JP2014218651A - 熱硬化性組成物 - Google Patents

熱硬化性組成物 Download PDF

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Publication number
JP2014218651A
JP2014218651A JP2014077614A JP2014077614A JP2014218651A JP 2014218651 A JP2014218651 A JP 2014218651A JP 2014077614 A JP2014077614 A JP 2014077614A JP 2014077614 A JP2014077614 A JP 2014077614A JP 2014218651 A JP2014218651 A JP 2014218651A
Authority
JP
Japan
Prior art keywords
phenyl
thermosetting composition
epoxypropoxy
compound
tetracarboxylic dianhydride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014077614A
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English (en)
Japanese (ja)
Inventor
近藤　学
Manabu Kondo
学 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JNC Corp
Original Assignee
JNC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JNC Corp filed Critical JNC Corp
Priority to JP2014077614A priority Critical patent/JP2014218651A/ja
Publication of JP2014218651A publication Critical patent/JP2014218651A/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Optical Filters (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
JP2014077614A 2013-04-08 2014-04-04 熱硬化性組成物 Pending JP2014218651A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014077614A JP2014218651A (ja) 2013-04-08 2014-04-04 熱硬化性組成物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013080213 2013-04-08
JP2013080213 2013-04-08
JP2014077614A JP2014218651A (ja) 2013-04-08 2014-04-04 熱硬化性組成物

Publications (1)

Publication Number Publication Date
JP2014218651A true JP2014218651A (ja) 2014-11-20

Family

ID=51667328

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014077614A Pending JP2014218651A (ja) 2013-04-08 2014-04-04 熱硬化性組成物

Country Status (4)

Country Link
JP (1) JP2014218651A (zh)
KR (1) KR20140121794A (zh)
CN (1) CN104098756B (zh)
TW (1) TWI613230B (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017061680A (ja) * 2015-09-24 2017-03-30 Jnc株式会社 熱硬化性組成物
JP2017101168A (ja) * 2015-12-03 2017-06-08 星和電機株式会社 導電性樹脂材料、および導電性パッキン
JP2018016786A (ja) * 2016-07-13 2018-02-01 Jnc株式会社 熱硬化性組成物

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI692505B (zh) * 2014-11-18 2020-05-01 日商捷恩智股份有限公司 感光性組成物與其用途
US10793717B2 (en) 2015-01-23 2020-10-06 Jnc Corporation Thermosetting resin composition, cured film, substrate with cured film, and electronic component
JP2016183258A (ja) * 2015-03-26 2016-10-20 Jnc株式会社 熱硬化性樹脂組成物
KR20170046585A (ko) * 2015-10-21 2017-05-02 제이엔씨 주식회사 감광성 조성물
JP2017122912A (ja) * 2016-01-06 2017-07-13 Jnc株式会社 感光性組成物
JP2018028062A (ja) * 2016-08-10 2018-02-22 Jnc株式会社 熱硬化性組成物
JP7047559B2 (ja) * 2018-04-12 2022-04-05 Jnc株式会社 熱硬化性組成物
US20220204697A1 (en) * 2020-12-31 2022-06-30 Industrial Technology Research Institute Polymer and resin composition thereof

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5584379A (en) * 1978-12-20 1980-06-25 Sony Corp Flame retardant adhesive composition
JPS61270852A (ja) * 1985-05-24 1986-12-01 Nitto Electric Ind Co Ltd 半導体装置
JPH10195278A (ja) * 1997-01-10 1998-07-28 Shin Etsu Chem Co Ltd 熱硬化性樹脂組成物
JP2000273297A (ja) * 1999-03-29 2000-10-03 Dainippon Ink & Chem Inc ポリエステル樹脂組成物
JP2003226741A (ja) * 2002-02-07 2003-08-12 Nippon Steel Chem Co Ltd ポリイミド系樹脂溶液、その硬化物及びフレキシブルキャリアパッケージの製造方法
JP2004292645A (ja) * 2003-03-27 2004-10-21 Sumitomo Bakelite Co Ltd エポキシ樹脂粉体塗料
JP2005105264A (ja) * 2003-09-09 2005-04-21 Chisso Corp 熱硬化性樹脂組成物及び硬化膜
JP2008156546A (ja) * 2006-12-26 2008-07-10 Chisso Corp 熱硬化性樹脂組成物及び硬化膜
JP2012193339A (ja) * 2011-03-02 2012-10-11 Jnc Corp 熱硬化性樹脂組成物及び硬化膜
JP2013032522A (ja) * 2011-07-29 2013-02-14 Namics Corp 半導体封止用液状エポキシ樹脂組成物及びそれを用いた半導体装置
JP2014172932A (ja) * 2013-03-06 2014-09-22 Nagase Chemtex Corp 電子部品保護膜形成用組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200516111A (en) * 2003-09-09 2005-05-16 Chisso Corp Thermosetting resin composition and cured film
JP5276324B2 (ja) * 2005-10-21 2013-08-28 日本化薬株式会社 熱硬化性樹脂組成物並びにその用途
KR101010036B1 (ko) * 2009-08-28 2011-01-21 주식회사 엘지화학 신규한 폴리아믹산, 이를 포함하는 감광성 수지 조성물 및 이로부터 제조된 드라이 필름

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5584379A (en) * 1978-12-20 1980-06-25 Sony Corp Flame retardant adhesive composition
JPS61270852A (ja) * 1985-05-24 1986-12-01 Nitto Electric Ind Co Ltd 半導体装置
JPH10195278A (ja) * 1997-01-10 1998-07-28 Shin Etsu Chem Co Ltd 熱硬化性樹脂組成物
JP2000273297A (ja) * 1999-03-29 2000-10-03 Dainippon Ink & Chem Inc ポリエステル樹脂組成物
JP2003226741A (ja) * 2002-02-07 2003-08-12 Nippon Steel Chem Co Ltd ポリイミド系樹脂溶液、その硬化物及びフレキシブルキャリアパッケージの製造方法
JP2004292645A (ja) * 2003-03-27 2004-10-21 Sumitomo Bakelite Co Ltd エポキシ樹脂粉体塗料
JP2005105264A (ja) * 2003-09-09 2005-04-21 Chisso Corp 熱硬化性樹脂組成物及び硬化膜
JP2008156546A (ja) * 2006-12-26 2008-07-10 Chisso Corp 熱硬化性樹脂組成物及び硬化膜
JP2012193339A (ja) * 2011-03-02 2012-10-11 Jnc Corp 熱硬化性樹脂組成物及び硬化膜
JP2013032522A (ja) * 2011-07-29 2013-02-14 Namics Corp 半導体封止用液状エポキシ樹脂組成物及びそれを用いた半導体装置
JP2014172932A (ja) * 2013-03-06 2014-09-22 Nagase Chemtex Corp 電子部品保護膜形成用組成物

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017061680A (ja) * 2015-09-24 2017-03-30 Jnc株式会社 熱硬化性組成物
JP2017101168A (ja) * 2015-12-03 2017-06-08 星和電機株式会社 導電性樹脂材料、および導電性パッキン
JP2018016786A (ja) * 2016-07-13 2018-02-01 Jnc株式会社 熱硬化性組成物

Also Published As

Publication number Publication date
KR20140121794A (ko) 2014-10-16
CN104098756A (zh) 2014-10-15
CN104098756B (zh) 2018-10-19
TW201439148A (zh) 2014-10-16
TWI613230B (zh) 2018-02-01

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