JP2014524663A5 - - Google Patents
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- Publication number
- JP2014524663A5 JP2014524663A5 JP2014524232A JP2014524232A JP2014524663A5 JP 2014524663 A5 JP2014524663 A5 JP 2014524663A5 JP 2014524232 A JP2014524232 A JP 2014524232A JP 2014524232 A JP2014524232 A JP 2014524232A JP 2014524663 A5 JP2014524663 A5 JP 2014524663A5
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- optical component
- optical
- substrate
- active optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 claims description 78
- 239000000758 substrate Substances 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 22
- 125000006850 spacer group Chemical group 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 3
- 230000005693 optoelectronics Effects 0.000 claims 10
- 238000004519 manufacturing process Methods 0.000 claims 3
- 230000010076 replication Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 14
- 239000002861 polymer material Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161521818P | 2011-08-10 | 2011-08-10 | |
| US61/521,818 | 2011-08-10 | ||
| PCT/CH2012/000178 WO2013020238A1 (en) | 2011-08-10 | 2012-08-02 | Opto-electronic module and method for manufacturing the same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014524663A JP2014524663A (ja) | 2014-09-22 |
| JP2014524663A5 true JP2014524663A5 (https=) | 2015-09-03 |
| JP6247633B2 JP6247633B2 (ja) | 2017-12-13 |
Family
ID=46762761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014524232A Active JP6247633B2 (ja) | 2011-08-10 | 2012-08-02 | 光電子モジュールおよびその製造方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US9224772B2 (https=) |
| EP (1) | EP2742529B1 (https=) |
| JP (1) | JP6247633B2 (https=) |
| KR (1) | KR101890457B1 (https=) |
| CN (1) | CN103858230B (https=) |
| SG (2) | SG2014005805A (https=) |
| TW (2) | TWI552275B (https=) |
| WO (1) | WO2013020238A1 (https=) |
Families Citing this family (25)
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|---|---|---|---|---|
| US9525093B2 (en) * | 2009-06-30 | 2016-12-20 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Infrared attenuating or blocking layer in optical proximity sensor |
| DE102011113483B4 (de) * | 2011-09-13 | 2023-10-19 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zum Herstellen einer Mehrzahl von optoelektronischen Bauelementen und optoelektronisches Bauelement |
| US9232122B2 (en) * | 2012-09-19 | 2016-01-05 | Lg Innotek Co., Ltd. | Camera module having an array sensor |
| US20140160751A1 (en) * | 2012-12-11 | 2014-06-12 | Vixar Inc. | Low cost optical package |
| US9543354B2 (en) | 2013-07-30 | 2017-01-10 | Heptagon Micro Optics Pte. Ltd. | Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules |
| US10403671B2 (en) | 2013-12-10 | 2019-09-03 | Ams Sensors Singapore Pte. Ltd. | Wafer-level optical modules and methods for manufacturing the same |
| KR101785879B1 (ko) * | 2014-07-23 | 2017-10-16 | 헵타곤 마이크로 옵틱스 피티이. 리미티드 | 수직 정렬 피처들을 포함하는 광 방출기 및 광 검출기 모듈들 |
| US9711552B2 (en) * | 2014-08-19 | 2017-07-18 | Heptagon Micro Optics Pte. Ltd. | Optoelectronic modules having a silicon substrate, and fabrication methods for such modules |
| CN204760384U (zh) * | 2015-05-18 | 2015-11-11 | 华天科技(昆山)电子有限公司 | 高像素影像传感芯片的晶圆级封装结构 |
| KR101778848B1 (ko) * | 2015-08-21 | 2017-09-14 | 엘지전자 주식회사 | 발광소자 패키지 어셈블리 및 이의 제조 방법 |
| DE102015114563A1 (de) * | 2015-09-01 | 2017-03-02 | Osram Opto Semiconductors Gmbh | Mikrolinse für LED-Modul |
| US10304813B2 (en) * | 2015-11-05 | 2019-05-28 | Innolux Corporation | Display device having a plurality of bank structures |
| WO2017146645A1 (en) * | 2016-02-22 | 2017-08-31 | Heptagon Micro Optics Pte. Ltd. | Thin optoelectronic modules with apertures and their manufacture |
| KR102572819B1 (ko) * | 2016-02-23 | 2023-08-30 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광모듈 제조방법 및 표시장치 |
| SG11201602031TA (en) * | 2016-03-08 | 2017-10-30 | Tnc Optics & Tech Pte Ltd | A fabrication method of optical sensor cover having a lens |
| TWI777947B (zh) * | 2016-03-23 | 2022-09-21 | 新加坡商海特根微光學公司 | 光電模組總成及製造方法 |
| US20180017741A1 (en) * | 2016-07-15 | 2018-01-18 | Advanced Semiconductor Engineering, Inc. | Semiconductor package device and method of manufacturing the same |
| TWI618156B (zh) * | 2016-08-05 | 2018-03-11 | Siliconware Precision Industries Co., Ltd. | 電子封裝件及其製法 |
| US11510351B2 (en) | 2019-01-04 | 2022-11-22 | Engent, Inc. | Systems and methods for precision placement of components |
| US11272631B2 (en) | 2019-09-09 | 2022-03-08 | Apple Inc. | Conductive PVD stack-up design to improve reliability of deposited electrodes |
| CN112911824A (zh) * | 2019-12-04 | 2021-06-04 | 菲尼萨公司 | 用于光纤印刷电路板组件的表面安装技术 |
| DE102021100530A1 (de) | 2021-01-13 | 2022-07-14 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches halbleiterbauelement und verfahren zur herstellung eines optoelektronischen halbleiterbauelements |
| US12222240B2 (en) | 2021-06-02 | 2025-02-11 | Luminar Technologies, Inc. | Protective mask for an optical receiver |
| US11953722B2 (en) | 2021-06-02 | 2024-04-09 | Luminar Technologies, Inc. | Protective mask for an optical receiver |
| US12376401B2 (en) * | 2022-03-29 | 2025-07-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods of forming optical modules |
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| JP3042853B2 (ja) | 1989-02-16 | 2000-05-22 | テキサス インスツルメンツ インコーポレイテツド | 集積回路 |
| JPH0782142B2 (ja) * | 1989-06-29 | 1995-09-06 | スタンレー電気株式会社 | Ledイレーサの組立方法 |
| JPH0749487Y2 (ja) * | 1989-06-29 | 1995-11-13 | スタンレー電気株式会社 | Ledイレーサ |
| JP2902898B2 (ja) * | 1993-05-17 | 1999-06-07 | 京セラ株式会社 | 画像装置 |
| JP2958212B2 (ja) * | 1993-05-21 | 1999-10-06 | 京セラ株式会社 | 画像装置 |
| JPH08234071A (ja) * | 1995-02-27 | 1996-09-13 | Kyocera Corp | 画像装置 |
| US6096155A (en) | 1996-09-27 | 2000-08-01 | Digital Optics Corporation | Method of dicing wafer level integrated multiple optical elements |
| US5912872A (en) | 1996-09-27 | 1999-06-15 | Digital Optics Corporation | Integrated optical apparatus providing separated beams on a detector and associated methods |
| JP2000025270A (ja) * | 1998-03-31 | 2000-01-25 | Kyocera Corp | 光プリンタヘッド |
| KR100393057B1 (ko) * | 2000-10-20 | 2003-07-31 | 삼성전자주식회사 | 마이크로 렌즈 일체형 표면광 레이저 |
| US6917461B2 (en) * | 2000-12-29 | 2005-07-12 | Texas Instruments Incorporated | Laminated package |
| JP2004071366A (ja) * | 2002-08-07 | 2004-03-04 | Omron Corp | 光電センサ |
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| US20050009239A1 (en) * | 2003-07-07 | 2005-01-13 | Wolff Larry Lee | Optoelectronic packaging with embedded window |
| US7452140B2 (en) * | 2003-07-16 | 2008-11-18 | Ibiden Co., Ltd. | Protective sealing of optoelectronic modules |
| JP2005038956A (ja) * | 2003-07-17 | 2005-02-10 | Matsushita Electric Ind Co Ltd | 光部品とその製造方法 |
| CN1875617A (zh) * | 2003-10-27 | 2006-12-06 | 皇家飞利浦电子股份有限公司 | 相机模块以及该相机模块的制造方法 |
| EP1569276A1 (en) * | 2004-02-27 | 2005-08-31 | Heptagon OY | Micro-optics on optoelectronics |
| US7517728B2 (en) * | 2004-03-31 | 2009-04-14 | Cree, Inc. | Semiconductor light emitting devices including a luminescent conversion element |
| US7326583B2 (en) * | 2004-03-31 | 2008-02-05 | Cree, Inc. | Methods for packaging of a semiconductor light emitting device |
| US8097897B2 (en) * | 2005-06-21 | 2012-01-17 | Epistar Corporation | High-efficiency light-emitting device and manufacturing method thereof |
| US7245065B2 (en) * | 2005-03-31 | 2007-07-17 | Eastman Kodak Company | Reducing angular dependency in microcavity color OLEDs |
| JP4640248B2 (ja) * | 2005-07-25 | 2011-03-02 | 豊田合成株式会社 | 光源装置 |
| JP5209177B2 (ja) * | 2005-11-14 | 2013-06-12 | 新光電気工業株式会社 | 半導体装置および半導体装置の製造方法 |
| KR100648628B1 (ko) * | 2005-12-29 | 2006-11-24 | 서울반도체 주식회사 | 발광 다이오드 |
| JP4881001B2 (ja) * | 2005-12-29 | 2012-02-22 | シチズン電子株式会社 | 発光装置 |
| US7795600B2 (en) * | 2006-03-24 | 2010-09-14 | Goldeneye, Inc. | Wavelength conversion chip for use with light emitting diodes and method for making same |
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| US8013350B2 (en) * | 2007-02-05 | 2011-09-06 | Panasonic Corporation | Optical device and method for manufacturing optical device, and camera module and endoscope module equipped with optical device |
| US7692256B2 (en) | 2007-03-23 | 2010-04-06 | Heptagon Oy | Method of producing a wafer scale package |
| DE102007041133A1 (de) * | 2007-08-30 | 2009-03-05 | Osram Opto Semiconductors Gmbh | Gehäuse mit einem Gehäuseunterteil, sowie Verfahren zur Aussendung elektromagnetischer Strahlung |
| US7915627B2 (en) * | 2007-10-17 | 2011-03-29 | Intematix Corporation | Light emitting device with phosphor wavelength conversion |
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| JP4891214B2 (ja) * | 2007-12-13 | 2012-03-07 | シャープ株式会社 | 電子素子ウエハモジュール、電子素子モジュール、センサウエハモジュール、センサモジュール、レンズアレイ板、センサモジュールの製造方法および電子情報機器 |
| EP2223173B1 (en) * | 2007-12-19 | 2013-09-04 | Heptagon Micro Optics Pte. Ltd. | Camera device and manufacturing methods therefor |
| TWI478808B (zh) | 2007-12-19 | 2015-04-01 | Heptagon Micro Optics Pte Ltd | 製造光學元件的方法 |
| JP2009212171A (ja) * | 2008-03-01 | 2009-09-17 | Yoshiaki Sonoda | チップ型ledの実装方法 |
| KR101506264B1 (ko) * | 2008-06-13 | 2015-03-30 | 삼성전자주식회사 | 발광 소자, 발광 장치 및 상기 발광 소자의 제조 방법 |
| WO2010020062A1 (en) | 2008-08-20 | 2010-02-25 | Heptagon Oy | Method of manufacturing a pluralty of optical devices |
| KR20100030472A (ko) * | 2008-09-10 | 2010-03-18 | 삼성전자주식회사 | 발광 소자 및 발광 장치의 제조 방법, 상기 방법을 이용하여 제조한 발광 소자 및 발광 장치 |
| KR101497953B1 (ko) * | 2008-10-01 | 2015-03-05 | 삼성전자 주식회사 | 광추출 효율이 향상된 발광 소자, 이를 포함하는 발광 장치, 상기 발광 소자 및 발광 장치의 제조 방법 |
| WO2010056083A2 (ko) * | 2008-11-14 | 2010-05-20 | 삼성엘이디 주식회사 | 반도체 발광소자 |
| US8963190B2 (en) * | 2009-08-25 | 2015-02-24 | Toshiba Lighting & Technology Corporation | Light-emitting device and lighting apparatus |
| TW201109164A (en) | 2009-09-11 | 2011-03-16 | E Pin Optical Industry Co Ltd | Stacked disk-shaped optical lens array, stacked lens module and their method of manufacturing thereof |
| US20110293168A1 (en) * | 2010-05-25 | 2011-12-01 | Yoshihiko Matsushima | Method for mounting transparent component |
| WO2011156926A1 (en) * | 2010-06-14 | 2011-12-22 | Heptagon Oy | Method of manufacturing a plurality of optical devices |
| KR101182920B1 (ko) * | 2010-07-05 | 2012-09-13 | 엘지이노텍 주식회사 | 발광 소자 및 그 제조방법 |
| TW201208131A (en) * | 2010-08-05 | 2012-02-16 | Everlight Electronics Co Ltd | Light emitting diode package structure |
| US9391247B2 (en) * | 2010-12-16 | 2016-07-12 | Cree, Inc. | High power LEDs with non-polymer material lenses and methods of making the same |
| US8957430B2 (en) * | 2011-06-15 | 2015-02-17 | Cree, Inc. | Gel underfill layers for light emitting diodes |
| CN103975436B (zh) * | 2011-07-19 | 2019-05-10 | 新加坡恒立私人有限公司 | 制造无源光学器件和包含该无源光学器件的装置的方法 |
| SG193151A1 (en) * | 2011-07-19 | 2013-09-30 | Heptagon Micro Optics Pte Ltd | Opto-electronic modules and methods of manufacturing the same and appliances and devices comprising the same |
| US8791489B2 (en) * | 2012-04-05 | 2014-07-29 | Heptagon Micro Optics Pte. Ltd. | Opto-electronic module |
-
2012
- 2012-08-02 WO PCT/CH2012/000178 patent/WO2013020238A1/en not_active Ceased
- 2012-08-02 SG SG2014005805A patent/SG2014005805A/en unknown
- 2012-08-02 CN CN201280049588.9A patent/CN103858230B/zh active Active
- 2012-08-02 EP EP12753377.6A patent/EP2742529B1/en active Active
- 2012-08-02 KR KR1020147006294A patent/KR101890457B1/ko active Active
- 2012-08-02 SG SG10201606075XA patent/SG10201606075XA/en unknown
- 2012-08-02 JP JP2014524232A patent/JP6247633B2/ja active Active
- 2012-08-07 TW TW101128458A patent/TWI552275B/zh active
- 2012-08-07 TW TW105121575A patent/TWI601244B/zh active
- 2012-08-08 US US13/569,707 patent/US9224772B2/en active Active
-
2015
- 2015-11-19 US US14/945,505 patent/US9786820B2/en active Active
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