JP2014148031A - 受渡位置教示方法、受渡位置教示装置および基板処理装置 - Google Patents
受渡位置教示方法、受渡位置教示装置および基板処理装置 Download PDFInfo
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Abstract
【解決手段】受渡位置教示装置は、基板処理装置により処理される半導体ウエハ等の基板と同一の形状を有し、その表面に導電性のコーティングがなされた教示用基板100を備える。また、受渡位置教示装置は、その上面に基準線21が形成され、その表面に絶縁コーティングがなされたベース部材20を有する。このベース部材20上には、各々、鉛直方向に延びる柱状の形状を有する入口用接点部材31、入口用接点部材32、Y方向用接点部材41、Y方向用接点部材42、X方向用接点部材51が立設されている。
【選択図】図2
Description
19 ハンド
20 ベース部材
21 基準線
24 制御部
25 受渡位置特定部
26 ロボット制御部
27 記憶部
28 入出力部
31 入り口用接点部材
32 入り口用接点部材
41 Y方向用接点部材
42 Y方向用接点部材
43 鍔部
44 鍔部
45 鍔部
46 鍔部
51 X方向用接点部材
53 鍔部
55 鍔部
61 当接部材
62 当接部材
70 ベース部材
81 接点部材
82 小径部
83 大径部
91 接点部材
92 小径部
100 教示用基板
101 教示用基板
102 教示用基板
103 教示用基板
Claims (11)
- 基板受渡部材に対して基板を受け渡すハンドに、基板の受渡位置を教示するための受渡位置教示方法であって、
前記ハンドにより、前記基板受渡部材に対して受け渡されるべき基板に代えて教示用基板を支持して搬送するときに、当該教示用基板との接触を検出するための検出部材を、前記基板受渡部材に対応する位置に配置する検出部材配置工程と、
前記ハンドにより前記教示用基板を支持する支持工程と、
前記教示用基板を支持したハンドを移動させる工程と、
前記ハンドにより支持されて移動する前記教示用基板が前記検出部材と接触した位置に基づいて、前記基板の受渡位置を特定して記憶する受渡位置特定工程と、
を備えたことを特徴とする受渡位置教示方法。 - 請求項1に記載の受渡位置教示方法において、
前記基板受渡部材は、複数の基板を積層状態で格納する基板格納用容器である受渡位置教示方法。 - 請求項2に記載の受渡位置教示方法において、
前記基板格納用容器における最上部の格納位置と、最下部の格納位置とに対して、基板の受渡位置を教示する受渡位置教示方法。 - 請求項1から請求項3のいずれかの受渡位置教示方法により受渡位置を教示されたハンドを備えた基板処理装置。
- 基板受渡部材に対して基板を受け渡すハンドに、基板の受渡位置を教示するための受渡位置教示装置であって、
前記基板受渡部材に対して受け渡されるべき基板に代えて前記ハンドに支持される教示用基板と、
前記基板受渡部材に対応する位置に配置され、前記教示用基板を前記ハンドにより搬送するときに、当該教示用基板との接触を検出するための検出部材と、
を備えたことを特徴とする受渡位置教示装置。 - 請求項5に記載の受渡位置教示装置において、
前記基板受渡部材は、複数の基板を積層状態で格納する基板格納用容器である受渡位置教示装置。 - 請求項6に記載の受渡位置教示装置において、
前記教示用基板および前記検出部材は導電性を有し、前記教示用基板と前記検出部材との間の通電により、前記教示用基板と前記検出部材との接触を検出する受渡位置教示装置。 - 請求項7に記載の受渡位置教示装置において、
前記検出部材は、
前記基板格納用容器の開口部の幅に対応して配設された一対のY方向用接点部材と、
前記基板格納用容器の開口部からの奥行きに対応して配置されたX方向用接点部材と、
から構成される受渡位置教示装置。 - 請求項8に記載の受渡位置教示装置において、
前記Y方向用接点部材と前記X方向用接点部材とは、鉛直方向に延びる柱状の形状を有するとともに、
前記Y方向用接点部材と前記X方向用接点部材とは、各々、前記基板格納用容器における最上部の格納位置と、最下部の格納位置とに対応する高さ位置に、前記教示用基板を支持するための鍔部を有する受渡位置教示装置。 - 請求項7に記載の受渡位置教示装置において、
前記教示用基板は、前記検出部材を挿入可能な穴部を有する受渡位置教示装置。 - 請求項5から請求項10のいずれかに記載の受渡位置教示装置と接続される基板処理装置であって、
前記ハンドを備える搬送ロボットの位置を制御する制御部と、
前記ハンドにより支持されて移動する前記教示用基板が前記検出部材と接触した位置に基づいて、前記基板の受渡位置を特定して記憶する受渡位置特定手段と、
を、備える基板処理装置。
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JP2013019312A JP6148025B2 (ja) | 2013-02-04 | 2013-02-04 | 受渡位置教示方法、受渡位置教示装置および基板処理装置 |
US14/087,331 US9238303B2 (en) | 2013-02-04 | 2013-11-22 | Transfer position teaching method, transfer position teaching apparatus and substrate processing apparatus |
TW102147732A TWI552842B (zh) | 2013-02-04 | 2013-12-23 | 交接位置教示方法、交接位置教示裝置及基板處理裝置 |
KR1020130167147A KR101588938B1 (ko) | 2013-02-04 | 2013-12-30 | 수도 위치 교시 방법, 수도 위치 교시 장치 및 기판 처리 장치 |
CN201410001239.0A CN103972137B (zh) | 2013-02-04 | 2014-01-02 | 交接位置示教方法、交接位置示教装置及基板处理装置 |
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TW (1) | TWI552842B (ja) |
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KR20160131201A (ko) * | 2015-05-06 | 2016-11-16 | 에스케이하이닉스 주식회사 | 반도체 장치 제조 설비를 위한 로봇 제어 시스템 및 방법, 이를 위한 컴퓨터 프로그램 |
KR20170082615A (ko) * | 2014-11-10 | 2017-07-14 | 브룩스 오토메이션 인코퍼레이티드 | 툴 자동-교시 방법 및 장치 |
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Also Published As
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CN103972137A (zh) | 2014-08-06 |
US9238303B2 (en) | 2016-01-19 |
TW201436963A (zh) | 2014-10-01 |
CN103972137B (zh) | 2017-04-12 |
KR101588938B1 (ko) | 2016-01-26 |
KR20140099816A (ko) | 2014-08-13 |
TWI552842B (zh) | 2016-10-11 |
JP6148025B2 (ja) | 2017-06-14 |
US20140222202A1 (en) | 2014-08-07 |
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