JP2014130881A - 研磨装置 - Google Patents

研磨装置 Download PDF

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Publication number
JP2014130881A
JP2014130881A JP2012287119A JP2012287119A JP2014130881A JP 2014130881 A JP2014130881 A JP 2014130881A JP 2012287119 A JP2012287119 A JP 2012287119A JP 2012287119 A JP2012287119 A JP 2012287119A JP 2014130881 A JP2014130881 A JP 2014130881A
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JP
Japan
Prior art keywords
gas
pure water
dissolved
unit
cleaning
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012287119A
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English (en)
Japanese (ja)
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JP2014130881A5 (https=
Inventor
Tomoatsu Ishibashi
知淳 石橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2012287119A priority Critical patent/JP2014130881A/ja
Priority to KR1020130157709A priority patent/KR101604519B1/ko
Priority to US14/139,764 priority patent/US9162337B2/en
Priority to TW102147895A priority patent/TWI564112B/zh
Publication of JP2014130881A publication Critical patent/JP2014130881A/ja
Publication of JP2014130881A5 publication Critical patent/JP2014130881A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2012287119A 2012-12-28 2012-12-28 研磨装置 Pending JP2014130881A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012287119A JP2014130881A (ja) 2012-12-28 2012-12-28 研磨装置
KR1020130157709A KR101604519B1 (ko) 2012-12-28 2013-12-18 연마 장치
US14/139,764 US9162337B2 (en) 2012-12-28 2013-12-23 Polishing apparatus
TW102147895A TWI564112B (zh) 2012-12-28 2013-12-24 研磨裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012287119A JP2014130881A (ja) 2012-12-28 2012-12-28 研磨装置

Publications (2)

Publication Number Publication Date
JP2014130881A true JP2014130881A (ja) 2014-07-10
JP2014130881A5 JP2014130881A5 (https=) 2015-12-03

Family

ID=51017685

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012287119A Pending JP2014130881A (ja) 2012-12-28 2012-12-28 研磨装置

Country Status (4)

Country Link
US (1) US9162337B2 (https=)
JP (1) JP2014130881A (https=)
KR (1) KR101604519B1 (https=)
TW (1) TWI564112B (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016049612A (ja) * 2014-09-01 2016-04-11 株式会社荏原製作所 研磨方法および研磨装置
CN108818278A (zh) * 2018-06-25 2018-11-16 浙江铁流离合器股份有限公司 一种机械联动式的可调型离合器摩擦片抛光装置
CN111975471A (zh) * 2020-08-19 2020-11-24 蚌埠知博自动化技术开发有限公司 一种金属材料表面处理的超声波表面强化处理设备

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10058975B2 (en) 2016-02-12 2018-08-28 Applied Materials, Inc. In-situ temperature control during chemical mechanical polishing with a condensed gas
US9962805B2 (en) * 2016-04-22 2018-05-08 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical polishing apparatus and method
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
JP7287987B2 (ja) 2018-06-27 2023-06-06 アプライド マテリアルズ インコーポレイテッド 化学機械研磨の温度制御
TWI838459B (zh) 2019-02-20 2024-04-11 美商應用材料股份有限公司 化學機械拋光裝置及化學機械拋光方法
TWI859239B (zh) 2019-05-29 2024-10-21 美商應用材料股份有限公司 用於化學機械研磨系統的蒸氣處置站的設備及方法
US11633833B2 (en) 2019-05-29 2023-04-25 Applied Materials, Inc. Use of steam for pre-heating of CMP components
US11628478B2 (en) 2019-05-29 2023-04-18 Applied Materials, Inc. Steam cleaning of CMP components
TWI872101B (zh) 2019-08-13 2025-02-11 美商應用材料股份有限公司 Cmp溫度控制的裝置及方法
US11897079B2 (en) 2019-08-13 2024-02-13 Applied Materials, Inc. Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity
CN115103738A (zh) 2020-06-29 2022-09-23 应用材料公司 Cmp中的温度和浆体流动速率控制
KR102905650B1 (ko) 2020-06-29 2025-12-30 어플라이드 머티어리얼스, 인코포레이티드 화학 기계적 연마를 위한 스팀 생성의 제어
KR20250004369A (ko) 2020-06-30 2025-01-07 어플라이드 머티어리얼스, 인코포레이티드 Cmp 온도 제어를 위한 장치 및 방법
US11577358B2 (en) 2020-06-30 2023-02-14 Applied Materials, Inc. Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing
TWI861570B (zh) 2022-06-06 2024-11-11 美商應用材料股份有限公司 凝結氣體墊調節器

Citations (8)

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JPH08255774A (ja) * 1995-03-16 1996-10-01 Sony Corp 化学的機械研磨方法および化学的機械研磨装置
JPH10323631A (ja) * 1997-05-23 1998-12-08 Ebara Corp 洗浄部材のセルフクリーニング装置
JPH1199382A (ja) * 1997-09-29 1999-04-13 Fron Tec:Kk 純水供給システム及び洗浄装置
JP2001015466A (ja) * 1999-06-16 2001-01-19 Samsung Electronics Co Ltd 化学機械的研磨装置及び研磨ヘッド内部の汚染物質洗浄方法
JP2004296463A (ja) * 2003-03-25 2004-10-21 Mitsubishi Electric Corp 洗浄方法および洗浄装置
JP2005012238A (ja) * 2004-09-02 2005-01-13 Ebara Corp 基板洗浄方法及び装置
JP2006272549A (ja) * 1999-05-17 2006-10-12 Ebara Corp ドレッシング装置
JP2008302478A (ja) * 2007-06-08 2008-12-18 Tokyo Seimitsu Co Ltd 研磨ヘッドの洗浄装置及び洗浄方法

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US5607718A (en) 1993-03-26 1997-03-04 Kabushiki Kaisha Toshiba Polishing method and polishing apparatus
US5384989A (en) 1993-04-12 1995-01-31 Shibano; Yoshihide Method of ultrasonically grinding workpiece
US5885134A (en) * 1996-04-18 1999-03-23 Ebara Corporation Polishing apparatus
JP3696690B2 (ja) * 1996-04-23 2005-09-21 不二越機械工業株式会社 ウェーハの研磨装置システム
US5888124A (en) * 1997-09-26 1999-03-30 Vanguard International Semiconductor Corporation Apparatus for polishing and cleaning a wafer
US6227944B1 (en) * 1999-03-25 2001-05-08 Memc Electronics Materials, Inc. Method for processing a semiconductor wafer
US6358119B1 (en) * 1999-06-21 2002-03-19 Taiwan Semiconductor Manufacturing Company Way to remove CU line damage after CU CMP
JP2001038614A (ja) * 1999-07-26 2001-02-13 Ebara Corp 研磨装置
JP2001113455A (ja) * 1999-10-14 2001-04-24 Sony Corp 化学的機械研磨装置及び方法
JP2002052370A (ja) * 2000-08-09 2002-02-19 Ebara Corp 基板洗浄装置
US6811805B2 (en) * 2001-05-30 2004-11-02 Novatis Ag Method for applying a coating
JP2004273961A (ja) * 2003-03-12 2004-09-30 Ebara Corp 金属配線形成基板の洗浄処理装置
WO2004112093A2 (en) * 2003-06-06 2004-12-23 P.C.T. Systems, Inc. Method and apparatus to process substrates with megasonic energy
KR101110905B1 (ko) * 2003-06-11 2012-02-20 아크리온 테크놀로지즈 인코포레이티드 과포화된 세정 용액을 사용한 메가소닉 세정
TWI340060B (en) * 2003-11-20 2011-04-11 Doi Toshiro Polishing apparatus and method of polishing work piece
TWI352645B (en) * 2004-05-28 2011-11-21 Ebara Corp Apparatus for inspecting and polishing substrate r
JP2007290111A (ja) * 2006-03-29 2007-11-08 Ebara Corp 研磨方法および研磨装置
WO2008097627A1 (en) * 2007-02-07 2008-08-14 Tbw Industries, Inc. Cleaning cup system for chemical mechanical planarization apparatus
SG148960A1 (en) * 2007-06-15 2009-01-29 Tokyo Electron Ltd Substrate cleaning method and substrate cleaning apparatus
CN101827686B (zh) * 2008-07-03 2013-07-17 旭硝子株式会社 研磨玻璃衬底的方法、制造玻璃衬底的方法和制造磁盘用玻璃衬底的方法
JP4532580B2 (ja) * 2008-08-20 2010-08-25 株式会社カイジョー 超音波洗浄装置
JP2010234298A (ja) * 2009-03-31 2010-10-21 Kurita Water Ind Ltd ガス溶解水供給装置及びガス溶解水の製造方法
US20100291841A1 (en) * 2009-05-14 2010-11-18 Chien-Min Sung Methods and Systems for Water Jet Assisted CMP Processing
JP5585076B2 (ja) * 2009-12-24 2014-09-10 栗田工業株式会社 洗浄方法
JP5866227B2 (ja) * 2012-02-23 2016-02-17 株式会社荏原製作所 基板洗浄方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08255774A (ja) * 1995-03-16 1996-10-01 Sony Corp 化学的機械研磨方法および化学的機械研磨装置
JPH10323631A (ja) * 1997-05-23 1998-12-08 Ebara Corp 洗浄部材のセルフクリーニング装置
JPH1199382A (ja) * 1997-09-29 1999-04-13 Fron Tec:Kk 純水供給システム及び洗浄装置
JP2006272549A (ja) * 1999-05-17 2006-10-12 Ebara Corp ドレッシング装置
JP2001015466A (ja) * 1999-06-16 2001-01-19 Samsung Electronics Co Ltd 化学機械的研磨装置及び研磨ヘッド内部の汚染物質洗浄方法
JP2004296463A (ja) * 2003-03-25 2004-10-21 Mitsubishi Electric Corp 洗浄方法および洗浄装置
JP2005012238A (ja) * 2004-09-02 2005-01-13 Ebara Corp 基板洗浄方法及び装置
JP2008302478A (ja) * 2007-06-08 2008-12-18 Tokyo Seimitsu Co Ltd 研磨ヘッドの洗浄装置及び洗浄方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016049612A (ja) * 2014-09-01 2016-04-11 株式会社荏原製作所 研磨方法および研磨装置
CN108818278A (zh) * 2018-06-25 2018-11-16 浙江铁流离合器股份有限公司 一种机械联动式的可调型离合器摩擦片抛光装置
CN111975471A (zh) * 2020-08-19 2020-11-24 蚌埠知博自动化技术开发有限公司 一种金属材料表面处理的超声波表面强化处理设备

Also Published As

Publication number Publication date
KR20140086839A (ko) 2014-07-08
US20140187122A1 (en) 2014-07-03
US9162337B2 (en) 2015-10-20
KR101604519B1 (ko) 2016-03-17
TW201436946A (zh) 2014-10-01
TWI564112B (zh) 2017-01-01

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