JP6109832B2 - 静電チャック - Google Patents

静電チャック Download PDF

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Publication number
JP6109832B2
JP6109832B2 JP2014533400A JP2014533400A JP6109832B2 JP 6109832 B2 JP6109832 B2 JP 6109832B2 JP 2014533400 A JP2014533400 A JP 2014533400A JP 2014533400 A JP2014533400 A JP 2014533400A JP 6109832 B2 JP6109832 B2 JP 6109832B2
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JP
Japan
Prior art keywords
electrostatic chuck
electrodes
grooves
ceramic plate
radial
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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JP2014533400A
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English (en)
Japanese (ja)
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JP2014529197A (ja
JP2014529197A5 (enExample
Inventor
ヴィジャイ ディー パルケ
ヴィジャイ ディー パルケ
スティーヴン ヴイ サンソーニ
スティーヴン ヴイ サンソーニ
チェン−シュン マシュー ツァイ
チェン−シュン マシュー ツァイ
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Applied Materials Inc
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Applied Materials Inc
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Publication of JP2014529197A publication Critical patent/JP2014529197A/ja
Publication of JP2014529197A5 publication Critical patent/JP2014529197A5/ja
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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
JP2014533400A 2011-09-30 2012-09-28 静電チャック Active JP6109832B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161542068P 2011-09-30 2011-09-30
US61/542,068 2011-09-30
US13/630,136 US9608549B2 (en) 2011-09-30 2012-09-28 Electrostatic chuck
US13/630,136 2012-09-28
PCT/US2012/057945 WO2013049586A1 (en) 2011-09-30 2012-09-28 Electrostatic chuck

Publications (3)

Publication Number Publication Date
JP2014529197A JP2014529197A (ja) 2014-10-30
JP2014529197A5 JP2014529197A5 (enExample) 2015-11-12
JP6109832B2 true JP6109832B2 (ja) 2017-04-05

Family

ID=47996438

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014533400A Active JP6109832B2 (ja) 2011-09-30 2012-09-28 静電チャック

Country Status (5)

Country Link
US (1) US9608549B2 (enExample)
JP (1) JP6109832B2 (enExample)
KR (1) KR102110108B1 (enExample)
CN (1) CN103843128B (enExample)
WO (1) WO2013049586A1 (enExample)

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US8832916B2 (en) * 2011-07-12 2014-09-16 Lam Research Corporation Methods of dechucking and system thereof
US9404176B2 (en) 2012-06-05 2016-08-02 Applied Materials, Inc. Substrate support with radio frequency (RF) return path
JP5975755B2 (ja) * 2012-06-28 2016-08-23 株式会社日立ハイテクノロジーズ プラズマ処理装置およびプラズマ処理方法
US10727092B2 (en) * 2012-10-17 2020-07-28 Applied Materials, Inc. Heated substrate support ring
US9101038B2 (en) 2013-12-20 2015-08-04 Lam Research Corporation Electrostatic chuck including declamping electrode and method of declamping
US10002782B2 (en) 2014-10-17 2018-06-19 Lam Research Corporation ESC assembly including an electrically conductive gasket for uniform RF power delivery therethrough
US10008404B2 (en) 2014-10-17 2018-06-26 Applied Materials, Inc. Electrostatic chuck assembly for high temperature processes
WO2016117427A1 (ja) * 2015-01-20 2016-07-28 日本碍子株式会社 ウエハ支持構造体
US10008399B2 (en) * 2015-05-19 2018-06-26 Applied Materials, Inc. Electrostatic puck assembly with metal bonded backing plate for high temperature processes
CN104900576A (zh) * 2015-05-27 2015-09-09 上海华力微电子有限公司 一种静电吸盘静电吸力分布的调节方法
JP6634315B2 (ja) * 2016-03-03 2020-01-22 日本特殊陶業株式会社 保持装置および保持装置の製造方法
US10249526B2 (en) 2016-03-04 2019-04-02 Applied Materials, Inc. Substrate support assembly for high temperature processes
US10770270B2 (en) 2016-06-07 2020-09-08 Applied Materials, Inc. High power electrostatic chuck with aperture-reducing plug in a gas hole
US11114327B2 (en) * 2017-08-29 2021-09-07 Applied Materials, Inc. ESC substrate support with chucking force control
TWI673797B (zh) * 2017-09-06 2019-10-01 台灣積體電路製造股份有限公司 製程零件、半導體製造設備及半導體製造方法
US10688750B2 (en) * 2017-10-03 2020-06-23 Applied Materials, Inc. Bonding structure of E chuck to aluminum base configuration
JP6504532B1 (ja) * 2018-03-14 2019-04-24 Toto株式会社 静電チャック
US10847402B2 (en) 2018-04-02 2020-11-24 Applied Materials, Inc. Bond protection around porous plugs
US11456161B2 (en) 2018-06-04 2022-09-27 Applied Materials, Inc. Substrate support pedestal
KR102460310B1 (ko) * 2018-08-20 2022-10-28 주식회사 원익아이피에스 기판 지지대 및 기판 처리 장치
US11742781B2 (en) * 2018-11-19 2023-08-29 Entegris, Inc. Electrostatic chuck with charge dissipation coating
KR20240115347A (ko) 2019-05-24 2024-07-25 어플라이드 머티어리얼스, 인코포레이티드 접합 층 보호가 개선된 기판 지지 캐리어
KR102681787B1 (ko) * 2019-06-13 2024-07-05 주식회사 원익아이피에스 기판 지지대 및 기판 처리 장치
KR102640172B1 (ko) 2019-07-03 2024-02-23 삼성전자주식회사 기판 처리 장치 및 이의 구동 방법
US11373893B2 (en) * 2019-09-16 2022-06-28 Applied Materials, Inc. Cryogenic electrostatic chuck
KR20210089375A (ko) 2020-01-08 2021-07-16 주식회사 미코세라믹스 정전척
US11538708B2 (en) * 2020-05-06 2022-12-27 Sandisk Technologies Llc Multi-zone plasma-enhanced chemical vapor deposition apparatus and methods for operating the same
US11551961B2 (en) 2020-05-06 2023-01-10 Sandisk Technologies Llc Multi-zone plasma-enhanced chemical vapor deposition apparatus and methods for operating the same
JP7372271B2 (ja) * 2021-01-06 2023-10-31 日本碍子株式会社 半導体製造装置用部材及びその製法
JP7632969B2 (ja) * 2021-03-23 2025-02-19 日本特殊陶業株式会社 電極埋設部材、および基板保持部材
US12224192B2 (en) 2022-11-10 2025-02-11 Applied Materials, Inc. Bowed substrate clamping method, apparatus, and system
WO2025165540A1 (en) * 2024-01-31 2025-08-07 Lam Research Corporation Electrostatic chuck with polarity swapping and/or polarity balancing for wafer bow control and nonuniformity improvement

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Publication number Priority date Publication date Assignee Title
JPH05275520A (ja) * 1992-03-26 1993-10-22 Fujitsu Ltd 静電吸着装置及びプラズマ処理装置
JPH06143075A (ja) * 1992-11-02 1994-05-24 Nippon Steel Corp 静電吸着装置
JPH06204325A (ja) * 1992-12-28 1994-07-22 Hitachi Ltd 静電吸着装置およびその吸着方法
US6141203A (en) * 1994-03-03 2000-10-31 Sherman; Arthur Electrostatic chuck
JP3082624B2 (ja) * 1994-12-28 2000-08-28 住友金属工業株式会社 静電チャックの使用方法
JPH09167794A (ja) 1995-12-15 1997-06-24 Sony Corp 静電チャックおよびプラズマ処理方法
US6108189A (en) * 1996-04-26 2000-08-22 Applied Materials, Inc. Electrostatic chuck having improved gas conduits
US6308654B1 (en) * 1996-10-18 2001-10-30 Applied Materials, Inc. Inductively coupled parallel-plate plasma reactor with a conical dome
US6034863A (en) * 1997-11-12 2000-03-07 Applied Materials, Inc. Apparatus for retaining a workpiece in a process chamber within a semiconductor wafer processing system
JP2001021281A (ja) * 1999-07-09 2001-01-26 Mitsubishi Electric Corp 均熱装置
JP2001102435A (ja) * 1999-07-28 2001-04-13 Tokyo Electron Ltd 載置台構造及び処理装置
KR20010111058A (ko) * 2000-06-09 2001-12-15 조셉 제이. 스위니 전체 영역 온도 제어 정전기 척 및 그 제조방법
US6853953B2 (en) * 2001-08-07 2005-02-08 Tokyo Electron Limited Method for characterizing the performance of an electrostatic chuck
JP2003142569A (ja) * 2001-10-31 2003-05-16 Applied Materials Inc 静電チャックおよびチャック方法
KR100511854B1 (ko) 2002-06-18 2005-09-02 아네르바 가부시키가이샤 정전 흡착 장치
AU2003248610A1 (en) * 2003-07-14 2005-01-28 Systems On Silicon Manufacturing Co. Pte. Ltd. Perforated plate for wafer chuck
JP2005136025A (ja) 2003-10-29 2005-05-26 Trecenti Technologies Inc 半導体製造装置、半導体装置の製造方法及びウエハステージ
JP2005136104A (ja) * 2003-10-29 2005-05-26 Ngk Spark Plug Co Ltd 静電チャック
US7697260B2 (en) 2004-03-31 2010-04-13 Applied Materials, Inc. Detachable electrostatic chuck
US7692916B2 (en) * 2005-03-31 2010-04-06 Tokyo Electron Limited Capacitive coupling plasma processing apparatus and method
JP4704087B2 (ja) * 2005-03-31 2011-06-15 東京エレクトロン株式会社 プラズマ処理装置およびプラズマ処理方法
JP2007067037A (ja) * 2005-08-30 2007-03-15 Hitachi High-Technologies Corp 真空処理装置
US8284538B2 (en) * 2006-08-10 2012-10-09 Tokyo Electron Limited Electrostatic chuck device
JP2008198739A (ja) * 2007-02-09 2008-08-28 Tokyo Electron Ltd 載置台構造、これを用いた処理装置及びこの装置の使用方法
JP2008228188A (ja) 2007-03-15 2008-09-25 Funai Electric Co Ltd 無線通信システム
KR20090024866A (ko) * 2007-09-05 2009-03-10 주식회사 코미코 기판 지지유닛 및 이를 갖는 기판 가공 장치
JP5198226B2 (ja) * 2008-11-20 2013-05-15 東京エレクトロン株式会社 基板載置台および基板処理装置
CN101872713B (zh) * 2009-04-24 2012-03-28 中微半导体设备(上海)有限公司 静电夹盘装置、等离子处理装置和制造静电夹盘装置的方法

Also Published As

Publication number Publication date
JP2014529197A (ja) 2014-10-30
CN103843128A (zh) 2014-06-04
US9608549B2 (en) 2017-03-28
KR20140069198A (ko) 2014-06-09
WO2013049586A1 (en) 2013-04-04
US20130088808A1 (en) 2013-04-11
CN103843128B (zh) 2017-11-21
KR102110108B1 (ko) 2020-05-13

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