JP6328813B2 - リフロー可能な光電子モジュール - Google Patents
リフロー可能な光電子モジュール Download PDFInfo
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- JP6328813B2 JP6328813B2 JP2017033644A JP2017033644A JP6328813B2 JP 6328813 B2 JP6328813 B2 JP 6328813B2 JP 2017033644 A JP2017033644 A JP 2017033644A JP 2017033644 A JP2017033644 A JP 2017033644A JP 6328813 B2 JP6328813 B2 JP 6328813B2
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Description
本件出願は、2012年4月5日に出願された米国仮出願第61/620,587号の優先権の利益を主張するものである。その出願の内容は、引用によりここに援用される。
本開示は、光学式近接センサモジュールなどの光電子モジュールに関する。
近接センサは、対象物の位置または場所を検知するために使用される。光学センサ、誘導センサ、および容量センサなどを含む、様々なタイプの近接センサが利用可能である。
リフロー可能な材料からなる光電子モジュールが記載される。一部の施行例においては、これにより、少なくとも一部で高温での製造が行なわれる装置に対し、モジュールが装置に組み込まれる時、またはその後の製造工程において、モジュールを組み込むことができる。
または熱可塑性ポリマーを含み得る。熱可塑性ポリマーのガラス遷移温度は、260℃よりも高くあり得る。一部の施行例において、第1のエポキシ材料または第2のエポキシ材料の一方または両方は、熱硬化ポリマーまたは紫外(UV)硬化ポリマーを含む。
図1に示されるように、光電子モジュール1は、少なくとも1つのアクティブ光学部品と少なくとも1つのパッシブ光学部品とを含み得る。アクティブ光学部品の例としては、フォトダイオード、イメージセンサ、LED、OLED、またはレーザーチップなどの、光感知部品または発光部品が含まれる。パッシブ光学部品の例としては、レンズ、プリズム、ミラー、または光学系(たとえば、開口紋り、イメージスクリーン、または支持体などの機械要素を含み得るパッシブ光学部品の集合)などの、屈折および/または回折および/または反射によって光の方向を変える光学部品が含まれる。図2は、図1のモジュールの構成要素の様々な横概略断面図を示し、これらの横断面のおおよその位置は、図1においてs1からs5および破線によって示される。s4およびs5については、視線の方向が矢印によって示される。
な光を実質的に透過させないことにより、および放出部材Eと検知部材Dとの間に壁を形成することにより、放出部材Eと検知部材Dとの間の光の相互干渉を減少させるように、検知部材Dに到達すべきでない放出部材Eから放出される光から検知部材Dを保護し得る。この方法によって、モジュール1の内側で反射した光、および放出部材Eから生じる迷光が検知部材Dに到達しないように防止され得る。一部の施行例において、分離部材Sは、たとえば、エポキシ樹脂、アクリレート、ポリウレタン、およびシリコーン材料などの硬化することが可能な(たとえば、硬化可能な)ポリマー材料である、不透明なポリマー材料からなる。分離部材は、たとえば、カーボンブラックを含有するエポキシからなり得る。
Eと検知部材Dとを互いに分離する縦壁分割部分12を有し、内部における光の相互干渉の減少を補助し得る。
他のハウジング部品と実質的に同じ横形状および横寸法を有する。これにより、図3および図4を参照して以下により詳細に記載されるようなモジュール1を非常に効率的な方法で製造することが容易となる。ハウジング部品P,S,O,Bの各々は、概ねブロック形状もしくは板状の形状、またはより概略的には直方体形状を有し、(バッフル部材Bおよび分離部材Sが有するような)穴もしくは開口または(光学部材Oが有するような)突起を有し得る。
品が配置され得る、または設けられ得る。ウエハは、開口または穴を有し得る。一部の場合において、ウエハはその横領域の大部分に材料が無い状態となり得る。施行例に応じて、ウエハは、たとえば、半導体材料、ポリマー材料、金属とポリマーとを含む複合材料、またはポリマーとガラス材料とを含む複合材料からなり得る。特に、ウエハは、熱硬化ポリマーまたはUV硬化ポリマーなどの硬化することが可能な材料を含み得る。一部の施行例において、ウエハの直径は、5cmと40cmとの間であり、たとえば、10cmと31cmとの間であり得る。ウエハは、たとえば、2、4、6、8、または12インチの直径を有する円筒状であり得て、1インチは約2.54cmである。ウエハの厚さは、たとえば、0.2mmと10mmとの間であり得て、一部の場合においては、0.4mmと6mmとの間である。
は他の接着剤が加えられ、対象となる波長(すなわち、LEDまたは他の放出部材Eによって放出される光の波長)でのスペーサウエハの光伝達特性が減少する。スペーサウエハSWのための基材の例としては、Electronic Materials, Inc.から入手可能なEMCAST(たとえば、23xx、24xx、25xx、および2600シリーズ)、Master Bond Inc.から入手可能なMASTERBOND(商標)(たとえば、UV15-7DC、UVIODCTK)、DELO Industrial Adhesivesから
入手可能なDELO-DUALBOND(商標)(たとえば、AD VE 80342)、Addison Clear Waveから入手可能なAC A1449、Epoxy Technology, Inc.から入手可能なEPOTEK OG198-54、およびLOCTITE 334、392、5091のうちの1つ以上が含まれる。前述の材料の一部は、デュアルキ
ュア型である(すなわち、UV光および熱によって硬化させることができる)。対象となる波長においてスペーサーウエハSWの光伝達特性を減少させるために、カーボンブラックまたは他の色素が基材に加えられ得る。たとえば、カーボンブラックまたは他の色素は、放出部材Eによって放出される光の波長において壁部分12を通過する光の伝達(T)が0.1%以下となるように十分に大きな量で基礎ポリマー材料に加えられ得る。同様に、一部の適用例において、色素の量は十分に大きく、放出部材Eによって放出される光の波長において壁部分12の吸収率または光学的密度が少なくとも3となる。
、GB368および19923シリーズ)、EPOTEK(商標)エポキシ(たとえば、90-172-4、90-174-3、100-24-3、もしくはOG142-13シリーズのエポキシ)、Kyoritsu Chemical & Co., Ltd.から入手可能なKyoritsu XLM-C5もしくはXRC 9-2シリーズのエポキシ、Micro Resist Technology GmbHから入手可能なMRT Ormocomp(商標)US-S4エポキシ、Showa Denko K.K.から入手可能なShowa Denko(商標)SAS008L-Pエポキシ、ならびに/またはWellomer Adhesive Technologyから入手可能なWELLOMER(商標)エポキシDUV 764エポキシのうちの1つ
以上が含まれる。
ュールの製造に使用され得る。図4のウエハOWおよびSW(またはウエハOWおよびBW、またはウエハOWおよびSWおよびBW)を1つの部品として考えることにより、組み合わせ光学ウエハが図1に係るモジュールの製造のために提供される。
Claims (6)
- 複数の光学式近接センサモジュールを作製する方法であって、方法は、
複数の発光素子が搭載されるとともに複数の光検知器が搭載される第1の表面を有する基板ウエハを設けるステップを備え、各発光素子は対応する1つの光検知器に隣接して取り付けられ、前記発光素子および前記光検知器は配列して前記ウエハ上に搭載され、前記発光素子は第1の波長の光を放出するように動作可能であり、前記光検知器は前記第1の波長の光を検知するように動作可能であり、方法はさらに、
少なくとも260℃まで熱的に安定する第1のポリマー材料から構成されるスペーサウエハを設けるステップを備え、前記スペーサウエハは、前記基板ウエハ上の前記発光素子および前記光検知器の配列に実質的に対応した配列の開口を有し、方法はさらに、
約260℃まで熱的に安定する第2のポリマー材料から構成される光学ウエハを設けるステップを備え、前記光学ウエハは、(1)前記第1の波長の入射光を実質的に減衰または遮断する遮断部分と、(2)前記第1の波長の光を透過する複数の第1および第2の透明部分とを含み、前記第1および第2の透明部分は、前記基板ウエハ上の前記発光素子および前記光検知器の配列に実質的に対応する配列で配置され、方法はさらに、
前記基板ウエハと、前記スペーサウエハと、前記光学ウエハとを合わせてウエハスタックに接着するステップを備え、前記ウエハスタックにおいて、前記発光素子および前記光検知器が前記基板ウエハと前記光学ウエハとの間に取り付けられるように、前記スペーサウエハは、前記基板ウエハと前記光学ウエハとの間に配置され、方法はさらに、
前記ウエハスタックを複数のモジュールに分離するステップを備え、前記複数のモジュールの各々は、前記発光素子の1つおよび前記光検知器の1つを含む、方法。 - 前記接着するステップは、熱硬化エポキシを使用して前記基板ウエハを前記スペーサウエハに接着するステップを含む、請求項1に記載の方法。
- 前記基板ウエハを前記スペーサウエハに接着するステップは、前記熱硬化エポキシを少なくとも100℃の温度に加熱するステップを含む、請求項2に記載の方法。
- 前記接着するステップは、熱硬化エポキシを使用して前記スペーサウエハを前記光学ウエハに接着するステップを含む、請求項3に記載の方法。
- 前記スペーサウエハを前記光学ウエハに接着するステップは、前記熱硬化エポキシを少なくとも100℃の温度に加熱するステップを含む、請求項4に記載の方法。
- 前記第1および第2の透明部分の各々は、少なくとも260℃まで熱的に安定する第3のポリマー材料から構成されるレンズを含む、請求項1に記載の方法。
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