JP2014228447A - 濃縮機能を有する水素ガスセンサとこれに用いる水素ガスセンサプローブ - Google Patents
濃縮機能を有する水素ガスセンサとこれに用いる水素ガスセンサプローブ Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/0004—Gaseous mixtures, e.g. polluted air
- G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
- G01N33/0027—General constructional details of gas analysers, e.g. portable test equipment concerning the detector
- G01N33/0036—General constructional details of gas analysers, e.g. portable test equipment concerning the detector specially adapted to detect a particular component
- G01N33/005—H2
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/0004—Gaseous mixtures, e.g. polluted air
- G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
- G01N33/0011—Sample conditioning
- G01N33/0019—Sample conditioning by preconcentration
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
- G01N25/48—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity on solution, sorption, or a chemical reaction not involving combustion or catalytic oxidation
- G01N25/4873—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity on solution, sorption, or a chemical reaction not involving combustion or catalytic oxidation for a flowing, e.g. gas sample
- G01N25/4893—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity on solution, sorption, or a chemical reaction not involving combustion or catalytic oxidation for a flowing, e.g. gas sample by using a differential method
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/14—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of an electrically-heated body in dependence upon change of temperature
- G01N27/16—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of an electrically-heated body in dependence upon change of temperature caused by burning or catalytic oxidation of surrounding material to be tested, e.g. of gas
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/403—Cells and electrode assemblies
- G01N27/414—Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS
- G01N27/4141—Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS specially adapted for gases
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Abstract
【解決手段】基板1から熱分離した薄膜10にヒータ25と温度センサ20および水素吸収材5とを有する水素ガスの濃縮部300と水素ガスセンサ素子500とを、同一のマイクロチャンバ100内に設ける。濃縮部300からヒータ加熱により放出させて高濃度化させた水素ガスを水素ガスセンサ素子500で計測する。水素吸収材5に水素ガスの選択性を持たせることにより、水素ガスセンサ素子500に水素ガス選択性を必要としない。マイクロチャンバ100の出入り口には気流制限部250を設けて、外部気体の流入による水素ガスの希薄化を防止している。被検出気体のマイクロチャンバ100への導入は、ポンプなどの導入手段150を用い、所定の周期で行うことができる。
【選択図】図1
Description
2、3 カバー
5 水素吸収材
6 水素感応層
10、11 薄膜
12 SOI層
13 BOX層
20、21 温度センサ
23 絶対温度センサ
25、26 ヒータ
40 空洞
41 スリット
42 溝
51 電気絶縁膜
60 オーム性電極
70、70’、71、71’ 電極パッド
75 共通電極パッド
100 チャンバ
110 配線
120a, 120b 熱電対導体
150 導入手段
160 チューブ
170 保持部材
200 連通孔
250 気流制限部
260 スペーサ
300 濃縮部
500 水素ガスセンサ素子
510 水素ガス検出部
600 水素ガスセンサプローブ
700 ケーブル
Claims (8)
- 被検出水素ガスを含む外部気体(被検出気体)とチャンバ(100)とを結ぶ連通孔(200)には気流制限部(250)を備えてあること、前記チャンバ(100)内には水素ガスの濃縮部(300)と水素ガスセンサ素子(500)とを備えてあること、該濃縮部(300)には水素吸収材(5)とヒータ(25)および温度センサ(20)を有すること、被検出気体を前記チャンバ(100)内に導入するための導入手段(150)を備えてあること、該導入手段(150)により前記チャンバ(100)内に被検出気体を導入して、前記濃縮部(300)に水素を吸収させて、その後、前記濃縮部(300)に吸収された水素を前記ヒータ(25)で加熱して前記チャンバ(100)内に放出させ、前記気流制限部(250)を利用して該チャンバ(100)内の水素ガス濃度を濃縮できるようにしたこと、前記水素ガスセンサ素子(500)でチャンバ(100)内の濃縮された水素ガス濃度に係る情報を出力させ、予め用意してある校正データに基づいて、被検出気体中の水素ガス濃度を求めるようにしたこと、を特徴とする水素ガスセンサ。
- 被検出気体の前記導入手段(150)による前記チャンバ(100)内への導入、被検出気体中の水素ガスの前記濃縮部(300)への吸収、前記ヒータ(25)による前記濃縮部(300)からの吸収水素ガスの前記チャンバ(100)内への放出と、この放出に伴い前記気流制限部(250)を利用した該チャンバ(100)の水素ガスの濃縮、前記水素ガスセンサ素子(500)で濃縮された水素ガス濃度に係る情報の出力、を所定のサイクルで行えるようにした請求項1記載の水素ガスセンサ。
- 水素吸収材(5)として、パラジウム(Pd)とした請求項1から2のいずれかに記載の水素ガスセンサ。
- 基板(1)から熱分離した薄膜(10)に、前記濃縮部(300)を形成した請求項1から3のいずれかに記載の水素ガスセンサ。
- 温度センサ(20)として、温度差センサとした請求項1から4のいずれかに記載の水素ガスセンサ。
- 水素ガスセンサ素子(500)として、接触燃焼型水素ガスセンサ、水素吸収(吸着も含む)発熱作用を利用する水素ガスセンサ、半導体式水素ガスセンサ、FET型水素ガスセンサのいずれかとした請求項1から5のいずれかに記載の水素ガスセンサ。
- 水素ガスセンサ素子(500)を半導体の基板に形成した請求項6に記載の水素ガスセンサ。
- 請求項1から7のいずれかに記載の水素ガスセンサに用いる水素ガスセンサプローブ(600)であって、少なくとも濃縮部(300)と水素ガスセンサ素子(500)の水素ガス検出部(510)とをチャンバ(100)の内部に備え、該チャンバ(100)に気流制限部(250)を有する前記連通孔(200)をも備えて構成したことを特徴とする水素ガスセンサプローブ。
Priority Applications (4)
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JP2013109375A JP6256933B2 (ja) | 2013-05-23 | 2013-05-23 | 濃縮機能を有する水素ガスセンサとこれに用いる水素ガスセンサプローブ |
CN201480029219.2A CN105229451B (zh) | 2013-05-23 | 2014-05-22 | 具有浓缩功能的氢气传感器以及其中使用的氢气传感器探头 |
US14/892,737 US20160103082A1 (en) | 2013-05-23 | 2014-05-22 | Hydrogen gas sensor with concentration function and hydrogen gas sensor probe used in same |
PCT/JP2014/063617 WO2014189119A1 (ja) | 2013-05-23 | 2014-05-22 | 濃縮機能を有する水素ガスセンサとこれに用いる水素ガスセンサプローブ |
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JP2013109375A JP6256933B2 (ja) | 2013-05-23 | 2013-05-23 | 濃縮機能を有する水素ガスセンサとこれに用いる水素ガスセンサプローブ |
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JP2014228447A true JP2014228447A (ja) | 2014-12-08 |
JP6256933B2 JP6256933B2 (ja) | 2018-01-10 |
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US (1) | US20160103082A1 (ja) |
JP (1) | JP6256933B2 (ja) |
CN (1) | CN105229451B (ja) |
WO (1) | WO2014189119A1 (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
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US9459224B1 (en) * | 2015-06-30 | 2016-10-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Gas sensor, integrated circuit device using the same, and manufacturing method thereof |
JP2017020883A (ja) * | 2015-07-10 | 2017-01-26 | 富士電機株式会社 | ガスセンサ |
JP2017150819A (ja) * | 2016-02-22 | 2017-08-31 | Tdk株式会社 | ガスセンサ |
JP2018009814A (ja) * | 2016-07-11 | 2018-01-18 | 富士通株式会社 | ガスセンサアレイ、ガス測定装置、及びガス測定方法 |
CN108369204A (zh) * | 2015-12-14 | 2018-08-03 | Ams传感器英国有限公司 | 感测层构造 |
JP2019056607A (ja) * | 2017-09-20 | 2019-04-11 | 株式会社東芝 | ガスセンサおよびその製造方法 |
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JP2021060330A (ja) * | 2019-10-09 | 2021-04-15 | 株式会社東芝 | センサ及びセンサの校正方法 |
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Also Published As
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US20160103082A1 (en) | 2016-04-14 |
CN105229451A (zh) | 2016-01-06 |
WO2014189119A1 (ja) | 2014-11-27 |
CN105229451B (zh) | 2018-09-14 |
JP6256933B2 (ja) | 2018-01-10 |
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