KR101144758B1 - Thermo-setting resin composition and hardened film - Google Patents

Abstract

A resin composition comprising a polyester amide acid, an epoxy resin, an epoxy curing agent and a solvent obtained by reacting a tetracarboxylic dianhydride, a diamine and a polyhydric hydroxy compound as essential components, wherein the epoxy resin is 20 to 100 parts by weight of the polyester amide acid. It is -400 weight part, and the epoxy hardening | curing agent is 15-60 weight part with respect to 100 weight part of epoxy resins, The curable film obtained by heating the said thermosetting resin composition.

Thermosetting resin composition, cured film, tetracarboxylic dianhydride, diamine, polyhydric hydroxy compound, foreign substance characteristic

Description

Thermosetting resin composition and cured film {THERMO-SETTING RESIN COMPOSITION AND HARDENED FILM}

This invention relates to the thermosetting resin composition and the cured film obtained by heating and hardening it.

During the manufacturing process of an element such as a liquid crystal display, various chemical treatments such as an organic solvent, an acid, an alkali solution, or the surface is locally heated to a high temperature when a wiring electrode is formed by sputtering. have. For this reason, a surface protective film may be provided in order to prevent deterioration, damage, and deterioration of the surface of various elements. For these protective films, various characteristics that can withstand the various treatments in the above manufacturing process are required. Specifically, chemical resistance such as solvent resistance, acid resistance, alkali resistance, water resistance, heat resistance, adhesion to base substrates such as glass, transparency, scratch resistance, coating property, flatness, and deterioration such as coloring over a long period of time Light resistance and the like that do not occur are required. In particular, in recent years, foreign matter characteristics have become important as characteristics when used as a color filter protective film. The foreign substance characteristic here means that when the resin composition is applied and dried on a substrate on which the foreign substance is present, the film thickness around the water becomes nonuniform, and as a result, the reflected light around the foreign substance is disturbed, and the size of the foreign substance is larger than the actual size of the foreign substance. It is a phenomenon in which foreign objects are easily seen due to its enlarged shape. The excellent foreign material property means that such a phenomenon is hard to occur and the foreign material is inconspicuous. The foreign material characteristic greatly influences the yield at the time of color filter manufacture.

As a protective film material excellent in such a characteristic, there exists a silicone containing polyamic-acid composition (patent document; Unexamined-Japanese-Patent No. 9-291150). This composition is a composition excellent in adhesion, transparency, scratch resistance, coating property, flatness and light resistance to base substrates such as solvent resistance, acid resistance, alkali resistance, water resistance, heat resistance, glass, etc. There was this.

An object of the present invention is to solve the drawbacks of the composition, such as solvent resistance, acid resistance, alkali resistance, chemical resistance, water resistance, heat resistance, adhesion to base substrates such as glass, transparency, scratch resistance, coating property, flatness, It is providing the cured film which is excellent in light resistance and excellent also in a foreign material characteristic, and the resin composition which gives this cured film.

MEANS TO SOLVE THE PROBLEM The present inventors examined variously in order to solve the said problem, As a result, the resin composition which consists of polyesteramic acid obtained by reaction of the compound containing tetracarboxylic dianhydride, a diamine, and a polyhydric hydroxy compound, an epoxy resin, and a solvent It discovered that the said objective can be achieved by the cured film obtained by heat-hardening, and came to complete this invention.

This invention has the following structures.

(1) A polyester composition comprising a polyester amide acid, an epoxy resin, an epoxy curing agent and a solvent obtained by reacting a tetracarboxylic dianhydride, a diamine, and a polyhydric hydroxy compound as essential components. An epoxy resin is 20-400 weight part with respect to a part, and an epoxy curing agent is 15-60 weight part with respect to 100 weight part of epoxy resins, The thermosetting resin composition characterized by the above-mentioned.

(2) The thermosetting resin composition according to claim 1, wherein the polyester amide acid is a reaction product obtained by reacting a tetracarboxylic dianhydride, a diamine, a polyhydric hydroxy compound, and a monohydric alcohol as essential components.

(3) The thermosetting resin composition according to claim 1, wherein the polyester amide acid is a reaction product obtained by reacting a tetracarboxylic dianhydride, a diamine, a polyhydric hydroxy compound, a monohydric alcohol, and a silicone-containing monoamine as essential components.

(4) Paragraph 2 or 3, wherein the monohydric alcohol is isopropyl alcohol, allyl alcohol, benzyl alcohol, hydroxyethyl methacrylate, propylene glycol monoethyl ether or 3-ethyl-3-hydroxymethyloxetane. Thermosetting resin composition.

(5) The thermosetting resin composition according to any one of claims 1 to 4, wherein the polyester amide acid is a polyester amide acid obtained by further reacting with a styrene-maleic anhydride copolymer.

(6) The polyester amic acid reacts X mol of tetracarboxylic dianhydride, Y mol of diamine, and Z mol of a polyhydric hydroxy compound at a ratio at which the relationship of the following formulas (1) and (2) is established: The thermosetting resin composition of any one of Claims 1-5 obtained.

0.2≤Z / Y≤8.0 (1)

0.2≤ (Y + Z) /X≤1.5 (2)

(7) The thermosetting resin composition of any one of Claims 1-6 which is a compound in which a polyester amide acid has a structural unit represented by following formula (3) and formula (4).

Wherein R ₁ is a tetracarboxylic dianhydride residue, R ₂ is a diamine residue, and R ₃ is a polyvalent hydroxy compound residue.

(8) tetracarboxylic dianhydride is 3,3 ', 4,4'-diphenylsulfontetracarboxylic dianhydride, 3,3', 4,4'-diphenylethertetracarboxylic dianhydride, 2,2- (bis Thermosetting resin according to any one of claims 1 to 7, which is at least one compound selected from (3,4-dicarboxyphenyl)) hexafluoropropane dianhydride and ethylene glycol bis (anhydrotrimelitate). Composition.

(9) The substrate according to any one of items 1 to 8, wherein the diamine is at least one compound selected from 3,3'-diaminodiphenylsulfone and bis (4- (3-aminophenoxy) phenyl) sulfone. Thermosetting resin composition.                     

(10) The polyhydric hydroxy compound is selected from ethylene glycol, propylene glycol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,7-heptanediol and 1,8-octanediol The thermosetting resin composition of any one of Claims 1-9 which is 1 or more types of compounds.

(11) epoxy resin polyglycidyl methacrylate, methyl methacrylate-glycidyl methacrylate copolymer, benzyl methacrylate-glycidyl methacrylate copolymer, n-butyl methacrylate-glycol The first is at least one compound selected from an epoxy group-containing polymer of a cyl methacrylate copolymer, a 2-hydroxyethyl methacrylate-glycidyl methacrylate copolymer and a styrene-glycidyl methacrylate copolymer. The thermosetting resin composition of any one of Claims 10-10.

(12) The thermosetting resin composition according to any one of claims 1 to 10, wherein the epoxy resin is an alicyclic epoxy resin.

(13) The thermosetting resin composition according to any one of claims 1 to 12, wherein the epoxy curing agent is trimellitic anhydride.

(14) tetracarboxylic dianhydride is 3,3 ', 4,4'-diphenylethertetracarboxylic dianhydride, diamine is 3,3'-diaminodiphenylsulfone, polyvalent hydroxy compound is 1,4- Claim 1 or Claim 2 which is a butanediol, an epoxy resin is n-butylmethacrylate-glycidyl methacrylate copolymer, an epoxy hardening agent is trimellitic anhydride, and a solvent is a solvent containing methyl 3-methoxypropionate. The thermosetting resin composition of Claim 2.

(15) Tetracarboxylic acid dianhydride is 3,3 ', 4,4'-diphenylethertetracarboxylic acid dianhydride, diamine is 3,3'-diaminodiphenyl sulfone, polyhydric hydroxy compound is 1,4- Butanediol, monohydric alcohol is benzyl alcohol, epoxy resin is n-butyl methacrylate-glycidyl methacrylate copolymer, epoxy curing agent is trimellitic anhydride, solvent contains methyl 3-methoxypropionate The thermosetting resin composition of Claim 2 or 3 which is a solvent to be used.

(16) The thermosetting resin composition according to any one of items 1 to 15, wherein the weight average molecular weight of the polyester amide acid is 2,000 to 200,000.

(17) The thermosetting resin composition according to any one of items 1 to 15, wherein the weight average molecular weight of the epoxy resin is 10,000 to 1,000,000.

(18) Cured film obtained by heating the thermosetting resin composition of any one of Claims 1-17.

(19) A color filter using the cured film of item 18 as a protective film.

(20) A liquid crystal display device using the color filter of claim 18.

(21) A solid-state imaging device using the color filter of claim 19.

(22) A liquid crystal display element using the cured film according to item 18 as a transparent insulating film formed between the TFT and the transparent electrode.

(23) A liquid crystal display device using the cured film of claim 18 as a transparent insulating film formed between the transparent electrode and the alignment film.

(24) An LED light-emitting body using the cured film of claim 18 as a protective film.

The thermosetting resin composition of this invention is excellent in a foreign material characteristic, and when used as a color filter protective film, a yield improves. Moreover, the cured film obtained by heating the thermosetting resin composition of this invention is balanced in transparency, heat resistance, chemical-resistance, flatness, adhesiveness, and sputter resistance, and is highly practical. It is especially useful as a protective film of the color filter manufactured by the dyeing method, the pigment dispersion method, the electrodeposition method, and the printing method. Moreover, it can also be used as a protective film and a transparent insulating film of various optical materials.

Specific examples of the tetracarboxylic dianhydride used in the present invention include 3,3 ', 4,4'-benzophenonetetracarboxylic dianhydride, 2,2', 3,3'-benzophenonetetracarboxylic dianhydride, 2, 3,3 ', 4'-benzophenonetetracarboxylic dianhydride, 3,3', 4,4'-diphenylsulfontetracarboxylic dianhydride, 2,2 ', 3,3'-diphenylsulfontetracarboxylic dianhydride , 2,3,3 ', 4'-diphenylsulfontetracarboxylic dianhydride, 3,3', 4,4'-diphenylethertetracarboxylic dianhydride, 2,2 ', 3,3'-diphenyl ether Tetracarboxylic dianhydride, 2,3,3 ', 4'-diphenylethertetracarboxylic dianhydride, 2,2- [bis (3,4-dicarboxyphenyl)] hexafluoropropane dianhydride, and ethylene glycol bis Aromatic tetracarboxylic dianhydride, cyclobutane tetracarboxylic dianhydride, methylcyclobutane tetracarboxylic acid, such as (anhydro trimellitate) (brand name; TMEG-100, Nippon Chemical Co., Ltd. make). Alicyclic tetracarboxylic acid dianhydrides, such as a dianhydride, cyclopentane tetracarboxylic dianhydride, and cyclohexane tetracarboxylic dianhydride, aliphatic tetracarboxylic dianhydride, such as an ethane tetracarboxylic dianhydride, and butanetetracarboxylic dianhydride, are mentioned. .

Among them, 3,3 ', 4,4'-diphenylsulfontetracarboxylic dianhydride, 3,3', 4,4'-diphenylethertetracarboxylic dianhydride, 2,2- which gives a resin having good transparency. [Bis (3,4-dicarboxyphenyl)] hexafluoro propane dianhydride, ethylene glycol bis (anhydro trimellitate) (brand name; TMEG-100, the Nippon Chemicals make) are preferable, 3, Particularly preferred are 3 ', 4,4'-diphenylethertetracarboxylic dianhydride and 3,3', 4,4'-diphenylsulfontetracarboxylic dianhydride.

Specific examples of the diamine used in the present invention include 4,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfone, 3,4'-diaminodiphenylsulfone, bis [4- (4 -Aminophenoxy) phenyl] sulfone, bis [4- (3-aminophenoxy) phenyl] sulfone, bis [3- (4-aminophenoxy) phenyl] sulfone, [4- (4-aminophenoxy) phenyl ] [3- (4-aminophenoxy) phenyl] sulfone, [4- (3-aminophenoxy) phenyl] [3- (4-aminophenoxy) phenyl] sulfone, and 2,2-bis [4- (4-aminophenoxy) phenyl] hexafluoropropane etc. are mentioned. Among these, 3,3'- diamino diphenyl sulfone and bis [4- (3-aminophenoxy) phenyl] sulfone which give resin with favorable transparency are preferable, and 3,3'- diamino diphenyl sulfone is preferable. Particularly preferred.

Specific examples of the polyhydric hydroxy compound used in the present invention include ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, polyethylene glycol having a molecular weight of 1,000 or less, propylene glycol, dipropylene glycol, tripropylene glycol, tetrapropylene glycol , Polypropylene glycol having a molecular weight of 1,000 or less, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 1,2-pentanediol, 1,5-pentanediol, 2,4-pentanediol, 1, 2,5-pentanetriol, 1,2-hexanediol, 1,6-hexanediol, 2,5-hexanediol, 1,2,6-hexanetriol, 1,2-heptanediol, 1,7- Heptanediol, 1,2,7-heptanetriol, 1,2-octanediol, 1,8-octanediol, 3,6-octanediol, 1,2,8-octanetriol, 1,2-nonanediol , 1,9-nonanediol, 1,2,9-nonanetriol, 1,2-decanediol, 1,10-decanediol, 1,2,10-decanetriol, 1,2-dodecanediol, 1,12-dodecanediol, glycerin, trimetholpropane, pentaerythritol, dipentaerythritol , Bisphenol A (brand name), bisphenol S (brand name), bisphenol F (brand name), diethanolamine, triethanolamine, and the like.

Among these, ethylene glycol, propylene glycol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,7-heptanediol, and 1,8-octanediol are preferable, and 1,4- Butanediol, 1,5-pentanediol, and 1,6-hexanediol are particularly preferred because of their good solubility in solvents.

Specific examples of the monohydric alcohol used in the present invention include methanol, ethanol, 1-propanol, isopropyl alcohol, allyl alcohol, benzyl alcohol, hydroxyethyl methacrylate, propylene glycol monoethyl ether, propylene glycol monomethyl ether, Dipropylene glycol monoethyl ether, dipropylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monoethyl ether, phenol, borneol, maltol, linalol, Terpineol, dimethylbenzylcarbinol, 3-ethyl-3-hydroxymethyloxetane, and the like.

Among these, isopropyl alcohol, allyl alcohol, benzyl alcohol, hydroxyethyl methacrylate, propylene glycol monoethyl ether, and 3-ethyl-3-hydroxymethyl oxetane are preferable. Considering the compatibility when the polyester amide acid produced using these, an epoxy resin and an epoxy curing agent are mixed, and the coating property on the color filter of the thermosetting resin composition which is the final product, it is preferable to use benzyl alcohol as the monohydric alcohol. More preferred.

Specific examples of the silicon-containing monoamine used in the present invention include 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropylmethyldimethoxysilane, 3-aminopropylmethyldiethoxysilane , 4-aminobutyltrimethoxysilane, 4-aminobutyltriethoxysilane, 4-aminobutylmethyldiethoxysilane, p-aminophenyltrimethoxysilane, p-aminophenyltriethoxysilane, p-aminophenyl Methyldimethoxysilane, p-aminophenylmethyl diethoxysilane, m-aminophenyl trimethoxysilane, m-aminophenylmethyl diethoxysilane, etc. are mentioned. Among these, 3-aminopropyltriethoxysilane and p-aminophenyltrimethoxysilane are preferable, and 3-aminopropyltriethoxysilane is particularly preferable because it provides good acid resistance of the coating film.

Specific examples of the solvent used in the polymerization reaction for obtaining the polyester amide acid include diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol monoethyl ether acetate, ethylene glycol monoethyl ether acetate, and propylene glycol monomethyl ether. Acetates, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate, ethyl lactate, cyclohexanone, N-methyl-2-pyrrolidone, and N, N-dimethylacetamide. Among these, propylene glycol monomethyl ether acetate, methyl 3-methoxypropionate, and N-methyl-2-pyrrolidone are preferable.

These solvents can be used alone or as mixed solvents of two or more thereof. Moreover, if it is a ratio of 30 weight% or less, you may mix and use other solvent other than the said solvent.

In the method for producing a polyester amide acid used in the present invention, X mole of tetracarboxylic dianhydride, Y mole of diamine, and Z mole of a polyvalent hydroxy compound are reacted in the solvent. At this time, it is preferable to set X, Y, and Z in the ratio which the relationship of following formula (1) and formula (2) holds between them. If it is this range, the solubility of a polyester amide acid in the solvent is high, and the coating property of a composition improves, and the cured film excellent in flatness can be obtained as a result.

0.2≤Z / Y≤8.0 (1)

0.2≤ (Y + Z) /X≤1.5 (2)

The relationship of the formula (1) is preferably 0.7 ≦ Z / Y ≦ 7.0, and more preferably 1.3 ≦ Z / Y ≦ 7.0. The relationship of the formula (2) is preferably 0.5 ≦ (Y + Z) /X≦0.9, and more preferably 0.7 ≦ (Y + Z) /X≦0.8.

When the polyesteramic acid used by this invention has an acid anhydride group at the terminal of a molecule | numerator, the above-mentioned monohydric alcohol can be added and made to react as needed. The polyester amide acid to which monohydric alcohol was added improves compatibility with an epoxy resin and an epoxy hardening | curing agent, and improves the applicability | paintability of the thermosetting resin composition of this invention containing these.

Moreover, the acid resistance of the coating film obtained when the above-mentioned silicone containing monoamine reacts with the polyester amide acid which has an acid anhydride group at a molecular terminal improves. The monohydric alcohol and the silicone-containing monoamine can also be reacted with the polyesteramic acid at the same time.

When the reaction solvent is used in an amount of 100 parts by weight or more based on 100 parts by weight of the total of tetracarboxylic dianhydride, diamine and a polyhydric hydroxy compound, the reaction proceeds smoothly. It is preferable to make reaction react for 20 to 20 hours at 40 degreeC-200 degreeC. When making silicon-containing monoamine react, after reaction of tetracarboxylic dianhydride, a diamine, and a polyhydric hydroxy compound is complete | finished, after cooling a reaction liquid to 40 degrees C or less, silicon-containing monoamine is added and it is 10 degreeC- What is necessary is just to react at 40 degreeC for 0.1 to 6 hours. In addition, monohydric alcohol can be added at any point in the reaction.

The order of adding the reaction raw materials to the reaction system is not particularly limited. That is, a method in which tetracarboxylic dianhydride, a diamine and a polyhydric hydroxy compound are simultaneously added to a reaction solvent, a diamine and a polyhydric hydroxy compound are dissolved in a reaction solvent, and then a tetracarboxylic dianhydride is added, or tetracarboxylic dianhydride and After making diamine react beforehand, any method, such as a method of adding a polyhydric hydroxy compound, to this reaction product can be used. It is preferable that it is 2,000-200,000, and, as for the weight average molecular weight of obtained polyester amide acid, it is more preferable that it is 3,000-150,000. It is because a high molecular weight is more preferable in a foreign material characteristic, and solubility with respect to a solvent is so preferable that it is low.

In order to raise the weight average molecular weight of polyester amic acid, you may add and synthesize | combine the compound which has three or more acid anhydride groups. As a specific example of the compound which has three or more acid anhydride groups, a styrene maleic anhydride copolymer is mentioned.

The polyester amide acid thus synthesized comprises a structural unit composed of the formulas (3) and (4), the terminal of which is an acid anhydride group and an amino group derived from tetracarboxylic dianhydride, diamine or polyhydric hydroxy compound as raw materials. Or a hydroxyl group, or an additive other than these compounds constitutes the terminal. In formula (3) and (4), R <_1> is a tetracarboxylic dianhydride residue, Preferably it is a C2-C30 organic group. R <_2> is a diamine residue, Preferably it is a C2-C30 organic group. R <_3> is a polyhydric hydroxy compound residue, Preferably it is a C2-C20 organic group.

The epoxy resin used in the present invention is not particularly limited as long as compatibility with other components forming the thermosetting resin composition of the present invention is good, but preferably a bisphenol A type epoxy resin, a glycidyl ester type epoxy resin, and an alicyclic ring And a copolymer of a formula epoxy resin, a polymer of a monomer having an epoxy group, a monomer having an epoxy group and another monomer, and the like. Among these, an alicyclic epoxy resin, the polymer of the monomer which has an epoxy group, and the copolymer of the monomer and other monomer which have an epoxy group are especially preferable because they are excellent in transparency and a foreign material characteristic.

Specific examples of the alicyclic epoxy resin include Epicoat 807, Epicoat 815, Epicoat 825, Epicoat 827, Epicoat 828, Epicoat 190P, and Epicoat 191P (above, trade names and products made by Emulsion Shell Epoxy) Epicoat 1004, Epicoat 1256 (above, trade name, manufactured by Japan Epoxy Resin), Araldite CY177, Araldite CY184 (above, trade name, manufactured by Chiba-Geigi Co., Ltd.), Celoxide 2021, And EHPE-3150 (above, trade names, manufactured by Daicel Chemical Industries, Ltd.) and the like. The epoxy resin used for this invention can also mix and use 2 or more types. In the case where the epoxy resin having a molecular weight of less than 10,000 and the epoxy resin having a molecular weight of 10,000 or more are mixed and used, if the epoxy resin having a molecular weight of 10,000 or more is 5% by weight or more of the whole epoxy resin, the foreign material property is preferable.

Moreover, glycidyl (meth) acrylate and methylglycidyl (meth) acrylate are mentioned as a specific example of the monomer which has an epoxy group. Among these, glycidyl methacrylate is preferable because it can provide the cured film with favorable foreign material characteristics.

As a specific example of the other monomer copolymerizing with the monomer which has an epoxy group, (meth) acrylic acid, methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate , iso-butyl (meth) acrylate, tert-butyl (meth) acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (Meth) acrylate, styrene, methyl styrene, chlormethyl styrene, N-phenylmaleimide, etc. are mentioned. Among these, the copolymer obtained has methyl (meth) acrylate, benzyl (meth) acrylate, n-butyl (meth) acrylate, and 2-hydroxyethyl excellent in compatibility with the polyester amic acid used by this invention. More preferred are methacrylate and styrene.

Preferable specific examples of the polymer of the monomer having an epoxy group and the copolymer of the monomer having an epoxy group with another monomer include polyglycidyl methacrylate, methyl methacrylate-glycidyl methacrylate copolymer and benzyl methacrylate-. Glycidyl methacrylate copolymer, n-butyl methacrylate-glycidyl methacrylate copolymer, 2-hydroxyethyl methacrylate-glycidyl methacrylate copolymer and styrene-glycidyl methacrylate A latex copolymer is mentioned.

The ratio of the copolymer of the monomer which has an epoxy group, and another monomer is preferable because it is excellent in chemical resistance, if the monomer which has an epoxy group is 30 mol% or more. It is further more preferable if the monomer which has an epoxy group is 50 mol% or more.

10,000-1,000,000 are preferable and, as for the molecular weight of the polymer of the monomer which has an epoxy group, or the copolymer of the monomer which has an epoxy group, and another monomer, 50,000-500,000 are more preferable. This is because foreign material characteristics are better at higher molecular weight, and better at low molecular weight.

In order to improve heat resistance and chemical resistance, it is effective to add an epoxy hardening | curing agent to the thermosetting resin composition of this invention. As an epoxy hardening | curing agent, although an acid anhydride type hardening | curing agent, a polyamine type hardening | curing agent, a polyphenol type hardening | curing agent, a catalyst type hardening | curing agent, etc. are mentioned, an acid anhydride type hardening | curing agent is preferable at the point of coloring and heat resistance.

Specific examples of the acid anhydride curing agent include aromatic polyhydric carboxylic acid anhydrides such as aliphatic dicarboxylic acid anhydrides such as maleic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, and methylhexahydrophthalic anhydride, phthalic anhydride, and trimellitic anhydride and styrene. -Maleic anhydride copolymer, etc. are mentioned. Among them, trimellitic anhydride is particularly preferred in view of the balance between heat resistance and solubility in solvents.

The thermosetting resin composition of this invention is 20-400 weight part of epoxy resins with respect to 100 weight part of polyester amide acids. If the epoxy resin is in this range, the balance of flatness, heat resistance, chemical resistance, adhesion, and foreign matter characteristics is good. The epoxy resin is more preferably in the range of 50 to 200 parts by weight.

It is preferable to add the ratio of the epoxy resin and the epoxy curing agent in the case of adding an epoxy curing agent for the purpose of improving heat resistance and chemical resistance so that the carboxylic anhydride group or carboxylic acid group which is an epoxy curing agent is 0.2-2 times equivalent with respect to an epoxy group. At this time, a carboxylic anhydride group calculates bivalently. It is more preferable if the carboxylic anhydride group or the carboxylic acid group is added so as to be 0.5 to 1.5 times equivalent, since the chemical resistance is further improved.

As a solvent used for the resin composition of this invention, the solvent used by the polymerization reaction at the time of synthesize | combining polyesteramic acid can be used as it is. Although solid content of the said thermosetting resin composition is selected according to the film thickness of a coating film, it is common to include in the range of 5-40 weight part in 100 weight part of said resin compositions.

The thermosetting resin composition which concerns on this invention may contain other components of that excepting the above as needed in the range which does not impair the objective of this invention. As such another component, a coupling agent and surfactant can be mentioned.

A coupling agent is used in order to improve adhesiveness with a board | substrate, 10 weight part or less is added with respect to 100 weight part of solid content (residual component except a solvent in the said resin composition) of the said thermosetting resin composition, and is used.

As the coupling agent, silane-based, aluminum-based, and titanate-based compounds can be used.                     

Specifically, silane type, such as 3-glycidoxy propyl dimethyl ethoxysilane, 3-glycidoxy propylmethyl diethoxysilane, and 3-glycidoxy propyl trimethoxysilane, acetalkoxy aluminum diisopropylate, etc. And titanium titanates such as tetraisopropyl bis (dioctylphosphite) titanate. Among these, 3-glycidoxy propyl trimethoxysilane is preferable because the effect of improving adhesiveness is large.

Surfactant is used in order to improve wettability, leveling property, or applicability | paintability with respect to a base substrate, 0.01-1 weight part is added and used with respect to 100 weight part of said thermosetting resin compositions. As surfactant, silicone type surfactant, acrylic type surfactant, fluorine type surfactant, etc. are used. Specifically, silicones such as Byk-300, Byk-306, Byk-335, Byk-310, Byk-341, Byk-344, and Byk-370 (above, brand names, manufactured by Big Chemie), Byk- Acrylic system, such as 354, ByK-358, and Byk-361 (above, a brand name, a Big Chemie make), DFX-18, Pgentent 250, and a gentgent 251 (above, a brand name, Neo's) Can be mentioned.

The thermosetting resin composition of this invention mixes polyester amide acid, an epoxy resin, and a solvent, Depending on the target characteristic, an epoxy curing agent, a coupling agent, and surfactant are further selected and added as needed, and these are made uniform. It can obtain by mixing and melt | dissolving easily.

The coating film can be formed by apply | coating the thermosetting resin composition prepared as mentioned above to the base body surface, and removing a solvent by heating. Application of the thermosetting resin composition to the surface of the base body can form a coating film by a conventionally known method such as a spin coat method, a roll coat method, a dipping method, and a slit coat method. Subsequently, this coating film is heated (prebaked) by a hotplate or oven. The heating conditions vary depending on the type and the blending ratio of each component, but usually at 70 ° C to 120 ° C for 5 to 15 minutes in the case of an oven and 1 to 5 minutes for the hot plate. Then, in order to harden a coating film, at 180 degreeC-250 degreeC, Preferably it is 200 degreeC-250 degreeC, a cured film can be obtained by heat-processing for 30 to 90 minutes in the case of oven, and 5 to 30 minutes in case of a hotplate. .

In the cured film thus obtained, upon heating, (1) the polyamic acid portion of the polyesteramic acid dehydrates to form an imide bond, and (2) the carboxylic acid of the polyesteramic acid reacts with the epoxy resin to give a high molecular weight. (3) Since the epoxy resin is cured and high molecular weight, it is extremely tough and excellent in transparency, heat resistance, chemical resistance, flatness, adhesion, and sputter resistance.

Next, the present invention will be described in detail with reference to Synthesis Examples, Examples and Comparative Examples, but the present invention is not limited at all by these Examples.

The polyester amic acid solution which consists of reaction products of tetracarboxylic dianhydride, a diamine, and a polyhydric hydroxy compound was synthesize | combined as follows.

Synthesis Example 1

9.93 g of 3,3'-diaminodiphenylsulfone (hereinafter abbreviated as "DDS") after nitrogen replacement of a thermometer, 500 ml of a detachable flask with stirring vanes, and 14.42 g of 1,4-butanediol After the addition, 202 g of dehydrated and purified 3-methoxypropionate methyl (hereinafter abbreviated as "MMP") was added thereto, and stirred at room temperature to dissolve DDS and 1,4-butanediol. Thereafter, 62.04 g of 3,3 ', 4,4'-diphenylethertetracarboxylic acid dianhydride (hereinafter abbreviated as "ODPA") was added thereto. It heated to 130 degreeC by the oil bath, stirred for 4 hours, and cooled, and obtained the 30 weight% solution of the pale yellow transparent polyesteramic acid. The rotational viscosity of this solution was 36.5 mPa * s. Rotational viscosity is here the viscosity measured at 25 degreeC using the E-type viscosity meter (brand name; VISCONIC END, (made by Tokyo Chemical Industry)) (it is the same below). The weight average molecular weight measured by GPC was 7,600.

Synthesis Example 2

After nitrogen-substituting a 500 ml flask with a thermometer and a stirring blade, 12.75 g of DDS and 16.20 g of 1,4-butanediol were added thereto, followed by adding 280 g of dehydrated and purified MMP, followed by stirring at room temperature. 4-butanediol was dissolved. Thereafter, 79.67 g of ODPA was added. It heated to 130 degreeC with the oil bath, and stirred for 4 hours, and cooled to 30 degreeC. 11.37 g of 3-aminopropyltriethoxysilane were added and stirred for 4 hours to obtain a 30 wt% solution of a pale yellow transparent ester group-containing polyamic acid. The rotational viscosity of this solution was 18.2 mPa · s. The weight average molecular weight measured by GPC was 3,800.

Synthesis Example 3

After nitrogen-substituting a 500 ml separate flask with a thermometer and a stirring blade, 9.93 g of DDS and 14.42 g of 1,4-butanediol were added thereto, followed by adding 206 g of dehydrated and purified MMP, followed by stirring at room temperature. 1,4-butanediol was dissolved. Thereafter, 55.84 g of ODPA and 8.09 g of styrene-maleic anhydride copolymer SMA-1000 (trade name, manufactured by Kawagawa Chemical Co., Ltd.) were added. It heated to 130 degreeC by the oil bath, stirred for 4 hours, and cooled. A 30 wt% solution of pale yellow transparent polyesteramic acid was obtained. The rotational viscosity of this solution was 91.7 mPa * s. The weight average molecular weight measured by GPC was 24,000.

(Synthesis Example 4)

After nitrogen-substituting a 500 ml separate flask equipped with a thermometer and a stirring blade, 9.93 g of DDS and 24.03 g of triethylene glycol were added thereto, followed by adding 224 g of dehydrated and purified MMP, followed by stirring at room temperature for DDS and triethylene. Glycol was dissolved. Thereafter, 62.04 g of ODPA was added. It heated to 130 degreeC by the oil bath, and stirred for 6 hours, and cooled. A 30 wt% solution of pale yellow transparent polyesteramic acid was obtained. The rotational viscosity of this solution was 31.9 mPa · s. The weight average molecular weight measured by GPC was 7,200.

Synthesis Example 5

After nitrogen-substituting a 500 ml flask with a thermometer and a stirring blade, 13.03 g of DDS and 14.19 g of 1,4-butanediol were added thereto, followed by adding 280 g of dehydrated and purified MMP, followed by stirring at room temperature to give DDS, 1,4 Butanediol was dissolved. Thereafter, 81.42 g of ODPA and 11.35 g of benzyl alcohol were added thereto. It heated to 130 degreeC by the oil bath, stirred for 4 hours, and cooled. A 30 wt% solution of a pale yellow transparent ester group-containing polyamic acid was obtained. The rotational viscosity of this solution was 20.1 mPa * s. The weight average molecular weight measured by GPC was 4,400.

Example 1

1,000 ml of a detachable flask with a stirring blade was nitrogen-substituted, and 100 g of the polyester amide acid solution obtained in Synthesis Example 1 and methyl methacrylate-glycidyl methacrylate copolymer (molar ratio 30:70) were added to the flask. 30 g of weight average molecular weight 250,000), 6 g of trimellitic anhydride, 3 g of 3-glycidoxypropyltrimethoxysilane, and 558 g of dehydrated and purified MMP were added thereto, and the mixture was stirred at room temperature for 5 hours to uniformly dissolve. Next, 0.69 g of Byk-344 (trade name; manufactured by BIC Chemie) was added thereto, stirred at room temperature for 1 hour, and filtered with a membrane filter having a pore diameter of 0.2 µm to prepare a coating solution. First, the foreign material characteristic was evaluated about this coating liquid. Next, this coating solution was spin-coated at 600 rpm on a glass substrate and a color filter substrate for 10 seconds, and then prebaked at 80 ° C. for 3 minutes on a hot plate to form a coating film. Then, the coating film was hardened by heating at 220 degreeC for 30 minutes in oven, and the cured film with a film thickness of 1.5 micrometers was obtained. About the cured film obtained in this way, the characteristic was evaluated about transparency, heat resistance, chemical-resistance, flatness, adhesiveness, and sputter resistance. These evaluation results are shown in Table 1.

[Assessment Methods]

Foreign material characteristics: The chromium substrate was installed in the spreader of the beads spacer, and the 20 micrometers diameter beads spacer was sprayed so that it might become a ratio of 3-5 pieces / cm <2>. The substrate was spin-coated at 600 rpm for 10 seconds, and then prebaked at 80 ° C for 3 minutes on a hot plate to form a coating film. Then, the coating film was hardened by heating at 220 degreeC for 30 minutes in oven, and the cured film with a film thickness of 1.5 micrometers was obtained. The cured film was observed at 50 times the surface using a differential interference microscope (trade name; AFX-IIA, manufactured by Nikon), and the diameter of the portion where the film around the beads spacer swelled was measured.

Transparency: The obtained glass substrate with a cured film WHEREIN: The transmittance | permeability in wavelength 400nm of the light of a cured film only was measured with the spectrophotometer (brand name; MICRO COLOR ANALYZER TC-1800M, product made by the Tokyo Metro Co., Ltd.). (Circle) and the case below 99% were made into the case where the transmittance | permeability is 99% or more.

Heat resistance: After reheating the obtained glass substrate with a cured film at 250 degreeC for 1 hour, the residual film rate after heating with respect to the film thickness before heating, and the transmittance | permeability in 400 nm after heating were measured. The case where the residual film rate after heating is 95% or more and the transmittance | permeability in 400 nm after heating is 99% or more was made into (circle). The case where the residual film rate after heating is less than 95% or the transmittance | permeability in 400 nm after heating was less than 99% was made into x.

Chemical resistance: The obtained glass substrate with a cured film was immersed in a 5 wt% sodium hydroxide aqueous solution at 30 ° C. for 30 minutes (hereinafter abbreviated as NaOH treatment), 36% hydrochloric acid / 60% nitric acid / water = 40/20/40 Immersion treatment at 50 ° C. for 15 minutes (hereinafter abbreviated as mixed acid treatment) in a mixed solution (weight ratio) consisting of 30 minutes and at 40 ° C. for 30 minutes in N-methylpyrrolidone (hereinafter abbreviated as NMP treatment). ) Separately, and the remaining film rate after each treatment and the transmittance before and after each treatment with respect to the film thickness before each treatment were measured. The case where the residual film rate after each process is 95% or more and the transmittance | permeability in 400 nm after each process is 99% or more was made into (circle). The case where the residual film rate after each process is less than 95% or the transmittance | permeability after each process is less than 99% was made into x.

Flatness: The level | step difference of the cured film surface of the obtained color filter substrate with a cured film was measured using the probe type film thickness meter (brand name: alpha-step 200, product made by TENCOR INSTRUMENTS). (Circle) and the case where it is 0.05 micrometer or more were made into the case where the maximum value (henceforth abbreviation of maximum roughness) of the level | step difference between R, G, and B pixels containing a black matrix is less than 0.05 micrometer. The color filter substrate used is an electrodeposition method color filter (hereinafter abbreviated as electrodeposition CF) having a maximum roughness of about 0.8 mu m and a printing method color filter (hereinafter abbreviated as printing CF) having a maximum roughness of about 0.2 mu m.

Adhesiveness: After the pressure cooker test (henceforth abbreviated as PCT process) is performed on the obtained glass substrate with a cured film for 24 hours on 120 degreeC, 100%, and 0.2 MPa conditions, the board | substrate test by tape peeling of a cured film (JIS-K-5400) is performed to count the remaining water. (Circle) and the case of 99/100 or less were made into the case where the residual number / 100 is 100/100.

Sputter resistance: In the obtained glass substrate with a cured film, when the ITO film | membrane was formed on the cured film by the sputter | spatter at 240 degreeC so that the resistance value of 10 ohms / cm <2> could be obtained, the presence or absence of wrinkles of a film was investigated. (Circle) and the case where a wrinkle generate | occur | produced the case where there was no wrinkle.

[Example 2]

In the same manner as in Example 1, only the polyester amide acid solution was changed to the solution obtained in Synthesis Example 2 to prepare a coating solution. As in Example 1, the properties were evaluated for foreign material properties, transparency, heat resistance, chemical resistance, flatness, adhesion, and sputter resistance. These evaluation results are shown in Table 1.

Example 3

In the same manner as in Example 1, only the polyester amide acid solution was changed to the solution obtained in Synthesis Example 3 to prepare a coating solution. As in Example 1, the properties were evaluated for foreign matter properties, permeability, heat resistance, chemical resistance, flatness, adhesion, and sputter resistance. These evaluation results are shown in Table 1.

Example 4

In the same manner as in Example 1, only the polyester amide acid solution was changed to the solution obtained in Synthesis Example 4 to prepare a coating solution. As in Example 1, the properties were evaluated for foreign material properties, transparency, heat resistance, chemical resistance, flatness, adhesion, and sputter resistance. These evaluation results are shown in Table 1.

Example 5

In the same manner as in Example 1, the polyester amide acid solution was changed to the solution obtained in Synthesis Example 5, and the methyl methacrylate / glycidyl methacrylate copolymer was changed to butyl methacrylate / glycidyl methacrylate. The coating liquid was adjusted to 30 g of copolymers (molar ratio 20:80, weight average molecular weight 80,000). As in Example 1, the properties were evaluated for foreign material properties, transparency, heat resistance, chemical resistance, flatness, adhesion, and sputter resistance. These evaluation results are shown in Table 1.

[Example 6]

Into a nitrogen-displaced 500 ml separated flask equipped with a stirring blade, 100 g of the polyester amide acid solution obtained in Synthesis Example 3, and an alicyclic epoxy resin epicoat 191P (trade name; a modified shell epoxy agent, a weight average molecular weight 284) 30g), 15g of trimellitic anhydride, 3g of 3-glycidoxypropyltrimethoxysilane and 206g of dehydrated and purified MMP were added, and stirred at room temperature for 5 hours to dissolve uniformly. Next, 0.69 g of Byk-344 (trade name; manufactured by BIC Chemie) was added thereto, stirred at room temperature for 1 hour, and filtered with a membrane filter having a pore diameter of 0.2 µm to prepare a coating solution. Evaluation similar to Example 1 was performed about this coating liquid. These evaluation results are shown in Table 1.

Example 7

20 g of ester-group-containing polyamic acid solution obtained in Synthesis Example 1, alicyclic epoxy resin epicoat 191P (trade name: manufactured by Nippon Shell Epoxy) in a 500 ml separate flask with a stirring blade, nitrogen-substituted, 13 g of trimellitic anhydride, 3 g of 3-glycidoxypropyltrimethoxysilane, and 206 g of dehydrated and purified MMP were charged, and stirred at room temperature for 5 hours to dissolve uniformly. Next, 0.69 g of Byk-344 (trade name: manufactured by BICCHEMY) was added thereto, stirred at room temperature for 1 hour, and filtered with a membrane filter having a pore diameter of 0.2 µm to prepare a coating solution. Evaluation similar to Example 1 was performed about this coating liquid. These evaluation results are shown in Table 1.

(Comparative Example 1)

After nitrogen-substituting the 500 ml separate flask with a thermometer and a stirring blade, 4.85 g of DDS and 43.22 g of 3-aminopropyltriethoxysilane were added thereto, and then 197 g of dehydrated and purified MMP was added thereto, followed by stirring at room temperature. , DDS and 3-aminopropyltriethoxysilane were dissolved. Thereafter, the flask was cooled in an ice bath and 36.36 g of ODPA was added when the temperature of the contents liquid reached 10 ° C. When the temperature rise by the exothermic reaction stopped, the ice bath was removed and stirred at room temperature for 8 hours to obtain a pale yellow transparent silicone-containing polyamic acid solution. The rotational viscosity of this solution was 12 mPa · s.

In a 500 ml nitrogen-substituted flask equipped with a stirring blade, 100 g of the silicone-containing polyamic acid solution, Epicoat 191P (trade name; manufactured by Epoxy Shell Epoxy), 16.95 g of trimellitic anhydride, 3- 3.85 g of glycidoxypropyl trimethoxysilane and 172.4 g of dehydrated and purified MMP were added thereto, stirred at room temperature, and dissolved homogeneously. Subsequently, 0.17 g of Byk-344 (brand name; made by BICCHEMY) was added, it stirred at room temperature for 1 hour, and it filtered with the membrane filter of 0.2 micrometer of pore diameters, and prepared the coating liquid. Evaluation similar to Example 1 was performed about this coating liquid. These evaluation results are shown in Table 1.

(Comparative Example 2)

Into a nitrogen-displaced 500 ml separated flask equipped with a stirring blade, 100 g of a silicone-containing polyamic acid solution synthesized in Comparative Example 1, a methyl methacrylate-glycidyl methacrylate copolymer (molar ratio 30:70, weight average Molecular weight 250,000) 30g, trimellitic anhydride 16.95g, 3-glycidoxypropyltrimethoxysilane 3.85g and dehydrated MMP 172.4g were added, and the mixture was stirred at room temperature to obtain a uniform solution. Could not.

(Comparative Example 3)

A 500 ml separate flask equipped with a thermometer and a stirring blade was nitrogen-substituted, 29.10 g of DDS was injected, and 153 g of dehydrated and purified MMP was added thereto, followed by stirring at room temperature to dissolve the DDS. Thereafter, the flask was cooled with an ice bath and 36.36 g of ODPA was added when the temperature of the contents liquid reached 10 ° C. The ice bath was removed and stirring was continued at room temperature, resulting in a slightly grayish slurry that could not obtain a polyamic acid solution.                     

(Comparative Example 4)

A 500 ml separated flask equipped with a thermometer and a stirring blade was nitrogen-substituted, 10.56 g of 1,4-butanediol and 109 g of dehydrated and purified MMP were added thereto, and 36.36 g of ODPA was added while stirring at room temperature. It heated to 120 degreeC by the oil bath, stirred for 4 hours, and cooled. A 30 wt% solution of pale yellow transparent polyester was obtained. The rotational viscosity of this solution was 67.2 mPa * s. The weight average molecular weight measured by GPC was 15,000.

Subsequently, in a 500 ml nitrogen-removable flask equipped with a stirring blade, 100 g of the polyester solution, 30 g of Epicoat 191P (trade name; manufactured by Shell Chemicals Co., Ltd.), 16.95 g of trimellitic anhydride, 3-glycolic 3.85 g of cydoxipropyl trimethoxysilane and 172.4 g of dehydrated and purified MMP were added, and the mixture was stirred at room temperature to dissolve uniformly. Subsequently, 0.17 g of Byk-344 (brand name; product of BIC Chemie) was added, it stirred at room temperature for 1 hour, and it filtered with the membrane filter of 0.2 micrometer of pore diameters, and prepared the coating liquid. Evaluation similar to Example 1 was performed about this coating liquid. These evaluation results are shown in Table 1.

[Table 1]

Evaluation items
Example
Comparative example One 2 3 4 5 6 7 One 4  Foreign body characteristic, ㎛ 120 150 100 110 130 180 160 340 110  Transparency ○ ○ ○ ○ ○ ○ ○ ○ ○  Heat resistance ○ ○ ○ ○ ○ ○ ○ ○ ×  Chemical resistance ○ ○ ○ ○ ○ ○ ○ ○ ○  Flatness ○ ○ ○ ○ ○ ○ ○ ○ ○  Adhesion ○ ○ ○ ○ ○ ○ ○ ○ ○  Sputter resistance ○ ○ ○ ○ ○ ○ ○ ○ ×

As is clear from the results shown in Table 1, it is understood that the cured films of Examples 1 to 7 are small in foreign matter and balanced in all aspects of transparency, heat resistance, chemical resistance, flatness, adhesion, and sputter resistance. On the other hand, the coating liquid using the polyamic-acid solution which does not contain the ester group of the comparative example 1 is inferior in the point of a foreign material characteristic, and the fall of a yield is anticipated when used as a color filter protective film.

Since the cured film obtained from the thermosetting resin composition of this invention is also excellent in the characteristics as an optical material, such as sputter resistance and transparency, it is a protective film, such as various optical materials, such as a color filter, an LED light emitting element, and a light receiving element, and between TFT and a transparent electrode. And a transparent insulating film formed between the transparent electrode and the alignment film.

Claims (27)

As a resin composition containing the polyesteramic acid obtained by making tetracarboxylic dianhydride, a diamine, and a polyhydric hydroxy compound react as an essential component, an epoxy resin, an epoxy hardening | curing agent, and a solvent, The polyester amide acid is represented by the following formula (1) and formula (2): X mole tetracarboxylic dianhydride, Y mole diamine, and Z mole polyhydric hydroxy compound: 0.2 ≤ Z / Y ≤ 8.0 ... (1) 0.2 ≤ (Y + Z) / X ≤ 1.5 ... (2) Is obtained by reacting at a rate that The epoxy resin is 20-400 weight part with respect to 100 weight part of polyester amide acids, and the epoxy hardening | curing agent is 15-60 weight part with respect to 100 weight part of epoxy resins. The method of claim 1, A thermosetting resin composition, wherein the polyester amide acid is a reaction product obtained by reacting a tetracarboxylic dianhydride, a diamine, a polyhydric hydroxy compound, and a monohydric alcohol as essential components. The method of claim 1, Polyester amide acid is a reaction product obtained by reacting tetracarboxylic dianhydride, diamine, polyhydric hydroxy compound, monohydric alcohol, and silicone containing monoamine as an essential component, and said silicone containing monoamine is 3-aminopropyltrimethoxysilane. , 3-aminopropyltriethoxysilane, 3-aminopropylmethyldimethoxysilane, 3-aminopropylmethyldiethoxysilane, 4-aminobutyltrimethoxysilane, 4-aminobutyltriethoxysilane, 4-aminobutyl Methyldiethoxysilane, p-aminophenyltrimethoxysilane, p-aminophenyltriethoxysilane, p-aminophenylmethyldimethoxysilane, p-aminophenylmethyldiethoxysilane, m-aminophenyltrimethoxysilane, Or m-aminophenylmethyldiethoxysilane. The thermosetting resin composition characterized by the above-mentioned. 3. The method of claim 2, The monohydric alcohol is isopropyl alcohol, allyl alcohol, benzyl alcohol, hydroxyethyl methacrylate, propylene glycol monoethyl ether or 3-ethyl-3-hydroxymethyl oxetane. The method of claim 3, The monohydric alcohol is isopropyl alcohol, allyl alcohol, benzyl alcohol, hydroxyethyl methacrylate, propylene glycol monoethyl ether or 3-ethyl-3-hydroxymethyl oxetane. The method of claim 1, The polyester amide acid is a polyester amide acid obtained by further reacting a styrene-maleic anhydride copolymer. The method of claim 1, Thermosetting resin composition characterized in that the polyester amide acid is a compound having a structural unit represented by the following formula (3) and formula (4):

Wherein R ₁ is a tetracarboxylic dianhydride residue, R ₂ is a diamine residue, and R ₃ is a polyvalent hydroxy compound residue. 3. The method of claim 2, Thermosetting resin composition characterized in that the polyester amide acid is a compound having a structural unit represented by the following formula (3) and formula (4):

Wherein R ₁ is a tetracarboxylic dianhydride residue, R ₂ is a diamine residue, and R ₃ is a polyvalent hydroxy compound residue. The method of claim 3, Thermosetting resin composition characterized in that the polyester amide acid is a compound having a structural unit represented by the following formula (3) and formula (4):

Wherein R ₁ is a tetracarboxylic dianhydride residue, R ₂ is a diamine residue, and R ₃ is a polyvalent hydroxy compound residue. 5. The method of claim 4, Thermosetting resin composition characterized in that the polyester amide acid is a compound having a structural unit represented by the following formula (3) and formula (4):

Wherein R ₁ is a tetracarboxylic dianhydride residue, R ₂ is a diamine residue, and R ₃ is a polyvalent hydroxy compound residue. The method of claim 7, wherein The tetracarboxylic dianhydride is 3,3 ', 4,4'-diphenylsulfontetracarboxylic dianhydride, 3,3', 4,4'-diphenylethertetracarboxylic dianhydride, 2,2- (bis (3 And 4-dicarboxyphenyl)) hexafluoropropane dianhydride and at least one compound selected from ethylene glycol bis (anhydrotrimelitate). The method of claim 7, wherein And said diamine is at least one compound selected from 3,3'-diaminodiphenylsulfone and bis (4- (3-aminophenoxy) phenyl) sulfone. The method of claim 7, wherein The polyhydric hydroxy compound is selected from ethylene glycol, propylene glycol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,7-heptanediol, and 1,8-octanediol It is a compound more than species, The thermosetting resin composition characterized by the above-mentioned. The method of claim 7, wherein Epoxy resins are polyglycidyl methacrylate, methyl methacrylate-glycidyl methacrylate copolymer, benzyl methacrylate-glycidyl methacrylate copolymer, n-butyl methacrylate-glycidyl meta At least one compound selected from an epoxy group-containing polymer of a acrylate copolymer, a 2-hydroxyethyl methacrylate-glycidyl methacrylate copolymer, and a styrene-glycidyl methacrylate copolymer. Thermosetting resin composition. The method of claim 7, wherein The epoxy resin is an alicyclic epoxy resin, The thermosetting resin composition characterized by the above-mentioned. The method of claim 7, wherein The epoxy hardening | curing agent is trimellitic anhydride, The thermosetting resin composition characterized by the above-mentioned. The method of claim 7, wherein The said tetracarboxylic dianhydride is 3,3 ', 4,4'- diphenyl ether tetracarboxylic acid dianhydride, the said diamine is 3,3'- diamino diphenyl sulfone, and the said polyhydric hydroxy compound is 1, 4- It is a butanediol, Epoxy resin is n-butyl methacrylate- glycidyl methacrylate copolymer, Epoxy hardening | curing agent is trimellitic anhydride, and a solvent is a solvent containing methyl 3-methoxypropionate. Resin composition. The method of claim 8, The said tetracarboxylic dianhydride is 3,3 ', 4,4'- diphenyl ether tetracarboxylic acid dianhydride, the said diamine is 3,3'- diamino diphenyl sulfone, and the said polyhydric hydroxy compound is 1, 4- Butanediol, monohydric alcohol is benzyl alcohol, epoxy resin is n-butyl methacrylate-glycidyl methacrylate copolymer, epoxy curing agent is trimellitic anhydride, solvent contains methyl 3-methoxypropionate A thermosetting resin composition, characterized in that the solvent. The method of claim 1, The weight average molecular weight of the said polyester amide acid is 2,000-200,000, The thermosetting resin composition characterized by the above-mentioned. The method of claim 1, Thermosetting resin composition, characterized in that the weight average molecular weight of the epoxy resin is 10,000 ~ 1,000,000. The cured film obtained by heating the thermosetting resin composition of any one of Claims 1-20. The color filter which used the cured film of Claim 21 as a protective film. A liquid crystal display device using the color filter of claim 22. A solid-state image sensor using the color filter of claim 22. A liquid crystal display device using the cured film of claim 21 as a transparent insulating film formed between a TFT and a transparent electrode. A liquid crystal display device using the cured film of claim 21 as a transparent insulating film formed between a transparent electrode and an alignment film. LED light-emitting body which used the cured film of Claim 21 as a protective film.