JP2014068015A - バンプ構造体、電気的接続構造体、及びその形成方法 - Google Patents

バンプ構造体、電気的接続構造体、及びその形成方法 Download PDF

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Publication number
JP2014068015A
JP2014068015A JP2013197965A JP2013197965A JP2014068015A JP 2014068015 A JP2014068015 A JP 2014068015A JP 2013197965 A JP2013197965 A JP 2013197965A JP 2013197965 A JP2013197965 A JP 2013197965A JP 2014068015 A JP2014068015 A JP 2014068015A
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Prior art keywords
layer
extension
pad
structure according
bump structure
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JP2013197965A
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Japanese (ja)
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JP2014068015A5 (enExample
Inventor
Moon Gi Cho
文祺 趙
Young Lyong Kim
泳竜 金
Sun-Hee Park
善▲姫▼ 朴
Hwan-Sik Lim
桓植 林
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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Publication of JP2014068015A publication Critical patent/JP2014068015A/ja
Publication of JP2014068015A5 publication Critical patent/JP2014068015A5/ja
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    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP2013197965A 2012-09-25 2013-09-25 バンプ構造体、電気的接続構造体、及びその形成方法 Pending JP2014068015A (ja)

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JP2015228472A (ja) * 2014-06-03 2015-12-17 株式会社ソシオネクスト 半導体装置およびその製造方法
KR20160055071A (ko) * 2014-11-07 2016-05-17 르네사스 일렉트로닉스 가부시키가이샤 반도체 장치의 제조 방법
KR20160101866A (ko) * 2015-02-18 2016-08-26 르네사스 일렉트로닉스 가부시키가이샤 반도체 장치 및 그 제조 방법

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CN108598178B (zh) * 2015-01-19 2020-12-04 苏州固锝电子股份有限公司 微电子器件用整流芯片
KR102450326B1 (ko) * 2015-10-06 2022-10-05 삼성전자주식회사 반도체 칩, 이의 제조방법, 및 이를 포함하는 반도체 패키지
KR20180136148A (ko) * 2017-06-14 2018-12-24 에스케이하이닉스 주식회사 범프를 구비하는 반도체 장치
TWI736695B (zh) * 2017-10-24 2021-08-21 啟耀光電股份有限公司 電子裝置與其製造方法
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