CN103663348A - 电子装置 - Google Patents

电子装置 Download PDF

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Publication number
CN103663348A
CN103663348A CN201310397636.XA CN201310397636A CN103663348A CN 103663348 A CN103663348 A CN 103663348A CN 201310397636 A CN201310397636 A CN 201310397636A CN 103663348 A CN103663348 A CN 103663348A
Authority
CN
China
Prior art keywords
electronic installation
chip
semiconductor chip
mems
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310397636.XA
Other languages
English (en)
Chinese (zh)
Inventor
渡边贤哉
奥山规生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of CN103663348A publication Critical patent/CN103663348A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/00238—Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/041—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass H10F
    • H01L25/043—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/117—Stacked arrangements of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
    • B81C2203/0785—Transfer and j oin technology, i.e. forming the electronic processing unit and the micromechanical structure on separate substrates and joining the substrates
    • B81C2203/0792—Forming interconnections between the electronic processing unit and the micromechanical structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
CN201310397636.XA 2012-09-14 2013-09-04 电子装置 Pending CN103663348A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012202374A JP2014054718A (ja) 2012-09-14 2012-09-14 電子装置
JP2012-202374 2012-09-14

Publications (1)

Publication Number Publication Date
CN103663348A true CN103663348A (zh) 2014-03-26

Family

ID=50273639

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310397636.XA Pending CN103663348A (zh) 2012-09-14 2013-09-04 电子装置

Country Status (3)

Country Link
US (1) US9437584B2 (enExample)
JP (1) JP2014054718A (enExample)
CN (1) CN103663348A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014221546A1 (de) * 2014-10-23 2016-04-28 Robert Bosch Gmbh Mikroelektronische Bauelementanordnung mit einer Mehrzahl von Substraten und entsprechendes Herstellungsverfahren
KR101720300B1 (ko) 2015-07-21 2017-03-28 주식회사 오킨스전자 접촉성이 개선된 범프를 포함하는 테스트 소켓용 ｍｅｍｓ 필름
KR102534734B1 (ko) 2018-09-03 2023-05-19 삼성전자 주식회사 반도체 패키지
JP7497604B2 (ja) * 2020-04-10 2024-06-11 セイコーエプソン株式会社 振動デバイス、電子機器および移動体

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005153067A (ja) * 2003-11-25 2005-06-16 Kyocera Corp 電子部品封止用基板およびそれを用いた電子装置の製造方法
JP2005335022A (ja) * 2004-05-28 2005-12-08 Sony Corp 微小デバイス及び電子機器
JP4688526B2 (ja) * 2005-03-03 2011-05-25 Ｏｋｉセミコンダクタ株式会社 半導体装置及びその製造方法
US7297574B2 (en) * 2005-06-17 2007-11-20 Infineon Technologies Ag Multi-chip device and method for producing a multi-chip device
US8022554B2 (en) 2006-06-15 2011-09-20 Sitime Corporation Stacked die package for MEMS resonator system
KR100807050B1 (ko) * 2006-08-23 2008-02-25 동부일렉트로닉스 주식회사 반도체 소자 및 그 제조방법
US7807583B2 (en) 2006-08-25 2010-10-05 Imec High aspect ratio via etch
JP5276289B2 (ja) 2006-08-25 2013-08-28 アイメック 高アスペクト比ビアエッチング
US7514775B2 (en) * 2006-10-09 2009-04-07 Taiwan Semiconductor Manufacturing Co., Ltd. Stacked structures and methods of fabricating stacked structures
KR100834826B1 (ko) 2007-01-25 2008-06-03 삼성전자주식회사 취급손상을 줄인 집적회로 모듈의 구조 및 모듈의 종단저항 배치방법
JP4792143B2 (ja) 2007-02-22 2011-10-12 株式会社デンソー 半導体装置およびその製造方法
JP2008288384A (ja) 2007-05-17 2008-11-27 Sony Corp ３次元積層デバイスとその製造方法、及び３次元積層デバイスの接合方法
KR100891805B1 (ko) 2007-05-25 2009-04-07 주식회사 네패스 웨이퍼 레벨 시스템 인 패키지 및 그 제조 방법
JP4825778B2 (ja) 2007-11-16 2011-11-30 株式会社日立製作所 半導体装置およびその製造方法
US20090194829A1 (en) * 2008-01-31 2009-08-06 Shine Chung MEMS Packaging Including Integrated Circuit Dies
WO2010047228A1 (ja) * 2008-10-21 2010-04-29 日本電気株式会社 配線基板およびその製造方法
JP2010112763A (ja) 2008-11-04 2010-05-20 Toshiba Corp 半導体装置およびその製造方法

Also Published As

Publication number Publication date
JP2014054718A (ja) 2014-03-27
US9437584B2 (en) 2016-09-06
US20140077390A1 (en) 2014-03-20

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Application publication date: 20140326