JP2014054718A - 電子装置 - Google Patents

電子装置 Download PDF

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Publication number
JP2014054718A
JP2014054718A JP2012202374A JP2012202374A JP2014054718A JP 2014054718 A JP2014054718 A JP 2014054718A JP 2012202374 A JP2012202374 A JP 2012202374A JP 2012202374 A JP2012202374 A JP 2012202374A JP 2014054718 A JP2014054718 A JP 2014054718A
Authority
JP
Japan
Prior art keywords
electronic device
semiconductor
chip
mems
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2012202374A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014054718A5 (enExample
Inventor
Masaya Watanabe
賢哉 渡辺
Norio Okuyama
規生 奥山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2012202374A priority Critical patent/JP2014054718A/ja
Priority to CN201310397636.XA priority patent/CN103663348A/zh
Priority to US14/018,731 priority patent/US9437584B2/en
Publication of JP2014054718A publication Critical patent/JP2014054718A/ja
Publication of JP2014054718A5 publication Critical patent/JP2014054718A5/ja
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/00238—Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/041—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass H10F
    • H01L25/043—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/117—Stacked arrangements of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
    • B81C2203/0785—Transfer and j oin technology, i.e. forming the electronic processing unit and the micromechanical structure on separate substrates and joining the substrates
    • B81C2203/0792—Forming interconnections between the electronic processing unit and the micromechanical structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
JP2012202374A 2012-09-14 2012-09-14 電子装置 Withdrawn JP2014054718A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012202374A JP2014054718A (ja) 2012-09-14 2012-09-14 電子装置
CN201310397636.XA CN103663348A (zh) 2012-09-14 2013-09-04 电子装置
US14/018,731 US9437584B2 (en) 2012-09-14 2013-09-05 Electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012202374A JP2014054718A (ja) 2012-09-14 2012-09-14 電子装置

Publications (2)

Publication Number Publication Date
JP2014054718A true JP2014054718A (ja) 2014-03-27
JP2014054718A5 JP2014054718A5 (enExample) 2014-05-08

Family

ID=50273639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012202374A Withdrawn JP2014054718A (ja) 2012-09-14 2012-09-14 電子装置

Country Status (3)

Country Link
US (1) US9437584B2 (enExample)
JP (1) JP2014054718A (enExample)
CN (1) CN103663348A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6041953B1 (ja) * 2015-07-21 2016-12-14 オキンス エレクトロニクス カンパニー リミテッド 接触性が改善されたバンプを含むテストソケット用ｍｅｍｓフィルム
KR20170072216A (ko) * 2014-10-23 2017-06-26 로베르트 보쉬 게엠베하 다수의 기판을 포함하는 마이크로 전자 부품 조립체, 및 상응하는 제조 방법
JP2021168451A (ja) * 2020-04-10 2021-10-21 セイコーエプソン株式会社 振動デバイス、電子機器および移動体

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102534734B1 (ko) 2018-09-03 2023-05-19 삼성전자 주식회사 반도체 패키지

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005153067A (ja) * 2003-11-25 2005-06-16 Kyocera Corp 電子部品封止用基板およびそれを用いた電子装置の製造方法
JP2005335022A (ja) * 2004-05-28 2005-12-08 Sony Corp 微小デバイス及び電子機器
JP2006245311A (ja) * 2005-03-03 2006-09-14 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
JP2008053708A (ja) * 2006-08-23 2008-03-06 Dongbu Hitek Co Ltd 半導体素子及びその製造方法
US20080083975A1 (en) * 2006-10-09 2008-04-10 Taiwan Semiconductor Manufacturing Co., Ltd. Stacked structures and methods of fabricating stacked structures
JP2008229833A (ja) * 2007-02-22 2008-10-02 Denso Corp 半導体装置およびその製造方法
US20090194829A1 (en) * 2008-01-31 2009-08-06 Shine Chung MEMS Packaging Including Integrated Circuit Dies
WO2010047228A1 (ja) * 2008-10-21 2010-04-29 日本電気株式会社 配線基板およびその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7297574B2 (en) * 2005-06-17 2007-11-20 Infineon Technologies Ag Multi-chip device and method for producing a multi-chip device
US8022554B2 (en) 2006-06-15 2011-09-20 Sitime Corporation Stacked die package for MEMS resonator system
US7807583B2 (en) 2006-08-25 2010-10-05 Imec High aspect ratio via etch
JP5276289B2 (ja) 2006-08-25 2013-08-28 アイメック 高アスペクト比ビアエッチング
KR100834826B1 (ko) 2007-01-25 2008-06-03 삼성전자주식회사 취급손상을 줄인 집적회로 모듈의 구조 및 모듈의 종단저항 배치방법
JP2008288384A (ja) 2007-05-17 2008-11-27 Sony Corp ３次元積層デバイスとその製造方法、及び３次元積層デバイスの接合方法
KR100891805B1 (ko) 2007-05-25 2009-04-07 주식회사 네패스 웨이퍼 레벨 시스템 인 패키지 및 그 제조 방법
JP4825778B2 (ja) 2007-11-16 2011-11-30 株式会社日立製作所 半導体装置およびその製造方法
JP2010112763A (ja) 2008-11-04 2010-05-20 Toshiba Corp 半導体装置およびその製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005153067A (ja) * 2003-11-25 2005-06-16 Kyocera Corp 電子部品封止用基板およびそれを用いた電子装置の製造方法
JP2005335022A (ja) * 2004-05-28 2005-12-08 Sony Corp 微小デバイス及び電子機器
JP2006245311A (ja) * 2005-03-03 2006-09-14 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
JP2008053708A (ja) * 2006-08-23 2008-03-06 Dongbu Hitek Co Ltd 半導体素子及びその製造方法
US20080083975A1 (en) * 2006-10-09 2008-04-10 Taiwan Semiconductor Manufacturing Co., Ltd. Stacked structures and methods of fabricating stacked structures
JP2008229833A (ja) * 2007-02-22 2008-10-02 Denso Corp 半導体装置およびその製造方法
US20090194829A1 (en) * 2008-01-31 2009-08-06 Shine Chung MEMS Packaging Including Integrated Circuit Dies
WO2010047228A1 (ja) * 2008-10-21 2010-04-29 日本電気株式会社 配線基板およびその製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170072216A (ko) * 2014-10-23 2017-06-26 로베르트 보쉬 게엠베하 다수의 기판을 포함하는 마이크로 전자 부품 조립체, 및 상응하는 제조 방법
KR102405373B1 (ko) * 2014-10-23 2022-06-07 로베르트 보쉬 게엠베하 다수의 기판을 포함하는 마이크로 전자 부품 조립체, 및 상응하는 제조 방법
JP6041953B1 (ja) * 2015-07-21 2016-12-14 オキンス エレクトロニクス カンパニー リミテッド 接触性が改善されたバンプを含むテストソケット用ｍｅｍｓフィルム
US10506714B2 (en) 2015-07-21 2019-12-10 Okins Electronics Co., Ltd. MEMS film for semiconductor device test socket including MEMS bump
JP2021168451A (ja) * 2020-04-10 2021-10-21 セイコーエプソン株式会社 振動デバイス、電子機器および移動体
JP7497604B2 (ja) 2020-04-10 2024-06-11 セイコーエプソン株式会社 振動デバイス、電子機器および移動体

Also Published As

Publication number Publication date
CN103663348A (zh) 2014-03-26
US9437584B2 (en) 2016-09-06
US20140077390A1 (en) 2014-03-20

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