CN103843128B - 静电夹具 - Google Patents

静电夹具 Download PDF

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Publication number
CN103843128B
CN103843128B CN201280047894.9A CN201280047894A CN103843128B CN 103843128 B CN103843128 B CN 103843128B CN 201280047894 A CN201280047894 A CN 201280047894A CN 103843128 B CN103843128 B CN 103843128B
Authority
CN
China
Prior art keywords
electrodes
grooves
ceramic plate
radially
electrostatic chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201280047894.9A
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English (en)
Chinese (zh)
Other versions
CN103843128A (zh
Inventor
维贾伊·D·帕克赫
史蒂芬·V·桑索尼
振雄·马修·蔡
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Applied Materials Inc
Original Assignee
Applied Materials Inc
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Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN103843128A publication Critical patent/CN103843128A/zh
Application granted granted Critical
Publication of CN103843128B publication Critical patent/CN103843128B/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
CN201280047894.9A 2011-09-30 2012-09-28 静电夹具 Active CN103843128B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161542068P 2011-09-30 2011-09-30
US61/542,068 2011-09-30
US13/630,136 US9608549B2 (en) 2011-09-30 2012-09-28 Electrostatic chuck
US13/630,136 2012-09-28
PCT/US2012/057945 WO2013049586A1 (en) 2011-09-30 2012-09-28 Electrostatic chuck

Publications (2)

Publication Number Publication Date
CN103843128A CN103843128A (zh) 2014-06-04
CN103843128B true CN103843128B (zh) 2017-11-21

Family

ID=47996438

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280047894.9A Active CN103843128B (zh) 2011-09-30 2012-09-28 静电夹具

Country Status (5)

Country Link
US (1) US9608549B2 (enExample)
JP (1) JP6109832B2 (enExample)
KR (1) KR102110108B1 (enExample)
CN (1) CN103843128B (enExample)
WO (1) WO2013049586A1 (enExample)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8832916B2 (en) * 2011-07-12 2014-09-16 Lam Research Corporation Methods of dechucking and system thereof
US9404176B2 (en) 2012-06-05 2016-08-02 Applied Materials, Inc. Substrate support with radio frequency (RF) return path
JP5975755B2 (ja) * 2012-06-28 2016-08-23 株式会社日立ハイテクノロジーズ プラズマ処理装置およびプラズマ処理方法
US10727092B2 (en) * 2012-10-17 2020-07-28 Applied Materials, Inc. Heated substrate support ring
US9101038B2 (en) 2013-12-20 2015-08-04 Lam Research Corporation Electrostatic chuck including declamping electrode and method of declamping
US10002782B2 (en) 2014-10-17 2018-06-19 Lam Research Corporation ESC assembly including an electrically conductive gasket for uniform RF power delivery therethrough
US10008404B2 (en) 2014-10-17 2018-06-26 Applied Materials, Inc. Electrostatic chuck assembly for high temperature processes
WO2016117427A1 (ja) * 2015-01-20 2016-07-28 日本碍子株式会社 ウエハ支持構造体
US10008399B2 (en) * 2015-05-19 2018-06-26 Applied Materials, Inc. Electrostatic puck assembly with metal bonded backing plate for high temperature processes
CN104900576A (zh) * 2015-05-27 2015-09-09 上海华力微电子有限公司 一种静电吸盘静电吸力分布的调节方法
JP6634315B2 (ja) * 2016-03-03 2020-01-22 日本特殊陶業株式会社 保持装置および保持装置の製造方法
US10249526B2 (en) 2016-03-04 2019-04-02 Applied Materials, Inc. Substrate support assembly for high temperature processes
US10770270B2 (en) 2016-06-07 2020-09-08 Applied Materials, Inc. High power electrostatic chuck with aperture-reducing plug in a gas hole
US11114327B2 (en) * 2017-08-29 2021-09-07 Applied Materials, Inc. ESC substrate support with chucking force control
TWI673797B (zh) * 2017-09-06 2019-10-01 台灣積體電路製造股份有限公司 製程零件、半導體製造設備及半導體製造方法
US10688750B2 (en) * 2017-10-03 2020-06-23 Applied Materials, Inc. Bonding structure of E chuck to aluminum base configuration
JP6504532B1 (ja) * 2018-03-14 2019-04-24 Toto株式会社 静電チャック
US10847402B2 (en) 2018-04-02 2020-11-24 Applied Materials, Inc. Bond protection around porous plugs
US11456161B2 (en) 2018-06-04 2022-09-27 Applied Materials, Inc. Substrate support pedestal
KR102460310B1 (ko) * 2018-08-20 2022-10-28 주식회사 원익아이피에스 기판 지지대 및 기판 처리 장치
US11742781B2 (en) * 2018-11-19 2023-08-29 Entegris, Inc. Electrostatic chuck with charge dissipation coating
KR20240115347A (ko) 2019-05-24 2024-07-25 어플라이드 머티어리얼스, 인코포레이티드 접합 층 보호가 개선된 기판 지지 캐리어
KR102681787B1 (ko) * 2019-06-13 2024-07-05 주식회사 원익아이피에스 기판 지지대 및 기판 처리 장치
KR102640172B1 (ko) 2019-07-03 2024-02-23 삼성전자주식회사 기판 처리 장치 및 이의 구동 방법
US11373893B2 (en) * 2019-09-16 2022-06-28 Applied Materials, Inc. Cryogenic electrostatic chuck
KR20210089375A (ko) 2020-01-08 2021-07-16 주식회사 미코세라믹스 정전척
US11538708B2 (en) * 2020-05-06 2022-12-27 Sandisk Technologies Llc Multi-zone plasma-enhanced chemical vapor deposition apparatus and methods for operating the same
US11551961B2 (en) 2020-05-06 2023-01-10 Sandisk Technologies Llc Multi-zone plasma-enhanced chemical vapor deposition apparatus and methods for operating the same
JP7372271B2 (ja) * 2021-01-06 2023-10-31 日本碍子株式会社 半導体製造装置用部材及びその製法
JP7632969B2 (ja) * 2021-03-23 2025-02-19 日本特殊陶業株式会社 電極埋設部材、および基板保持部材
US12224192B2 (en) 2022-11-10 2025-02-11 Applied Materials, Inc. Bowed substrate clamping method, apparatus, and system
WO2025165540A1 (en) * 2024-01-31 2025-08-07 Lam Research Corporation Electrostatic chuck with polarity swapping and/or polarity balancing for wafer bow control and nonuniformity improvement

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05275520A (ja) * 1992-03-26 1993-10-22 Fujitsu Ltd 静電吸着装置及びプラズマ処理装置
JPH06143075A (ja) * 1992-11-02 1994-05-24 Nippon Steel Corp 静電吸着装置
JPH06204325A (ja) * 1992-12-28 1994-07-22 Hitachi Ltd 静電吸着装置およびその吸着方法
US6141203A (en) * 1994-03-03 2000-10-31 Sherman; Arthur Electrostatic chuck
JP3082624B2 (ja) * 1994-12-28 2000-08-28 住友金属工業株式会社 静電チャックの使用方法
JPH09167794A (ja) 1995-12-15 1997-06-24 Sony Corp 静電チャックおよびプラズマ処理方法
US6108189A (en) * 1996-04-26 2000-08-22 Applied Materials, Inc. Electrostatic chuck having improved gas conduits
US6308654B1 (en) * 1996-10-18 2001-10-30 Applied Materials, Inc. Inductively coupled parallel-plate plasma reactor with a conical dome
US6034863A (en) * 1997-11-12 2000-03-07 Applied Materials, Inc. Apparatus for retaining a workpiece in a process chamber within a semiconductor wafer processing system
JP2001021281A (ja) * 1999-07-09 2001-01-26 Mitsubishi Electric Corp 均熱装置
JP2001102435A (ja) * 1999-07-28 2001-04-13 Tokyo Electron Ltd 載置台構造及び処理装置
KR20010111058A (ko) * 2000-06-09 2001-12-15 조셉 제이. 스위니 전체 영역 온도 제어 정전기 척 및 그 제조방법
US6853953B2 (en) * 2001-08-07 2005-02-08 Tokyo Electron Limited Method for characterizing the performance of an electrostatic chuck
JP2003142569A (ja) * 2001-10-31 2003-05-16 Applied Materials Inc 静電チャックおよびチャック方法
KR100511854B1 (ko) 2002-06-18 2005-09-02 아네르바 가부시키가이샤 정전 흡착 장치
AU2003248610A1 (en) * 2003-07-14 2005-01-28 Systems On Silicon Manufacturing Co. Pte. Ltd. Perforated plate for wafer chuck
JP2005136025A (ja) 2003-10-29 2005-05-26 Trecenti Technologies Inc 半導体製造装置、半導体装置の製造方法及びウエハステージ
JP2005136104A (ja) * 2003-10-29 2005-05-26 Ngk Spark Plug Co Ltd 静電チャック
US7697260B2 (en) 2004-03-31 2010-04-13 Applied Materials, Inc. Detachable electrostatic chuck
US7692916B2 (en) * 2005-03-31 2010-04-06 Tokyo Electron Limited Capacitive coupling plasma processing apparatus and method
JP4704087B2 (ja) * 2005-03-31 2011-06-15 東京エレクトロン株式会社 プラズマ処理装置およびプラズマ処理方法
JP2007067037A (ja) * 2005-08-30 2007-03-15 Hitachi High-Technologies Corp 真空処理装置
US8284538B2 (en) * 2006-08-10 2012-10-09 Tokyo Electron Limited Electrostatic chuck device
JP2008198739A (ja) * 2007-02-09 2008-08-28 Tokyo Electron Ltd 載置台構造、これを用いた処理装置及びこの装置の使用方法
JP2008228188A (ja) 2007-03-15 2008-09-25 Funai Electric Co Ltd 無線通信システム
KR20090024866A (ko) * 2007-09-05 2009-03-10 주식회사 코미코 기판 지지유닛 및 이를 갖는 기판 가공 장치
JP5198226B2 (ja) * 2008-11-20 2013-05-15 東京エレクトロン株式会社 基板載置台および基板処理装置
CN101872713B (zh) * 2009-04-24 2012-03-28 中微半导体设备(上海)有限公司 静电夹盘装置、等离子处理装置和制造静电夹盘装置的方法

Also Published As

Publication number Publication date
JP2014529197A (ja) 2014-10-30
JP6109832B2 (ja) 2017-04-05
CN103843128A (zh) 2014-06-04
US9608549B2 (en) 2017-03-28
KR20140069198A (ko) 2014-06-09
WO2013049586A1 (en) 2013-04-04
US20130088808A1 (en) 2013-04-11
KR102110108B1 (ko) 2020-05-13

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