JP2014519533A - 改善されたバリア性を有するシリコーン樹脂 - Google Patents
改善されたバリア性を有するシリコーン樹脂 Download PDFInfo
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- JP2014519533A JP2014519533A JP2014509583A JP2014509583A JP2014519533A JP 2014519533 A JP2014519533 A JP 2014519533A JP 2014509583 A JP2014509583 A JP 2014509583A JP 2014509583 A JP2014509583 A JP 2014509583A JP 2014519533 A JP2014519533 A JP 2014519533A
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- organopolysiloxane
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- 230000004888 barrier function Effects 0.000 title abstract description 12
- 229920002050 silicone resin Polymers 0.000 title description 3
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 88
- 239000000203 mixture Substances 0.000 claims abstract description 57
- 125000001424 substituent group Chemical group 0.000 claims abstract description 38
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 29
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims abstract description 15
- -1 3,3-dimethyl-n-butyl group Chemical group 0.000 claims description 38
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 25
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 13
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 11
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 claims description 11
- 229920002554 vinyl polymer Polymers 0.000 claims description 11
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- 238000007259 addition reaction Methods 0.000 claims description 7
- 125000003342 alkenyl group Chemical group 0.000 claims description 7
- 238000004132 cross linking Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 239000007809 chemical reaction catalyst Substances 0.000 claims description 5
- 239000008393 encapsulating agent Substances 0.000 claims description 5
- 239000011230 binding agent Substances 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000003197 catalytic effect Effects 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000003566 sealing material Substances 0.000 claims description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 30
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 13
- 230000015572 biosynthetic process Effects 0.000 description 10
- 238000003786 synthesis reaction Methods 0.000 description 10
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 7
- 239000012153 distilled water Substances 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 125000003118 aryl group Chemical group 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 230000007935 neutral effect Effects 0.000 description 6
- 229920001843 polymethylhydrosiloxane Polymers 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 5
- 238000002390 rotary evaporation Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 125000000962 organic group Chemical group 0.000 description 4
- 239000012071 phase Substances 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229910004283 SiO 4 Inorganic materials 0.000 description 3
- 125000004430 oxygen atom Chemical group O* 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- SESWNJHMQHLVNW-UHFFFAOYSA-N 2-(3,3-dimethylbutyl)-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound CC(CC[SiH]1O[SiH2]O[SiH2]O[SiH2]O1)(C)C SESWNJHMQHLVNW-UHFFFAOYSA-N 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 2
- 125000005388 dimethylhydrogensiloxy group Chemical group 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 238000006459 hydrosilylation reaction Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- IQLZWWDXNXZGPK-UHFFFAOYSA-N methylsulfonyloxymethyl methanesulfonate Chemical compound CS(=O)(=O)OCOS(C)(=O)=O IQLZWWDXNXZGPK-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000004383 yellowing Methods 0.000 description 2
- DVQGJDYDHQULIU-UHFFFAOYSA-N 3,3-dimethylbutyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)CCC(C)(C)C DVQGJDYDHQULIU-UHFFFAOYSA-N 0.000 description 1
- PTIQIWBJAFOZEY-UHFFFAOYSA-N 3,3-dimethylbutyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCC(C)(C)C PTIQIWBJAFOZEY-UHFFFAOYSA-N 0.000 description 1
- QYXVDGZUXHFXTO-UHFFFAOYSA-L 3-oxobutanoate;platinum(2+) Chemical compound [Pt+2].CC(=O)CC([O-])=O.CC(=O)CC([O-])=O QYXVDGZUXHFXTO-UHFFFAOYSA-L 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 239000008346 aqueous phase Substances 0.000 description 1
- 125000000732 arylene group Chemical group 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 125000003636 chemical group Chemical group 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- QABCGOSYZHCPGN-UHFFFAOYSA-N chloro(dimethyl)silicon Chemical compound C[Si](C)Cl QABCGOSYZHCPGN-UHFFFAOYSA-N 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- WIWBLJMBLGWSIN-UHFFFAOYSA-L dichlorotris(triphenylphosphine)ruthenium(ii) Chemical compound [Cl-].[Cl-].[Ru+2].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 WIWBLJMBLGWSIN-UHFFFAOYSA-L 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000033444 hydroxylation Effects 0.000 description 1
- 238000005805 hydroxylation reaction Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- WORCCYVLMMTGFR-UHFFFAOYSA-M loxoprofen sodium Chemical compound [Na+].C1=CC(C(C([O-])=O)C)=CC=C1CC1C(=O)CCC1 WORCCYVLMMTGFR-UHFFFAOYSA-M 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229920001558 organosilicon polymer Polymers 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000002683 reaction inhibitor Substances 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 238000002211 ultraviolet spectrum Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
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- C—CHEMISTRY; METALLURGY
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H01L33/56—Materials, e.g. epoxy or silicone resin
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
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- C08K2201/008—Additives improving gas barrier properties
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- Life Sciences & Earth Sciences (AREA)
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Abstract
Description
で示される少なくとも1種のポリオルガノシロキサンを含んでなる発光素子(LED)封入組成物が開示されている。この組成物は、青色スペクトルから紫外スペクトルの光を発するLEDを封入するために使用することができる。
また、オルガノポリシロキサンが熱および/または紫外線の影響下で黄変または他の変色を示さないことを意味する、改善された硬化後の熱安定性および紫外線安定性も望まれる。
(A)平均組成式(2):
で示される基から選択される同じまたは異なった有機基であり、R4の少なくとも10mol%は、式(1)で示される同じまたは異なった基であり、一分子あたりのR4の少なくとも2つは、互いに独立してビニルまたはアリルであり、nは1≦n<2を満たす正数である]
で示される少なくとも1種のオルガノポリシロキサン、
(B)平均組成式(3):
で示される基から選択される同じまたは異なった基であり、mは1≦m<2を満たす正数であり、pは0.001<p<1を満たす正数であり、一分子あたり少なくとも2つのSi−H基が含まれている]
で示される少なくとも1種のオルガノハイドロジェンポリシロキサン、
(C)触媒量の付加反応触媒
を含んでなり、成分(B)におけるケイ素原子に直接結合している水素原子の、成分(A)におけるビニル基およびアリル基の和に対するモル比は0.5〜10である。
2,2−ジメチルブチレン(16.8g)、トリメトキシシラン(30.0g)およびトリス−(トリフェニルホスフィン)ルテニウム(II)ジクロライド(50mg)をTHF(80g)に溶解し、次いで、70℃で7時間撹拌した。続いて、低沸点成分を回転蒸発によって除去し、DMBTMSを減圧下で留去した。無色透明の液体(28g)を得た。1H NMR:CH3O-(s, 3.534-3.608ppm)、-CH2CH2Si(t, 1.268-1.345ppm)、CH3-(s, 0.931-0.982ppm)、-CH2CH2Si(t, 0.458-0.587ppm)。
DMBTMS(69.90g)、VTMS(16.78g)、MDMS(13.63g)、トルエン(224mL)および塩酸(84mL、1mol/L)を秤取し、丸底フラスコに導入した。110℃で5時間撹拌および還流した後、混合物を分液漏斗に移した。中性になるまでトルエン相を蒸留水で洗浄し、次いで、MgSO4を用いて乾燥させた。溶液をフラスコに移し、室温で撹拌した。続いて、HMDZ(78.01g)およびHAc(7.80g)を逐次添加した。溶液を50℃に加熱し、5時間撹拌した後、中性になるまで蒸留水で洗浄し、MgSO4を用いて乾燥させた。溶媒を回転蒸発によって除去した後、高粘性液体を得た。平均分子量は1700、ビニル含量は1.1mmol/gであった。
DMBTES(49.95g)、VTMS(7.48g)、トルエン(127mL)および塩酸(40mL、1mol/L)を秤取し、丸底フラスコに導入した。110℃で5時間撹拌および還流した後、混合物を分液漏斗に移した。中性になるまでトルエン相を蒸留水で洗浄し、次いで、MgSO4を用いて乾燥させた。溶液を約100mLまで濃縮し、続いて、HMDZ(5.25g)およびHAc(0.54g)を逐次添加した。溶液を50℃に加熱し、5時間撹拌した後、中性になるまで蒸留水で洗浄し、MgSO4を用いて乾燥させた。溶媒を回転蒸発によって除去した後、高粘性液体を得た。平均分子量は1680、ビニル含量は1.4mmol/gであった。
XS-60056-HSR(25.77g)、3,3−ジメチルブチレン(12.77g)、トルエン(25.77mL)およびPt/Al2O3(0.29g、0.5%Pt)を秤取し、ステンレス鋼製ジャケット内のテフロン(登録商標)製カラムに導入した。混合物を90℃で1.5時間撹拌した後、Pt/Al2O3粒子を除去するために濾過した。次いで、溶液を回転蒸発によって精製し、高粘性液体を得た。Si−H含量は3.3mmol/gであった。
DMBTES(12.48g)、ジメチルクロロシラン(5.33g)およびトルエン(20mL)を秤取し、丸底フラスコに導入した。室温で蒸留水(10.8g)を添加した。次いで、混合物を100℃に加熱し、2時間撹拌した。分液漏斗に移した後、水相を除去し、中性になるまでトルエン相を蒸留水で洗浄し、続いて、MgSO4を用いて乾燥させた。溶媒を除去した後、無色の液体を得た。Si−H含量は4.4mmol/gであった。
合成例2の生成物3.70g、合成例4の生成物1.63g、およびPt触媒一滴を一緒に混合し、次いで、150℃で2時間加熱した。
合成例3の生成物2.40g、合成例5の生成物0.98g、およびPt触媒一滴を一緒に混合し、次いで、120℃で1時間および150℃で1時間加熱した。
Dow corning高屈折率材料OE6631、AおよびB成分を、A:B=1:2の比で混合し、70℃で1時間、120℃で1時間、150℃で1時間加熱した。
3.01gのXS-60056-HSR、1.02gのD4 vi、および一滴のPt触媒を一緒に混合し、次いで、150℃で2時間加熱した。
1)R9Si(OCH3)3(0.1mol)およびジメチルジメトキシシラン(0.1mol)をトルエン(70mL)に溶解し、塩酸(0.1mol/L、35mL)を添加し、次いで、110℃で5時間撹拌および還流した。
2)相分離後、中性になるまでトルエン相を蒸留水で洗浄し、MgSO4を用いて乾燥させ、続いて、回転蒸発によってトルエンを除去した。
3)無色の液体を得、炉に投入し、150℃で72時間保持した。
4)固体を得た。
Claims (14)
- 全置換基の少なくとも15mol%が式(1)で示される、請求項1に記載のオルガノポリシロキサン。
- 全置換基の少なくとも20mol%が式(1)で示される、請求項1または2に記載のオルガノポリシロキサン。
- qが0〜2の整数である、請求項1〜3のいずれかに記載のオルガノポリシロキサン。
- R1、R2およびR3がメチル基である、請求項1〜4のいずれかに記載のオルガノポリシロキサン。
- qが0〜2の整数であり、R1、R2およびR3がメチル基である、請求項1〜5のいずれかに記載のオルガノポリシロキサン。
- 式(1)が3,3−ジメチル−n−ブチル基を表す、請求項1〜6のいずれかに記載のオルガノポリシロキサン。
- アルケニル基および水素原子から選択される置換基を、一分子あたり少なくとも2つ有する、請求項1〜7のいずれかに記載のオルガノポリシロキサン。
- 一分子あたり少なくとも2つのビニル基を有する、請求項1〜8のいずれかに記載のオルガノポリシロキサン。
- オルガノポリシロキサンが一分子あたり少なくとも2つのビニル基を有し、オルガノポリシロキサンの全置換基の少なくとも10mol%が3,3−ジメチル−n−ブチル基である、請求項1〜9のいずれかに記載のオルガノポリシロキサン。
- 請求項1〜10のいずれかに記載の少なくとも1種のオルガノポリシロキサンを含んでなる硬化性組成物。
- (A)平均組成式(2):
で示される基から選択される同じまたは異なった有機基であり、R4の少なくとも10mol%は、式(1)で示される同じまたは異なった基であり、一分子あたりのR4の少なくとも2つは、互いに独立してビニルまたはアリルであり、nは1≦n<2を満たす正数である]
で示される少なくとも1種のオルガノポリシロキサン、
(B)平均組成式(3):
で示される基から選択される同じまたは異なった基であり、mは1≦m<2を満たす正数であり、pは0.001<p<1を満たす正数であり、一分子あたり少なくとも2つのSi−H基が含まれている]
で示される少なくとも1種のオルガノハイドロジェンポリシロキサン、
(C)触媒量の付加反応触媒
を含んでなる、請求項11に記載の硬化性組成物であって、成分(B)におけるケイ素原子に直接結合している水素原子の、成分(A)におけるビニル基およびアリル基の和に対するモル比が0.5〜10である硬化性組成物。 - 封入材、シーリング材、保護材、結合材および/またはレンズ形成材における、請求項1〜10のいずれかに記載のオルガノポリシロキサンの使用。
- 半導体デバイスにおける封入材、保護材、結合材および/またはレンズ形成材としての、請求項11または12に記載の硬化性組成物の使用。
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JP2004359756A (ja) | 2003-06-03 | 2004-12-24 | Wacker Asahikasei Silicone Co Ltd | Led用封止剤組成物 |
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