DE112013007305A5 - Verfahren zum Bearbeiten eines plattenartigen Werkstückes mit einer transparenten, gläsernen, glasartigen keramischen und/oder kristallinen Lage, Trennvorrichtung für ein derartiges Werkstück sowie Produkt aus einem derartigen Werkstück - Google Patents
Verfahren zum Bearbeiten eines plattenartigen Werkstückes mit einer transparenten, gläsernen, glasartigen keramischen und/oder kristallinen Lage, Trennvorrichtung für ein derartiges Werkstück sowie Produkt aus einem derartigen Werkstück Download PDFInfo
- Publication number
- DE112013007305A5 DE112013007305A5 DE112013007305.6T DE112013007305T DE112013007305A5 DE 112013007305 A5 DE112013007305 A5 DE 112013007305A5 DE 112013007305 T DE112013007305 T DE 112013007305T DE 112013007305 A5 DE112013007305 A5 DE 112013007305A5
- Authority
- DE
- Germany
- Prior art keywords
- workpiece
- vitreous
- glassy
- ceramic
- transparent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/20—Manufacture of screens on or from which an image or pattern is formed, picked up, converted or stored; Applying coatings to the vessel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2013/002366 WO2015018425A1 (de) | 2013-08-07 | 2013-08-07 | Verfahren zum bearbeiten eines plattenartigen werkstückes mit einer transparenten, gläsernen, glasartigen, keramischen und/oder kristallinen lage, trennvorrichtung für ein derartiges werkstück sowie produkt aus einem derartigen werkstück |
Publications (1)
Publication Number | Publication Date |
---|---|
DE112013007305A5 true DE112013007305A5 (de) | 2016-06-02 |
Family
ID=49034031
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE112013007305.6T Pending DE112013007305A5 (de) | 2013-08-07 | 2013-08-07 | Verfahren zum Bearbeiten eines plattenartigen Werkstückes mit einer transparenten, gläsernen, glasartigen keramischen und/oder kristallinen Lage, Trennvorrichtung für ein derartiges Werkstück sowie Produkt aus einem derartigen Werkstück |
Country Status (5)
Country | Link |
---|---|
US (1) | US10941069B2 (de) |
JP (1) | JP2016534008A (de) |
CN (1) | CN105592994B (de) |
DE (1) | DE112013007305A5 (de) |
WO (1) | WO2015018425A1 (de) |
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FR3024137B1 (fr) * | 2014-07-24 | 2016-07-29 | Saint Gobain | Procede de fabrication de feuilles de verre de forme complexe |
KR102251985B1 (ko) | 2014-11-19 | 2021-05-17 | 트룸프 레이저-운트 시스템테크닉 게엠베하 | 비대칭 광학 빔 정형을 위한 시스템 |
DE102014116957A1 (de) | 2014-11-19 | 2016-05-19 | Trumpf Laser- Und Systemtechnik Gmbh | Optisches System zur Strahlformung |
DE102014116958B9 (de) | 2014-11-19 | 2017-10-05 | Trumpf Laser- Und Systemtechnik Gmbh | Optisches System zur Strahlformung eines Laserstrahls, Laserbearbeitungsanlage, Verfahren zur Materialbearbeitung und Verwenden einer gemeinsamen langgezogenen Fokuszone zur Lasermaterialbearbeitung |
DE102017106372B4 (de) * | 2017-03-24 | 2021-04-29 | Lpkf Laser & Electronics Ag | Verfahren zur Bearbeitung eines Werkstückes |
KR102260931B1 (ko) * | 2017-05-15 | 2021-06-04 | 엘피케이에프 레이저 앤드 일렉트로닉스 악티엔게젤샤프트 | 레이저 유도 디프 반응성 에칭을 이용해 기판을 가공하기 위한, 특히 분리하기 위한 방법 |
JP6501093B1 (ja) * | 2017-12-08 | 2019-04-17 | 株式会社Nsc | 透明性薄膜付ガラスパネル製造方法および透明性薄膜付液晶パネル製造方法 |
JP6519045B2 (ja) * | 2017-05-24 | 2019-05-29 | 株式会社Nsc | ガラスパネル製造方法および液晶パネル製造方法 |
CN110770640A (zh) * | 2017-05-24 | 2020-02-07 | 株式会社Nsc | 带透明薄膜的玻璃面板的制造方法、带透明薄膜的液晶面板的制造方法、玻璃面板制造方法以及液晶面板制造方法 |
JP7009194B2 (ja) * | 2017-12-12 | 2022-01-25 | 株式会社ディスコ | ウエーハ生成装置および搬送トレー |
JP7058870B2 (ja) * | 2018-05-21 | 2022-04-25 | 株式会社Nsc | 液晶パネル製造方法 |
JP7287637B2 (ja) * | 2018-10-04 | 2023-06-06 | 株式会社Nsc | 液晶パネル製造方法 |
JP7164396B2 (ja) * | 2018-10-29 | 2022-11-01 | 株式会社ディスコ | ウエーハ生成装置 |
WO2020190489A1 (en) * | 2019-03-21 | 2020-09-24 | Corning Incorporated | Systems for and methods of forming micro-holes in glass-based objects using an annular vortex laser beam |
LT6791B (lt) | 2019-05-15 | 2020-12-28 | Uab "Altechna R&D" | Skaidrių medžiagų apdirbimo būdas ir įrenginys |
DE102019121827A1 (de) * | 2019-08-13 | 2021-02-18 | Trumpf Laser- Und Systemtechnik Gmbh | Laserätzen mit variierender Ätzselektivität |
DE102021116398A1 (de) | 2021-06-24 | 2022-12-29 | Schott Ag | Element aus sprödbrüchigem Material mit strukturierter Kante, Zwischenprodukt und Verfahren zur Herstellung des Elements |
WO2023099946A1 (en) | 2021-12-02 | 2023-06-08 | Uab Altechna R&D | Pulsed laser beam shaping device for laser processing of a material transparent for the laser beam |
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CN2228458Y (zh) * | 1995-09-20 | 1996-06-05 | 陈新 | 方便信封 |
US6602430B1 (en) * | 2000-08-18 | 2003-08-05 | Micron Technology, Inc. | Methods for finishing microelectronic device packages |
JP2002253027A (ja) | 2001-02-27 | 2002-09-10 | Honda Motor Co Ltd | 刈払機の駆動軸構造 |
US6754429B2 (en) | 2001-07-06 | 2004-06-22 | Corning Incorporated | Method of making optical fiber devices and devices thereof |
JP4729883B2 (ja) * | 2003-10-31 | 2011-07-20 | セイコーエプソン株式会社 | 基板の加工方法、マイクロレンズシートの製造方法、透過型スクリーン、プロジェクタ、表示装置並びに基板の加工装置 |
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WO2007096958A1 (ja) * | 2006-02-22 | 2007-08-30 | Nippon Sheet Glass Company, Limited | レーザを用いたガラスの加工方法および加工装置 |
US8496866B2 (en) | 2007-04-25 | 2013-07-30 | Ceramtec Gmbh | Chip resistor substrate |
KR101512213B1 (ko) * | 2007-12-18 | 2015-04-14 | 호야 가부시키가이샤 | 휴대 단말기용 커버 글래스 및 그 제조 방법, 및 휴대 단말 장치 |
JP2009206291A (ja) * | 2008-02-28 | 2009-09-10 | Panasonic Corp | 半導体基板、半導体装置、およびその製造方法 |
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US8341976B2 (en) | 2009-02-19 | 2013-01-01 | Corning Incorporated | Method of separating strengthened glass |
CN201418206Y (zh) * | 2009-04-14 | 2010-03-03 | 常州海弘电子有限公司 | 具有邮票孔的pcb拼版 |
US9701581B2 (en) * | 2009-06-04 | 2017-07-11 | Corelase Oy | Method and apparatus for processing substrates using a laser |
CN201491381U (zh) * | 2009-07-22 | 2010-05-26 | 广州兴森快捷电路科技有限公司 | 一种v形槽结构的高密度积层印制板 |
EP2480507A1 (de) | 2009-08-28 | 2012-08-01 | Corning Incorporated | Laserschneidverfahren für artikel aus chemisch verstärkten glassubstraten |
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US8616024B2 (en) * | 2010-11-30 | 2013-12-31 | Corning Incorporated | Methods for forming grooves and separating strengthened glass substrate sheets |
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TWI415809B (zh) * | 2011-08-12 | 2013-11-21 | Wintek Corp | 強化玻璃單元及其製作方法以及具有強化玻璃單元的覆蓋板 |
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CN202617514U (zh) * | 2012-04-17 | 2012-12-19 | 深圳市奔创电子有限公司 | 一种设有邮票孔的精密pcb线路板 |
CN202938252U (zh) * | 2012-11-19 | 2013-05-15 | 厦门利德宝电子科技有限公司 | 不规则led基板smt拼版出货结构 |
CN103220877A (zh) * | 2013-04-01 | 2013-07-24 | 浙江开化建科电子科技有限公司 | 一种整版印制线路板 |
WO2020110303A1 (ja) | 2018-11-30 | 2020-06-04 | 本田技研工業株式会社 | 作業機用パッドの支持構造 |
-
2013
- 2013-08-07 DE DE112013007305.6T patent/DE112013007305A5/de active Pending
- 2013-08-07 WO PCT/EP2013/002366 patent/WO2015018425A1/de active Application Filing
- 2013-08-07 JP JP2016532240A patent/JP2016534008A/ja active Pending
- 2013-08-07 CN CN201380080076.3A patent/CN105592994B/zh active Active
-
2016
- 2016-02-05 US US15/016,888 patent/US10941069B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20160152508A1 (en) | 2016-06-02 |
JP2016534008A (ja) | 2016-11-04 |
US10941069B2 (en) | 2021-03-09 |
CN105592994A (zh) | 2016-05-18 |
CN105592994B (zh) | 2018-10-12 |
WO2015018425A1 (de) | 2015-02-12 |
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R012 | Request for examination validly filed | ||
R016 | Response to examination communication | ||
R082 | Change of representative |
Representative=s name: KUEMMEL, FELIX, DIPL.-PHYS. DR. RER. NAT., DE |
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R082 | Change of representative |
Representative=s name: KUEMMEL, FELIX, DIPL.-PHYS. DR. RER. NAT., DE |