁膜を介して到達する連結フィールドプレート電極とを備える。
【選択図】図1
Description
半導体装置1の低オン抵抗化のためには、柱状領域20の幅が狭いことが好ましい。この場合、すべての柱状領域20の上端に電界緩和領域30を配置すると、製造工程の精度の限界によって電界緩和領域30同士が接触してしまう場合がある。電界緩和領域30同士が接触すると、電界集中の緩和ができなくなり、耐圧が低下する。このため、一部の柱状領域20の上端とは電界緩和領域30に接続していないように電界緩和領域30を設けない外周領域102を構成してもよい。
上記のように本発明は実施形態によって記載したが、この開示の一部をなす論述及び図面はこの発明を限定するものであると理解すべきではない。この開示から当業者には様々な代替実施形態、実施例及び運用技術が明らかとなろう。
10…半導体領域
20…柱状領域
21…周辺領域
30…電界緩和領域
40…絶縁膜
50…連結フィールドプレート電極
60…外周フィールドプレート電極
70…外縁電極
80…外縁フィールドプレート電極
100…半導体素子
101…素子領域
102…外周領域
103…境界
104…外縁
110…基板
120…ベース領域
130…ソース領域
140…ゲート電極
150…ゲート絶縁膜
160…ソース電極
170…ドレイン電極
200…セルユニット
Claims (9)
- 半導体素子が形成された素子領域と前記素子領域の周囲に配置された外周領域を有する半導体装置において、
前記素子領域及び前記外周領域に形成された第1導電型の半導体領域と、
前記外周領域の前記半導体領域中に前記素子領域を囲むリング状に形成された第2導電型の複数の柱状領域と、
少なくとも一部の前記柱状領域の上部にそれぞれ接続して前記外周領域の前記半導体領域の上面に配置された第2導電型の複数の電界緩和領域と、
前記電界緩和領域を覆って前記外周領域の前記半導体領域上に配置された絶縁膜と、
前記素子領域と前記外周領域との境界から前記外周領域の外縁に向かって隣接して配置された一対の前記電界緩和領域のうちの前記境界側の電界緩和領域と前記絶縁膜に形成された開口部で接触し、且つ、前記一対の前記電界緩和領域のうちの前記外縁側の電界緩和領域と前記絶縁膜を介して到達する連結フィールドプレート電極と
を備えることを特徴とする半導体装置。 - 前記境界から前記外縁に向かって複数の前記連結フィールドプレート電極が配置され、前記電界緩和領域と前記連結フィールドプレート電極とが前記境界から前記外縁に向かって交互に電気的に連結されていることを特徴とする請求項1に記載の半導体装置。
- 前記外縁に最近接の前記電界緩和領域に接続する外周フィールドプレート電極を更に備え、
前記境界から前記外縁方向の長さが、前記連結フィールドプレート電極よりも前記外周フィールドプレート電極の方が長いことを特徴とする請求項1又は2に記載の半導体装置。 - 前記素子領域に最近接の前記電界緩和領域が、前記素子領域に形成される前記半導体素子の主電極と電気的に接続されていることを特徴とする請求項1乃至3のいずれか1項に記載の半導体装置。
- 一部の前記柱状領域は前記電界緩和領域に接続していないことを特徴とする請求項1乃至4のいずれか1項に記載の半導体装置。
- 前記電界緩和領域に接続する前記柱状領域と前記電界緩和領域に接続しない前記柱状領域とが、前記境界から前記外縁に向かって交互に配置されていることを特徴とする請求項5に記載の半導体装置。
- 前記柱状領域が、複数の団子状領域が深さ方向に連結された形状であることを特徴とする請求項1乃至6のいずれか1項に記載の半導体装置。
- 前記連結フィールドプレート電極に接続する前記電界緩和領域と、前記連結フィールドプレート電極に接続しない前記電界緩和領域とが、前記外周領域に混在していることを特徴とする請求項1乃至7のいずれか1項に記載の半導体装置。
- 前記連結フィールドプレート電極がポリシリコン材からなることを特徴とする請求項1乃至8のいずれか1項に記載の半導体装置。
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JP2013204822A JP6237064B2 (ja) | 2013-09-30 | 2013-09-30 | 半導体装置 |
US14/488,656 US9123549B2 (en) | 2013-09-30 | 2014-09-17 | Semiconductor device |
CN201410514099.7A CN104518007B (zh) | 2013-09-30 | 2014-09-29 | 半导体装置 |
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Cited By (2)
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WO2018163872A1 (ja) * | 2017-03-09 | 2018-09-13 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置および電子機器 |
JP2019102761A (ja) * | 2017-12-07 | 2019-06-24 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
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CN104952910A (zh) * | 2015-05-19 | 2015-09-30 | 上海先进半导体制造股份有限公司 | 超结半导体器件的终端结构及其制造方法 |
JP6758592B2 (ja) * | 2015-09-18 | 2020-09-23 | サンケン電気株式会社 | 半導体装置 |
US9825128B2 (en) * | 2015-10-20 | 2017-11-21 | Maxpower Semiconductor, Inc. | Vertical power transistor with thin bottom emitter layer and dopants implanted in trenches in shield area and termination rings |
JP7424782B2 (ja) * | 2019-09-27 | 2024-01-30 | ローム株式会社 | 半導体装置 |
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WO2018163872A1 (ja) * | 2017-03-09 | 2018-09-13 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置および電子機器 |
US10879348B2 (en) | 2017-03-09 | 2020-12-29 | Sony Semiconductor Solutions Corporation | Semiconductor device and electronic apparatus |
JP2019102761A (ja) * | 2017-12-07 | 2019-06-24 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
US11322607B2 (en) | 2017-12-07 | 2022-05-03 | Fuji Electric Co., Ltd. | Semiconductor device |
JP7073698B2 (ja) | 2017-12-07 | 2022-05-24 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
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CN104518007B (zh) | 2017-07-14 |
US20150091126A1 (en) | 2015-04-02 |
JP6237064B2 (ja) | 2017-11-29 |
CN104518007A (zh) | 2015-04-15 |
US9123549B2 (en) | 2015-09-01 |
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