TW200516111A - Thermosetting resin composition and cured film - Google Patents
Thermosetting resin composition and cured filmInfo
- Publication number
- TW200516111A TW200516111A TW093126954A TW93126954A TW200516111A TW 200516111 A TW200516111 A TW 200516111A TW 093126954 A TW093126954 A TW 093126954A TW 93126954 A TW93126954 A TW 93126954A TW 200516111 A TW200516111 A TW 200516111A
- Authority
- TW
- Taiwan
- Prior art keywords
- epoxy resin
- resin composition
- thermosetting resin
- weight
- parts
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/12—Polyester-amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/14—Polyamide-imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133504—Diffusing, scattering, diffracting elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/10—Transparent films; Clear coatings; Transparent materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
- G02F1/133519—Overcoatings
Abstract
A thermosetting resin composition comprises polyester amic acid, epoxy resin, epoxy resin curing agent and solvent. The polyester amic acid is obtained by reacting the following essential ingredients: tetracarboxylic dianhydride, diamine, and polyvalent hydroxy compound. The features of the thermosetting resin composition are that the epoxy resin is 20 to 400 parts by weight on the basis of the polyester amic acid being 100 parts by weight, and the epoxy resin curing agent is 15 to 60 parts by weight on the basis of the epoxy resin being 100 parts by weight.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003317373 | 2003-09-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200516111A true TW200516111A (en) | 2005-05-16 |
TWI341850B TWI341850B (en) | 2011-05-11 |
Family
ID=37384241
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093126954A TW200516111A (en) | 2003-09-09 | 2004-09-07 | Thermosetting resin composition and cured film |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101144758B1 (en) |
TW (1) | TW200516111A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI421301B (en) * | 2006-12-26 | 2014-01-01 | Jnc Corp | Thermosetting resin composition and cured film |
CN104804638A (en) * | 2014-01-28 | 2015-07-29 | 捷恩智株式会社 | Thermosetting composition, cured film and color filter |
TWI500699B (en) * | 2011-03-02 | 2015-09-21 | Jnc Corp | Thermal curing resin, cured film, color filter, liquid crystal display device, solid photographic device and led luminous body |
CN105086316A (en) * | 2014-05-15 | 2015-11-25 | 捷恩智株式会社 | Thermosetting compositions, harden film, color filter, liquid crystal displaying element, solid camera shooting element and light emitting diode illuminant |
CN106554618A (en) * | 2015-09-24 | 2017-04-05 | 捷恩智株式会社 | Thermosetting compositionss and application thereof |
TWI613230B (en) * | 2013-04-08 | 2018-02-01 | 捷恩智股份有限公司 | Thermosetting compositions, cured film, and electronic elements having the cured film |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4779670B2 (en) * | 2005-03-08 | 2011-09-28 | Jnc株式会社 | Thermosetting polymer composition |
WO2015012395A1 (en) | 2013-07-25 | 2015-01-29 | Jnc株式会社 | Thermosetting resin composition, cured film, substrate with curing film, and electronic component |
CN107207702B (en) * | 2015-01-23 | 2021-04-09 | 捷恩智株式会社 | Thermosetting resin composition, cured film, substrate with cured film, and electronic component |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3422178B2 (en) * | 1996-04-26 | 2003-06-30 | チッソ株式会社 | Thermosetting resin composition |
JPH11100564A (en) | 1997-09-29 | 1999-04-13 | Hitachi Chem Co Ltd | Adhesive based on polyamic acid and epoxy resin and production of semiconductor device by using the same |
JP2001192431A (en) | 2000-01-12 | 2001-07-17 | Nippon Kayaku Co Ltd | Resin composition, its cured product and article |
-
2004
- 2004-09-07 TW TW093126954A patent/TW200516111A/en unknown
- 2004-09-09 KR KR1020040072103A patent/KR101144758B1/en active IP Right Grant
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI421301B (en) * | 2006-12-26 | 2014-01-01 | Jnc Corp | Thermosetting resin composition and cured film |
TWI500699B (en) * | 2011-03-02 | 2015-09-21 | Jnc Corp | Thermal curing resin, cured film, color filter, liquid crystal display device, solid photographic device and led luminous body |
TWI613230B (en) * | 2013-04-08 | 2018-02-01 | 捷恩智股份有限公司 | Thermosetting compositions, cured film, and electronic elements having the cured film |
CN104804638A (en) * | 2014-01-28 | 2015-07-29 | 捷恩智株式会社 | Thermosetting composition, cured film and color filter |
CN105086316A (en) * | 2014-05-15 | 2015-11-25 | 捷恩智株式会社 | Thermosetting compositions, harden film, color filter, liquid crystal displaying element, solid camera shooting element and light emitting diode illuminant |
CN105086316B (en) * | 2014-05-15 | 2018-01-30 | 捷恩智株式会社 | Thermosetting composition, cured film, colored filter, liquid crystal display cells, solid-state imager and LED illuminant heart |
CN106554618A (en) * | 2015-09-24 | 2017-04-05 | 捷恩智株式会社 | Thermosetting compositionss and application thereof |
Also Published As
Publication number | Publication date |
---|---|
KR101144758B1 (en) | 2012-05-09 |
KR20050026367A (en) | 2005-03-15 |
TWI341850B (en) | 2011-05-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE271577T1 (en) | HEAT CURED RESINS MADE OF MALEIMIDES AND/OR VINYL DERIVATIVES | |
TW200833782A (en) | Thermosetting resin composition and cured film | |
TW200643104A (en) | Thermosetting resin composition | |
TW200516111A (en) | Thermosetting resin composition and cured film | |
EP2033985A3 (en) | Heat-curable polyimide silicone resin composition | |
WO2008064115A8 (en) | Epoxy resins comprising a cycloaliphatic diamine curing agent | |
GB1499098A (en) | Curable resin compositions | |
ATE243727T1 (en) | CURED RESIN COMPOSITIONS | |
EP1048680A4 (en) | Modified polyimide resin and thermosetting resin composition containing the same | |
ATE160153T1 (en) | COMPATIBLE MIXTURES OF EPOXY RESINS AND EPOXIDIZED POLYDIENES | |
ATE377059T1 (en) | POLYSILAZONE MODIFIED POLYAMINE CURING AGENTS FOR EPOXY RESINS | |
WO2003076515A1 (en) | Thermosetting resin composition and laminates and circuit board substrates made by using the same | |
TW200635985A (en) | Modified phenolic resin and its manufacturing method, epoxy resin composition containing the same, and prepreg impregnated with the composition | |
BRPI0618438A2 (en) | curable epoxy resin composition, crosslinked products, and electrical insulating material | |
TW200619259A (en) | Epoxy resin, epoxy resin composition and cured product thereof | |
WO2009037834A1 (en) | Primer resin for semiconductor device, and semiconductor device | |
WO2009072569A1 (en) | Polyamic acid solution composition having carbon black dispersed therein, process for production of semiconductive polyimide resin belt using the composition, and semiconductive polyimide resin belt | |
TW200734401A (en) | Resin composition and metal laminate plate | |
TW200609296A (en) | Epoxy resin composition and cured product thereof | |
EP1108762A3 (en) | Polyamic acid varnish composition and a flexible printed board | |
GB1493199A (en) | Thermosetting compositions based on a bis-imide and a polyurethane | |
GB1433891A (en) | Endo alicyclic end capped polyimide resins | |
JPS56141310A (en) | Curable resin composition | |
ATE380213T1 (en) | PAINT FOR LAMINATE OR PREPREG, LAMINATE OR PREPREG OBTAINED WITH SUCH PAINT AND CIRCUIT BOARD PRODUCED WITH SUCH LAMINATE OR PREPREG | |
EP0319008A3 (en) | Epoxy resin compositions as used in producing composites with high wet glass transition temperatures and in adhesive applications |