JP2014068015A - バンプ構造体、電気的接続構造体、及びその形成方法 - Google Patents

バンプ構造体、電気的接続構造体、及びその形成方法 Download PDF

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Publication number
JP2014068015A
JP2014068015A JP2013197965A JP2013197965A JP2014068015A JP 2014068015 A JP2014068015 A JP 2014068015A JP 2013197965 A JP2013197965 A JP 2013197965A JP 2013197965 A JP2013197965 A JP 2013197965A JP 2014068015 A JP2014068015 A JP 2014068015A
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JP
Japan
Prior art keywords
layer
extension
pad
structure according
bump structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013197965A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014068015A5 (enExample
Inventor
Moon Gi Cho
文祺 趙
Young Lyong Kim
泳竜 金
Sun-Hee Park
善▲姫▼ 朴
Hwan-Sik Lim
桓植 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of JP2014068015A publication Critical patent/JP2014068015A/ja
Publication of JP2014068015A5 publication Critical patent/JP2014068015A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/00—
    • H10W72/20—
    • H10W90/701—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H10W70/60—
    • H10W70/65—
    • H10W72/01235—
    • H10W72/01255—
    • H10W72/01257—
    • H10W72/01938—
    • H10W72/01971—
    • H10W72/072—
    • H10W72/07254—
    • H10W72/221—
    • H10W72/222—
    • H10W72/232—
    • H10W72/234—
    • H10W72/241—
    • H10W72/244—
    • H10W72/248—
    • H10W72/252—
    • H10W72/285—
    • H10W72/287—
    • H10W72/29—
    • H10W72/922—
    • H10W72/923—
    • H10W72/941—
    • H10W72/9415—
    • H10W72/942—
    • H10W72/944—
    • H10W72/952—
    • H10W74/00—
    • H10W90/722—
    • H10W90/724—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP2013197965A 2012-09-25 2013-09-25 バンプ構造体、電気的接続構造体、及びその形成方法 Pending JP2014068015A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2012-0106710 2012-09-25
KR1020120106710A KR20140041975A (ko) 2012-09-25 2012-09-25 범프 구조체 및 이를 포함하는 전기적 연결 구조체

Publications (2)

Publication Number Publication Date
JP2014068015A true JP2014068015A (ja) 2014-04-17
JP2014068015A5 JP2014068015A5 (enExample) 2016-11-10

Family

ID=50318664

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013197965A Pending JP2014068015A (ja) 2012-09-25 2013-09-25 バンプ構造体、電気的接続構造体、及びその形成方法

Country Status (4)

Country Link
US (1) US9312213B2 (enExample)
JP (1) JP2014068015A (enExample)
KR (1) KR20140041975A (enExample)
CN (1) CN103681556B (enExample)

Cited By (3)

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JP2015228472A (ja) * 2014-06-03 2015-12-17 株式会社ソシオネクスト 半導体装置およびその製造方法
KR20160055071A (ko) * 2014-11-07 2016-05-17 르네사스 일렉트로닉스 가부시키가이샤 반도체 장치의 제조 방법
KR20160101866A (ko) * 2015-02-18 2016-08-26 르네사스 일렉트로닉스 가부시키가이샤 반도체 장치 및 그 제조 방법

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CN108598178B (zh) * 2015-01-19 2020-12-04 苏州固锝电子股份有限公司 微电子器件用整流芯片
KR102450326B1 (ko) * 2015-10-06 2022-10-05 삼성전자주식회사 반도체 칩, 이의 제조방법, 및 이를 포함하는 반도체 패키지
KR20180136148A (ko) * 2017-06-14 2018-12-24 에스케이하이닉스 주식회사 범프를 구비하는 반도체 장치
TWI736695B (zh) * 2017-10-24 2021-08-21 啟耀光電股份有限公司 電子裝置與其製造方法
WO2019242752A1 (zh) * 2018-06-21 2019-12-26 矽创电子股份有限公司 凸块结构
US11166381B2 (en) 2018-09-25 2021-11-02 International Business Machines Corporation Solder-pinning metal pads for electronic components
CN109877411A (zh) * 2019-04-10 2019-06-14 中国电子科技集团公司第十三研究所 无助焊剂的微电路焊接组装方法
CN110418510A (zh) * 2019-07-15 2019-11-05 宁波华远电子科技有限公司 一种开放性电镀凸台的制作方法
KR20230045322A (ko) * 2021-09-28 2023-04-04 삼성전자주식회사 반도체 패키지
CN114189981B (zh) * 2021-12-17 2023-07-28 浪潮(山东)计算机科技有限公司 一种pcb板上连接器焊盘及反焊盘
US12224222B2 (en) * 2022-01-11 2025-02-11 Infineon Technologies Ag Semiconductor package having a thermally and electrically conductive spacer
US12183708B2 (en) 2022-01-31 2024-12-31 International Business Machines Corporation Double resist structure for electrodeposition bonding
US12354983B2 (en) * 2022-03-30 2025-07-08 International Business Machines Corporation Fine-pitch joining pad structure

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JPS6338328U (enExample) * 1986-08-28 1988-03-11
JPH11102926A (ja) * 1997-07-25 1999-04-13 Mcnc はんだ突起の体積を増大させるための制御された形状のはんだ溜とそれにより形成される構造体
JP2003179183A (ja) * 1999-10-29 2003-06-27 Hitachi Ltd 半導体装置およびその製造方法
JP2007251145A (ja) * 2006-03-17 2007-09-27 Hynix Semiconductor Inc 積層パッケージ
JP2007295010A (ja) * 2007-08-02 2007-11-08 Fujikura Ltd 半導体パッケージおよび半導体パッケージの製造方法
JP2009147220A (ja) * 2007-12-17 2009-07-02 Toshiba Corp 半導体装置の製造方法及び半導体装置
JP2010225851A (ja) * 2009-03-24 2010-10-07 Tamura Seisakusho Co Ltd はんだ堆積制御用基板

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DE69628161T2 (de) 1995-04-05 2004-03-25 Unitive International Ltd. Eine löthöckerstruktur für ein mikroelektronisches substrat
US5902686A (en) 1996-11-21 1999-05-11 Mcnc Methods for forming an intermetallic region between a solder bump and an under bump metallurgy layer and related structures
JP3446826B2 (ja) * 2000-04-06 2003-09-16 沖電気工業株式会社 半導体装置及びその製造方法
US6818545B2 (en) * 2001-03-05 2004-11-16 Megic Corporation Low fabrication cost, fine pitch and high reliability solder bump
JP2007073681A (ja) 2005-09-06 2007-03-22 Renesas Technology Corp 半導体装置およびその製造方法
JP4577690B2 (ja) * 2005-09-29 2010-11-10 エルピーダメモリ株式会社 半導体装置
JP4708148B2 (ja) 2005-10-07 2011-06-22 ルネサスエレクトロニクス株式会社 半導体装置
US7674701B2 (en) 2006-02-08 2010-03-09 Amkor Technology, Inc. Methods of forming metal layers using multi-layer lift-off patterns
DE102006028811A1 (de) 2006-06-21 2007-12-27 Qimonda Ag Verfahren zum Aufbringen von Lot auf Umverdrahtungsleitungen
US20080093749A1 (en) * 2006-10-20 2008-04-24 Texas Instruments Incorporated Partial Solder Mask Defined Pad Design
CN103208435B (zh) 2008-06-12 2016-01-20 三菱综合材料株式会社 使用锡焊膏进行的基板与焊件的接合方法
CN101728346A (zh) * 2008-10-10 2010-06-09 瀚宇彩晶股份有限公司 凸块结构及其制作方法
JP5249080B2 (ja) 2009-02-19 2013-07-31 セイコーインスツル株式会社 半導体装置
US9035459B2 (en) * 2009-04-10 2015-05-19 International Business Machines Corporation Structures for improving current carrying capability of interconnects and methods of fabricating the same
US8546254B2 (en) 2010-08-19 2013-10-01 Taiwan Semiconductor Manufacturing Company, Ltd. Mechanisms for forming copper pillar bumps using patterned anodes
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KR101782503B1 (ko) 2011-05-18 2017-09-28 삼성전자 주식회사 솔더 범프 붕괴를 억제하는 반도체 소자의 범프 형성방법

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JPS6338328U (enExample) * 1986-08-28 1988-03-11
JPH11102926A (ja) * 1997-07-25 1999-04-13 Mcnc はんだ突起の体積を増大させるための制御された形状のはんだ溜とそれにより形成される構造体
JP2003179183A (ja) * 1999-10-29 2003-06-27 Hitachi Ltd 半導体装置およびその製造方法
JP2007251145A (ja) * 2006-03-17 2007-09-27 Hynix Semiconductor Inc 積層パッケージ
JP2007295010A (ja) * 2007-08-02 2007-11-08 Fujikura Ltd 半導体パッケージおよび半導体パッケージの製造方法
JP2009147220A (ja) * 2007-12-17 2009-07-02 Toshiba Corp 半導体装置の製造方法及び半導体装置
JP2010225851A (ja) * 2009-03-24 2010-10-07 Tamura Seisakusho Co Ltd はんだ堆積制御用基板

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015228472A (ja) * 2014-06-03 2015-12-17 株式会社ソシオネクスト 半導体装置およびその製造方法
KR20160055071A (ko) * 2014-11-07 2016-05-17 르네사스 일렉트로닉스 가부시키가이샤 반도체 장치의 제조 방법
JP2016092305A (ja) * 2014-11-07 2016-05-23 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US10128129B2 (en) 2014-11-07 2018-11-13 Renesas Electronics Corporation Method of manufacturing semiconductor device
KR102343105B1 (ko) 2014-11-07 2021-12-24 르네사스 일렉트로닉스 가부시키가이샤 반도체 장치의 제조 방법
KR20160101866A (ko) * 2015-02-18 2016-08-26 르네사스 일렉트로닉스 가부시키가이샤 반도체 장치 및 그 제조 방법
KR102508909B1 (ko) * 2015-02-18 2023-03-13 르네사스 일렉트로닉스 가부시키가이샤 반도체 장치 및 그 제조 방법

Also Published As

Publication number Publication date
CN103681556B (zh) 2018-06-08
CN103681556A (zh) 2014-03-26
US9312213B2 (en) 2016-04-12
US20140084457A1 (en) 2014-03-27
KR20140041975A (ko) 2014-04-07

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