TWI547454B
(zh)
*
|
2011-05-31 |
2016-09-01 |
康寧公司 |
於玻璃中高速製造微孔洞的方法
|
US9938186B2
(en)
|
2012-04-13 |
2018-04-10 |
Corning Incorporated |
Strengthened glass articles having etched features and methods of forming the same
|
WO2014079478A1
(en)
|
2012-11-20 |
2014-05-30 |
Light In Light Srl |
High speed laser processing of transparent materials
|
JP2016508069A
(ja)
*
|
2012-11-29 |
2016-03-17 |
コーニング インコーポレイテッド |
基板をレーザー穿孔するための犠牲カバー層およびその方法
|
EP2925690B1
(en)
*
|
2012-11-29 |
2021-08-11 |
Corning Incorporated |
Methods of fabricating glass articles by laser damage and etching
|
EP2754524B1
(de)
|
2013-01-15 |
2015-11-25 |
Corning Laser Technologies GmbH |
Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
|
EP2781296B1
(de)
|
2013-03-21 |
2020-10-21 |
Corning Laser Technologies GmbH |
Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
|
DE112013007305A5
(de)
|
2013-08-07 |
2016-06-02 |
Trumpf Laser- Und Systemtechnik Gmbh |
Verfahren zum Bearbeiten eines plattenartigen Werkstückes mit einer transparenten, gläsernen, glasartigen keramischen und/oder kristallinen Lage, Trennvorrichtung für ein derartiges Werkstück sowie Produkt aus einem derartigen Werkstück
|
US9296646B2
(en)
|
2013-08-29 |
2016-03-29 |
Corning Incorporated |
Methods for forming vias in glass substrates
|
US10005152B2
(en)
*
|
2013-11-19 |
2018-06-26 |
Rofin-Sinar Technologies Llc |
Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses
|
US9815730B2
(en)
|
2013-12-17 |
2017-11-14 |
Corning Incorporated |
Processing 3D shaped transparent brittle substrate
|
US9676167B2
(en)
|
2013-12-17 |
2017-06-13 |
Corning Incorporated |
Laser processing of sapphire substrate and related applications
|
US9850160B2
(en)
|
2013-12-17 |
2017-12-26 |
Corning Incorporated |
Laser cutting of display glass compositions
|
US9701563B2
(en)
|
2013-12-17 |
2017-07-11 |
Corning Incorporated |
Laser cut composite glass article and method of cutting
|
US10293436B2
(en)
|
2013-12-17 |
2019-05-21 |
Corning Incorporated |
Method for rapid laser drilling of holes in glass and products made therefrom
|
US10442719B2
(en)
|
2013-12-17 |
2019-10-15 |
Corning Incorporated |
Edge chamfering methods
|
US20150165560A1
(en)
|
2013-12-17 |
2015-06-18 |
Corning Incorporated |
Laser processing of slots and holes
|
US11556039B2
(en)
|
2013-12-17 |
2023-01-17 |
Corning Incorporated |
Electrochromic coated glass articles and methods for laser processing the same
|
US10288792B2
(en)
*
|
2014-01-29 |
2019-05-14 |
Corning Incorporated |
Laser featured glass for display illumination
|
JP6262039B2
(ja)
|
2014-03-17 |
2018-01-17 |
株式会社ディスコ |
板状物の加工方法
|
TWI556898B
(zh)
*
|
2014-04-29 |
2016-11-11 |
Nat Inst Chung Shan Science & Technology |
A method and system for preparing vertical micro-guide hole on fly black laser on opaque ceramic sheet
|
CN106470953B
(zh)
*
|
2014-04-30 |
2019-03-12 |
康宁股份有限公司 |
用于制造穿通玻璃通孔的接合材料的回蚀工艺
|
JP6301203B2
(ja)
*
|
2014-06-02 |
2018-03-28 |
株式会社ディスコ |
チップの製造方法
|
KR102445217B1
(ko)
|
2014-07-08 |
2022-09-20 |
코닝 인코포레이티드 |
재료를 레이저 가공하는 방법 및 장치
|
WO2016010943A2
(en)
|
2014-07-14 |
2016-01-21 |
Corning Incorporated |
Method and system for arresting crack propagation
|
US10526234B2
(en)
|
2014-07-14 |
2020-01-07 |
Corning Incorporated |
Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
|
CN208586209U
(zh)
|
2014-07-14 |
2019-03-08 |
康宁股份有限公司 |
一种用于在工件中形成限定轮廓的多个缺陷的系统
|
TWI659793B
(zh)
|
2014-07-14 |
2019-05-21 |
美商康寧公司 |
用於使用可調整雷射束焦線來處理透明材料的系統及方法
|
US11610783B2
(en)
|
2014-07-30 |
2023-03-21 |
Corning Incorporated |
Ultrasonic tank and methods for uniform glass substrate etching
|
JP2016070900A
(ja)
*
|
2014-10-02 |
2016-05-09 |
セイコーエプソン株式会社 |
磁気計測装置の製造方法、ガスセルの製造方法、磁気計測装置、およびガスセル
|
JP2016080613A
(ja)
*
|
2014-10-21 |
2016-05-16 |
セイコーエプソン株式会社 |
磁気計測装置、ガスセル、磁気計測装置の製造方法、およびガスセルの製造方法
|
US10932371B2
(en)
|
2014-11-05 |
2021-02-23 |
Corning Incorporated |
Bottom-up electrolytic via plating method
|
US10047001B2
(en)
|
2014-12-04 |
2018-08-14 |
Corning Incorporated |
Glass cutting systems and methods using non-diffracting laser beams
|
JP6104354B2
(ja)
|
2014-12-16 |
2017-03-29 |
旭硝子株式会社 |
貫通孔形成方法、貫通孔形成装置、および貫通孔を有するガラス基板の製造方法
|
CN107406293A
(zh)
|
2015-01-12 |
2017-11-28 |
康宁股份有限公司 |
使用多光子吸收方法来对经热回火的基板进行激光切割
|
EP3274306B1
(en)
|
2015-03-24 |
2021-04-14 |
Corning Incorporated |
Laser cutting and processing of display glass compositions
|
EP3274313A1
(en)
|
2015-03-27 |
2018-01-31 |
Corning Incorporated |
Gas permeable window and method of fabricating the same
|
WO2016176171A1
(en)
|
2015-04-28 |
2016-11-03 |
Corning Incorporated |
Method of laser drilling through holes in substrates using an exit sacrificial cover layer; corresponding workpiece
|
EP3297967A1
(en)
*
|
2015-05-18 |
2018-03-28 |
Corning Incorporated |
Glass articles comprising light extraction features and methods for making the same
|
US20160347643A1
(en)
*
|
2015-05-29 |
2016-12-01 |
Asahi Glass Company, Limited |
Glass substrate manufacturing method
|
TW201704177A
(zh)
*
|
2015-06-10 |
2017-02-01 |
康寧公司 |
蝕刻玻璃基板的方法及玻璃基板
|
EP3319911B1
(en)
*
|
2015-07-10 |
2023-04-19 |
Corning Incorporated |
Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
|
RU2598011C1
(ru)
*
|
2015-07-16 |
2016-09-20 |
федеральное государственное автономное образовательное учреждение высшего образования "Санкт-Петербургский национальный исследовательский университет информационных технологий, механики и оптики" (Университет ИТМО) |
Способ изготовления полой трехмерной структуры в объеме пластины фоточувствительного стекла
|
JPWO2017038075A1
(ja)
*
|
2015-08-31 |
2018-06-14 |
日本板硝子株式会社 |
微細構造付きガラスの製造方法
|
US20170103249A1
(en)
|
2015-10-09 |
2017-04-13 |
Corning Incorporated |
Glass-based substrate with vias and process of forming the same
|
JP2017088467A
(ja)
*
|
2015-11-16 |
2017-05-25 |
旭硝子株式会社 |
ガラス基板に孔を形成する装置および方法
|
JP6885161B2
(ja)
*
|
2016-04-06 |
2021-06-09 |
Agc株式会社 |
貫通孔を有するガラス基板の製造方法およびガラス基板に貫通孔を形成する方法
|
US10292275B2
(en)
*
|
2016-04-06 |
2019-05-14 |
AGC Inc. |
Method of manufacturing glass substrate that has through hole, method of forming through hole in glass substrate and system for manufacturing glass substrate that has through hole
|
JP6938543B2
(ja)
|
2016-05-06 |
2021-09-22 |
コーニング インコーポレイテッド |
透明基板からの、輪郭設定された形状のレーザ切断及び取り外し
|
US10410883B2
(en)
|
2016-06-01 |
2019-09-10 |
Corning Incorporated |
Articles and methods of forming vias in substrates
|
JP6911288B2
(ja)
*
|
2016-06-23 |
2021-07-28 |
凸版印刷株式会社 |
ガラスの加工方法
|
US10134657B2
(en)
|
2016-06-29 |
2018-11-20 |
Corning Incorporated |
Inorganic wafer having through-holes attached to semiconductor wafer
|
US10794679B2
(en)
|
2016-06-29 |
2020-10-06 |
Corning Incorporated |
Method and system for measuring geometric parameters of through holes
|
JP7090594B2
(ja)
|
2016-07-29 |
2022-06-24 |
コーニング インコーポレイテッド |
レーザ加工するための装置および方法
|
JP2018024571A
(ja)
*
|
2016-08-05 |
2018-02-15 |
旭硝子株式会社 |
孔を有するガラス基板の製造方法
|
EP3507057A1
(en)
|
2016-08-30 |
2019-07-10 |
Corning Incorporated |
Laser processing of transparent materials
|
TW201815710A
(zh)
|
2016-08-31 |
2018-05-01 |
美商康寧公司 |
具有經填充之孔洞的經強化玻璃系物件及製造其之方法
|
JP6341245B2
(ja)
|
2016-09-05 |
2018-06-13 |
大日本印刷株式会社 |
貫通電極基板の製造方法、貫通電極基板および半導体装置
|
US10366904B2
(en)
|
2016-09-08 |
2019-07-30 |
Corning Incorporated |
Articles having holes with morphology attributes and methods for fabricating the same
|
TW201822282A
(zh)
|
2016-09-09 |
2018-06-16 |
美商康寧公司 |
具有通孔的低表面粗糙度基板及其製作方法
|
CN109803786B
(zh)
|
2016-09-30 |
2021-05-07 |
康宁股份有限公司 |
使用非轴对称束斑对透明工件进行激光加工的设备和方法
|
WO2018074560A1
(ja)
*
|
2016-10-20 |
2018-04-26 |
旭硝子株式会社 |
孔を有するガラス基板の製造方法、インターポーザの製造方法、およびガラス基板に孔を形成する方法
|
EP3529214B1
(en)
|
2016-10-24 |
2020-12-23 |
Corning Incorporated |
Substrate processing station for laser-based machining of sheet-like glass substrates
|
US10752534B2
(en)
|
2016-11-01 |
2020-08-25 |
Corning Incorporated |
Apparatuses and methods for laser processing laminate workpiece stacks
|
KR20190078595A
(ko)
|
2016-11-04 |
2019-07-04 |
코닝 인코포레이티드 |
마이크로-퍼포레이팅된 패널(micro-perforated panel) 시스템, 적용(application), 및 마이크로-퍼포레이팅된 패널 시스템의 제조 방법
|
US10688599B2
(en)
|
2017-02-09 |
2020-06-23 |
Corning Incorporated |
Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
|
KR102356415B1
(ko)
*
|
2017-03-06 |
2022-02-08 |
엘피케이에프 레이저 앤드 일렉트로닉스 악티엔게젤샤프트 |
전자기 방사선과 후속 에칭공정을 이용해 재료 안으로 적어도 하나의 리세스를 도입하기 위한 방법
|
CN106848832A
(zh)
*
|
2017-04-24 |
2017-06-13 |
西南石油大学 |
一种小型化单巴条端面泵浦脉冲激光器
|
WO2018200920A1
(en)
|
2017-04-28 |
2018-11-01 |
Corning Incorporated |
Glass electrochemical sensor with wafer level stacking and through glass via (tgv) interconnects
|
US10580725B2
(en)
|
2017-05-25 |
2020-03-03 |
Corning Incorporated |
Articles having vias with geometry attributes and methods for fabricating the same
|
US11078112B2
(en)
*
|
2017-05-25 |
2021-08-03 |
Corning Incorporated |
Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
|
US10626040B2
(en)
|
2017-06-15 |
2020-04-21 |
Corning Incorporated |
Articles capable of individual singulation
|
US20190024237A1
(en)
|
2017-07-20 |
2019-01-24 |
Corning Incorporated |
Methods for metalizing vias within a substrate
|
CN111065485B
(zh)
*
|
2017-08-25 |
2022-06-21 |
康宁股份有限公司 |
使用无焦光束调整组件激光加工透明工件的设备和方法
|
US11654657B2
(en)
|
2017-10-27 |
2023-05-23 |
Corning Incorporated |
Through glass via fabrication using a protective material
|
WO2019135985A1
(en)
|
2018-01-03 |
2019-07-11 |
Corning Incorporated |
Methods for making electrodes and providing electrical connections in sensors
|
US10917966B2
(en)
|
2018-01-29 |
2021-02-09 |
Corning Incorporated |
Articles including metallized vias
|
TWI675126B
(zh)
*
|
2018-02-14 |
2019-10-21 |
國立臺灣大學 |
針對矽晶圓之經製絨的表面上孔洞之擴孔方法
|
US11554984B2
(en)
|
2018-02-22 |
2023-01-17 |
Corning Incorporated |
Alkali-free borosilicate glasses with low post-HF etch roughness
|
JP7316999B2
(ja)
*
|
2018-04-05 |
2023-07-28 |
ヌヴォトンテクノロジージャパン株式会社 |
試料分割方法、半導体素子の製造方法及び半導体素子
|
US11152294B2
(en)
|
2018-04-09 |
2021-10-19 |
Corning Incorporated |
Hermetic metallized via with improved reliability
|
WO2020112710A1
(en)
|
2018-11-27 |
2020-06-04 |
Corning Incorporated |
3d interposer with through glass vias - method of increasing adhesion between copper and glass surfaces and articles therefrom
|
WO2020163051A1
(en)
*
|
2019-02-08 |
2020-08-13 |
Corning Incorporated |
Methods for laser processing transparent workpieces using pulsed laser beam focal lines and vapor etching
|
CN113474311B
(zh)
|
2019-02-21 |
2023-12-29 |
康宁股份有限公司 |
具有铜金属化贯穿孔的玻璃或玻璃陶瓷制品及其制造过程
|
TW202103830A
(zh)
*
|
2019-03-25 |
2021-02-01 |
美商康寧公司 |
在玻璃中形成穿孔之方法
|
US11952310B2
(en)
|
2019-05-10 |
2024-04-09 |
Corning Incorporated |
Silicate glass compositions useful for the efficient production of through glass vias
|
EP3966941A4
(en)
|
2019-05-10 |
2022-12-21 |
Corning Incorporated |
CLEAR PACKAGING FOR A WINDOWED TRANSMITTER-RECEIVER UNIT
|
JP7205413B2
(ja)
*
|
2019-08-07 |
2023-01-17 |
株式会社Sumco |
レーザマーク付きシリコンウェーハの製造方法
|
US20220402075A1
(en)
|
2019-10-03 |
2022-12-22 |
Orvinum Ag |
Apparatus for creating a hole in a glass container
|
WO2021108079A1
(en)
|
2019-11-27 |
2021-06-03 |
Corning Incorporated |
Fabricating laminate glass with blind vias
|
CN112894146A
(zh)
*
|
2019-12-04 |
2021-06-04 |
大族激光科技产业集团股份有限公司 |
玻璃基板通孔的激光加工方法和装置
|
WO2022055671A1
(en)
*
|
2020-09-09 |
2022-03-17 |
Corning Incorporated |
Glass substrates with blind vias having depth uniformity and methods for forming the same
|
CN116547803A
(zh)
|
2020-11-16 |
2023-08-04 |
康宁股份有限公司 |
具有玻璃通孔的3d中介层-增加铜和玻璃表面之间粘附性的方法及其制品
|
CN113292236A
(zh)
*
|
2021-05-21 |
2021-08-24 |
江西沃格光电股份有限公司 |
一种Mini-LED基板通孔的形成方法及电子设备
|
KR102605271B1
(ko)
*
|
2021-07-13 |
2023-11-27 |
주식회사 중우나라 |
유리기판의 관통홀 형성방법
|
WO2024118449A1
(en)
*
|
2022-11-30 |
2024-06-06 |
Corning Incorporated |
Systems and methods for laser micromachining substrates using a liquid-assist medium and articles fabricated by the same
|