JP2014529197A5 - - Google Patents

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Publication number
JP2014529197A5
JP2014529197A5 JP2014533400A JP2014533400A JP2014529197A5 JP 2014529197 A5 JP2014529197 A5 JP 2014529197A5 JP 2014533400 A JP2014533400 A JP 2014533400A JP 2014533400 A JP2014533400 A JP 2014533400A JP 2014529197 A5 JP2014529197 A5 JP 2014529197A5
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JP
Japan
Prior art keywords
electrostatic chuck
electrodes
grooves
ceramic plate
radial
Prior art date
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Application number
JP2014533400A
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English (en)
Japanese (ja)
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JP2014529197A (ja
JP6109832B2 (ja
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Publication date
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Priority claimed from US13/630,136 external-priority patent/US9608549B2/en
Publication of JP2014529197A publication Critical patent/JP2014529197A/ja
Publication of JP2014529197A5 publication Critical patent/JP2014529197A5/ja
Application granted granted Critical
Publication of JP6109832B2 publication Critical patent/JP6109832B2/ja
Active legal-status Critical Current
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JP2014533400A 2011-09-30 2012-09-28 静電チャック Active JP6109832B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161542068P 2011-09-30 2011-09-30
US61/542,068 2011-09-30
US13/630,136 US9608549B2 (en) 2011-09-30 2012-09-28 Electrostatic chuck
US13/630,136 2012-09-28
PCT/US2012/057945 WO2013049586A1 (en) 2011-09-30 2012-09-28 Electrostatic chuck

Publications (3)

Publication Number Publication Date
JP2014529197A JP2014529197A (ja) 2014-10-30
JP2014529197A5 true JP2014529197A5 (enExample) 2015-11-12
JP6109832B2 JP6109832B2 (ja) 2017-04-05

Family

ID=47996438

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014533400A Active JP6109832B2 (ja) 2011-09-30 2012-09-28 静電チャック

Country Status (5)

Country Link
US (1) US9608549B2 (enExample)
JP (1) JP6109832B2 (enExample)
KR (1) KR102110108B1 (enExample)
CN (1) CN103843128B (enExample)
WO (1) WO2013049586A1 (enExample)

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US10727092B2 (en) * 2012-10-17 2020-07-28 Applied Materials, Inc. Heated substrate support ring
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US10002782B2 (en) 2014-10-17 2018-06-19 Lam Research Corporation ESC assembly including an electrically conductive gasket for uniform RF power delivery therethrough
US10008404B2 (en) 2014-10-17 2018-06-26 Applied Materials, Inc. Electrostatic chuck assembly for high temperature processes
WO2016117427A1 (ja) * 2015-01-20 2016-07-28 日本碍子株式会社 ウエハ支持構造体
US10008399B2 (en) * 2015-05-19 2018-06-26 Applied Materials, Inc. Electrostatic puck assembly with metal bonded backing plate for high temperature processes
CN104900576A (zh) * 2015-05-27 2015-09-09 上海华力微电子有限公司 一种静电吸盘静电吸力分布的调节方法
JP6634315B2 (ja) * 2016-03-03 2020-01-22 日本特殊陶業株式会社 保持装置および保持装置の製造方法
US10249526B2 (en) 2016-03-04 2019-04-02 Applied Materials, Inc. Substrate support assembly for high temperature processes
US10770270B2 (en) 2016-06-07 2020-09-08 Applied Materials, Inc. High power electrostatic chuck with aperture-reducing plug in a gas hole
US11114327B2 (en) * 2017-08-29 2021-09-07 Applied Materials, Inc. ESC substrate support with chucking force control
TWI673797B (zh) * 2017-09-06 2019-10-01 台灣積體電路製造股份有限公司 製程零件、半導體製造設備及半導體製造方法
US10688750B2 (en) * 2017-10-03 2020-06-23 Applied Materials, Inc. Bonding structure of E chuck to aluminum base configuration
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US10847402B2 (en) 2018-04-02 2020-11-24 Applied Materials, Inc. Bond protection around porous plugs
US11456161B2 (en) 2018-06-04 2022-09-27 Applied Materials, Inc. Substrate support pedestal
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US11742781B2 (en) * 2018-11-19 2023-08-29 Entegris, Inc. Electrostatic chuck with charge dissipation coating
KR20240115347A (ko) 2019-05-24 2024-07-25 어플라이드 머티어리얼스, 인코포레이티드 접합 층 보호가 개선된 기판 지지 캐리어
KR102681787B1 (ko) * 2019-06-13 2024-07-05 주식회사 원익아이피에스 기판 지지대 및 기판 처리 장치
KR102640172B1 (ko) 2019-07-03 2024-02-23 삼성전자주식회사 기판 처리 장치 및 이의 구동 방법
US11373893B2 (en) * 2019-09-16 2022-06-28 Applied Materials, Inc. Cryogenic electrostatic chuck
KR20210089375A (ko) 2020-01-08 2021-07-16 주식회사 미코세라믹스 정전척
US11538708B2 (en) * 2020-05-06 2022-12-27 Sandisk Technologies Llc Multi-zone plasma-enhanced chemical vapor deposition apparatus and methods for operating the same
US11551961B2 (en) 2020-05-06 2023-01-10 Sandisk Technologies Llc Multi-zone plasma-enhanced chemical vapor deposition apparatus and methods for operating the same
JP7372271B2 (ja) * 2021-01-06 2023-10-31 日本碍子株式会社 半導体製造装置用部材及びその製法
JP7632969B2 (ja) * 2021-03-23 2025-02-19 日本特殊陶業株式会社 電極埋設部材、および基板保持部材
US12224192B2 (en) 2022-11-10 2025-02-11 Applied Materials, Inc. Bowed substrate clamping method, apparatus, and system
WO2025165540A1 (en) * 2024-01-31 2025-08-07 Lam Research Corporation Electrostatic chuck with polarity swapping and/or polarity balancing for wafer bow control and nonuniformity improvement

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JP5198226B2 (ja) * 2008-11-20 2013-05-15 東京エレクトロン株式会社 基板載置台および基板処理装置
CN101872713B (zh) * 2009-04-24 2012-03-28 中微半导体设备(上海)有限公司 静电夹盘装置、等离子处理装置和制造静电夹盘装置的方法

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