KR101604519B1 - 연마 장치 - Google Patents

연마 장치 Download PDF

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Publication number
KR101604519B1
KR101604519B1 KR1020130157709A KR20130157709A KR101604519B1 KR 101604519 B1 KR101604519 B1 KR 101604519B1 KR 1020130157709 A KR1020130157709 A KR 1020130157709A KR 20130157709 A KR20130157709 A KR 20130157709A KR 101604519 B1 KR101604519 B1 KR 101604519B1
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South Korea
Prior art keywords
gas
polishing
cleaning
unit
pure water
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KR1020130157709A
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Korean (ko)
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KR20140086839A (ko
Inventor
도모아츠 이시바시
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020130157709A 2012-12-28 2013-12-18 연마 장치 Active KR101604519B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-287119 2012-12-28
JP2012287119A JP2014130881A (ja) 2012-12-28 2012-12-28 研磨装置

Publications (2)

Publication Number Publication Date
KR20140086839A KR20140086839A (ko) 2014-07-08
KR101604519B1 true KR101604519B1 (ko) 2016-03-17

Family

ID=51017685

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130157709A Active KR101604519B1 (ko) 2012-12-28 2013-12-18 연마 장치

Country Status (4)

Country Link
US (1) US9162337B2 (https=)
JP (1) JP2014130881A (https=)
KR (1) KR101604519B1 (https=)
TW (1) TWI564112B (https=)

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JP6587379B2 (ja) * 2014-09-01 2019-10-09 株式会社荏原製作所 研磨装置
US10058975B2 (en) 2016-02-12 2018-08-28 Applied Materials, Inc. In-situ temperature control during chemical mechanical polishing with a condensed gas
US9962805B2 (en) * 2016-04-22 2018-05-08 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical polishing apparatus and method
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
CN108818278B (zh) * 2018-06-25 2020-05-19 浙江铁流离合器股份有限公司 一种机械联动式的可调型离合器摩擦片抛光装置
JP7287987B2 (ja) 2018-06-27 2023-06-06 アプライド マテリアルズ インコーポレイテッド 化学機械研磨の温度制御
TWI838459B (zh) 2019-02-20 2024-04-11 美商應用材料股份有限公司 化學機械拋光裝置及化學機械拋光方法
TWI859239B (zh) 2019-05-29 2024-10-21 美商應用材料股份有限公司 用於化學機械研磨系統的蒸氣處置站的設備及方法
US11633833B2 (en) 2019-05-29 2023-04-25 Applied Materials, Inc. Use of steam for pre-heating of CMP components
US11628478B2 (en) 2019-05-29 2023-04-18 Applied Materials, Inc. Steam cleaning of CMP components
TWI872101B (zh) 2019-08-13 2025-02-11 美商應用材料股份有限公司 Cmp溫度控制的裝置及方法
US11897079B2 (en) 2019-08-13 2024-02-13 Applied Materials, Inc. Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity
CN115103738A (zh) 2020-06-29 2022-09-23 应用材料公司 Cmp中的温度和浆体流动速率控制
KR102905650B1 (ko) 2020-06-29 2025-12-30 어플라이드 머티어리얼스, 인코포레이티드 화학 기계적 연마를 위한 스팀 생성의 제어
KR20250004369A (ko) 2020-06-30 2025-01-07 어플라이드 머티어리얼스, 인코포레이티드 Cmp 온도 제어를 위한 장치 및 방법
US11577358B2 (en) 2020-06-30 2023-02-14 Applied Materials, Inc. Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing
CN111975471A (zh) * 2020-08-19 2020-11-24 蚌埠知博自动化技术开发有限公司 一种金属材料表面处理的超声波表面强化处理设备
TWI861570B (zh) 2022-06-06 2024-11-11 美商應用材料股份有限公司 凝結氣體墊調節器

Citations (2)

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US5607718A (en) 1993-03-26 1997-03-04 Kabushiki Kaisha Toshiba Polishing method and polishing apparatus
US5746646A (en) 1993-04-12 1998-05-05 Shibano; Yoshihide Method of ultrasonically grinding workpiece

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JP3438388B2 (ja) * 1995-03-16 2003-08-18 ソニー株式会社 化学的機械研磨方法および化学的機械研磨装置
US5885134A (en) * 1996-04-18 1999-03-23 Ebara Corporation Polishing apparatus
JP3696690B2 (ja) * 1996-04-23 2005-09-21 不二越機械工業株式会社 ウェーハの研磨装置システム
JPH10323631A (ja) * 1997-05-23 1998-12-08 Ebara Corp 洗浄部材のセルフクリーニング装置
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US6358119B1 (en) * 1999-06-21 2002-03-19 Taiwan Semiconductor Manufacturing Company Way to remove CU line damage after CU CMP
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TWI340060B (en) * 2003-11-20 2011-04-11 Doi Toshiro Polishing apparatus and method of polishing work piece
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CN101827686B (zh) * 2008-07-03 2013-07-17 旭硝子株式会社 研磨玻璃衬底的方法、制造玻璃衬底的方法和制造磁盘用玻璃衬底的方法
JP4532580B2 (ja) * 2008-08-20 2010-08-25 株式会社カイジョー 超音波洗浄装置
JP2010234298A (ja) * 2009-03-31 2010-10-21 Kurita Water Ind Ltd ガス溶解水供給装置及びガス溶解水の製造方法
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Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5607718A (en) 1993-03-26 1997-03-04 Kabushiki Kaisha Toshiba Polishing method and polishing apparatus
US5746646A (en) 1993-04-12 1998-05-05 Shibano; Yoshihide Method of ultrasonically grinding workpiece

Also Published As

Publication number Publication date
KR20140086839A (ko) 2014-07-08
US20140187122A1 (en) 2014-07-03
US9162337B2 (en) 2015-10-20
JP2014130881A (ja) 2014-07-10
TW201436946A (zh) 2014-10-01
TWI564112B (zh) 2017-01-01

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