JP5905899B2 - ガラスに孔の高密度アレイを形成する方法 - Google Patents
ガラスに孔の高密度アレイを形成する方法 Download PDFInfo
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- JP5905899B2 JP5905899B2 JP2013542117A JP2013542117A JP5905899B2 JP 5905899 B2 JP5905899 B2 JP 5905899B2 JP 2013542117 A JP2013542117 A JP 2013542117A JP 2013542117 A JP2013542117 A JP 2013542117A JP 5905899 B2 JP5905899 B2 JP 5905899B2
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- 239000011521 glass Substances 0.000 title claims description 81
- 238000000034 method Methods 0.000 title claims description 54
- 238000005530 etching Methods 0.000 claims description 31
- 230000001678 irradiating effect Effects 0.000 claims description 11
- 239000011148 porous material Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 229910052779 Neodymium Inorganic materials 0.000 claims description 2
- FFEYZVDJHQUAKG-UHFFFAOYSA-N [W].[Gd].[K] Chemical compound [W].[Gd].[K] FFEYZVDJHQUAKG-UHFFFAOYSA-N 0.000 claims description 2
- 238000004364 calculation method Methods 0.000 claims description 2
- 238000002474 experimental method Methods 0.000 claims description 2
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 claims description 2
- 239000002253 acid Substances 0.000 description 22
- 239000000243 solution Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000000608 laser ablation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000013019 agitation Methods 0.000 description 1
- 239000005347 annealed glass Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000017105 transposition Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
- C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/386—Removing material by boring or cutting by boring of blind holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
- C03C15/02—Surface treatment of glass, not in the form of fibres or filaments, by etching for making a smooth surface
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/1225—Basic optical elements, e.g. light-guiding paths comprising photonic band-gap structures or photonic lattices
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/136—Integrated optical circuits characterised by the manufacturing method by etching
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Surface Treatment Of Glass (AREA)
- Laser Beam Processing (AREA)
- Lasers (AREA)
Description
繰返し数:15kHz,
平均パワー:1.5W,及び
持続時間:90mm秒,
である。さらに高い繰返し数では、繰返し数が100kHzの対照プロセスの画像である図9に示されるように、損傷領域は明確に定められた境界をもたない。そのような損傷領域では、準円筒形よりもむしろ円錐形の孔プロファイルが生じる。約1.5Wより低いパワーでは十分な損傷が生じず、1.5Wをこえるパワーはかなりの前面損傷を生じさせることができ、そのような前面損傷は漏斗形の孔プロファイルも生じさせる。90ミリ秒トレイン/バーストの15kHzパルスが露光に選ばれ、バースト持続時間は0.63mm厚EagleXGガラスにおけるガラスの一方の側から他方の側に延びる損傷領域に対して最適化される。バースト持続時間が長くなるほど強い背面損傷が生じ、バースト持続時間が短くなるほど損傷領域長が短くなる。
22 レーザ
24 レーザビーム
26 レンズ
40 エッチング工程
42 酸エッチング装置
44 エッチング装置外槽
46 音響エネルギー伝達液体
48 酸槽
50 酸または混酸
52 エネルギー変換器
60 研磨工程
100 ガラス品
102 ガラス品前面
104 ガラス品背面
120 孔
Claims (10)
- ガラスに孔の高密度アレイを作製する方法において、前記方法が、
前面を有するガラス品を提供する工程、及び
前記ガラス品の前記前面をUVレーザビームで照射する工程、
を含み、
前記ビームがレンズによって前記ガラス品の前記前面の±100μm内に集束され、
前記ガラス品の前記前面から前記ガラス品に延び込む開孔を形成するため、前記レンズが0.1〜0.4の範囲の開口数を有し、
前記孔が5〜15μmの範囲の直径及び少なくとも20:1のアスペクト比を有する、
ことを特徴とする方法。 - 前記照射する工程が近UVレーザビームを使用する工程を含むことを特徴とする請求項1に記載の方法。
- 前記照射する工程に用いられる前記近UVレーザが335μmの波長で動作させたNd:KGW(ネオジムドープカリウム−ガドリニウムタングステン)レーザであることを特徴とする請求項2に記載の方法。
- 前記照射する工程に用いられる前記レンズの前記開口数が0.1〜0.15の範囲内にあることを特徴とする請求項1から3のいずれかに記載の方法。
- 前記レンズの前記開口数が0.12〜0.13の範囲内にあることを特徴とする請求項4に記載の方法。
- 前記照射する工程の間、前記レーザを10〜20kHzの範囲の繰返し数で動作させることを特徴とする請求項5に記載の方法。
- 前記照射する工程が前記ガラス品の前記表面をUVレーザビームにより、孔当たり60〜120ミリ秒の範囲の持続時間をかけて、照射する工程を含むことを特徴とする請求項1から6のいずれかに記載の方法。
- 前記照射する工程が前記ガラス品の前記表面をUVレーザビームにより、形成される孔を前記ガラス品のちょうど背面まで延びさせるであろう持続時間であるように実験または計算によって決定された持続時間をかけて、照射する工程を含むことを特徴とする請求項1から6のいずれかに記載の方法。
- 前記方法が前記ガラス品をHF+HNO3溶液内でエッチングする工程をさらに含むことを特徴とする請求項1から8のいずれかに記載の方法。
- 前記照射する工程の後で前記エッチングする工程の前に前記ガラス品の前記前面を研磨する工程をさらに含むことを特徴とする請求項1から9のいずれかに記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US41815210P | 2010-11-30 | 2010-11-30 | |
US61/418,152 | 2010-11-30 | ||
PCT/US2011/062520 WO2012075072A2 (en) | 2010-11-30 | 2011-11-30 | Methods of forming high-density arrays of holes in glass |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014501686A JP2014501686A (ja) | 2014-01-23 |
JP2014501686A5 JP2014501686A5 (ja) | 2015-09-24 |
JP5905899B2 true JP5905899B2 (ja) | 2016-04-20 |
Family
ID=45390179
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013542117A Active JP5905899B2 (ja) | 2010-11-30 | 2011-11-30 | ガラスに孔の高密度アレイを形成する方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US9278886B2 (ja) |
EP (1) | EP2646384B1 (ja) |
JP (1) | JP5905899B2 (ja) |
KR (1) | KR101917401B1 (ja) |
CN (2) | CN103237771B (ja) |
TW (1) | TWI599429B (ja) |
WO (1) | WO2012075072A2 (ja) |
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EP2925482A1 (en) * | 2012-11-29 | 2015-10-07 | Corning Incorporated | Sacrificial cover layers for laser drilling substrates and methods thereof |
EP2925690B1 (en) * | 2012-11-29 | 2021-08-11 | Corning Incorporated | Methods of fabricating glass articles by laser damage and etching |
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EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
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US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
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TWI556898B (zh) * | 2014-04-29 | 2016-11-11 | Nat Inst Chung Shan Science & Technology | A method and system for preparing vertical micro-guide hole on fly black laser on opaque ceramic sheet |
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JP6301203B2 (ja) * | 2014-06-02 | 2018-03-28 | 株式会社ディスコ | チップの製造方法 |
TWI730945B (zh) | 2014-07-08 | 2021-06-21 | 美商康寧公司 | 用於雷射處理材料的方法與設備 |
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CN103237771B (zh) | 2016-10-19 |
WO2012075072A2 (en) | 2012-06-07 |
CN106425129A (zh) | 2017-02-22 |
US9802855B2 (en) | 2017-10-31 |
WO2012075072A3 (en) | 2012-10-18 |
KR101917401B1 (ko) | 2018-11-09 |
TWI599429B (zh) | 2017-09-21 |
EP2646384B1 (en) | 2019-03-27 |
EP2646384A2 (en) | 2013-10-09 |
US20130247615A1 (en) | 2013-09-26 |
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US20160102009A1 (en) | 2016-04-14 |
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