JP2020520128A5 - - Google Patents
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- JP2020520128A5 JP2020520128A5 JP2019563579A JP2019563579A JP2020520128A5 JP 2020520128 A5 JP2020520128 A5 JP 2020520128A5 JP 2019563579 A JP2019563579 A JP 2019563579A JP 2019563579 A JP2019563579 A JP 2019563579A JP 2020520128 A5 JP2020520128 A5 JP 2020520128A5
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- semiconductor
- cavity
- assembly
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/596,663 US10242967B2 (en) | 2017-05-16 | 2017-05-16 | Die encapsulation in oxide bonded wafer stack |
| US15/596,663 | 2017-05-16 | ||
| PCT/US2017/061922 WO2018212785A1 (en) | 2017-05-16 | 2017-11-16 | Die encapsulation in oxide bonded wafer stack |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020520128A JP2020520128A (ja) | 2020-07-02 |
| JP2020520128A5 true JP2020520128A5 (enExample) | 2020-08-13 |
| JP6826214B2 JP6826214B2 (ja) | 2021-02-03 |
Family
ID=60702972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019563579A Active JP6826214B2 (ja) | 2017-05-16 | 2017-11-16 | 酸化物接合ウエハスタックにおけるダイ封入 |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US10242967B2 (enExample) |
| EP (1) | EP3625825A1 (enExample) |
| JP (1) | JP6826214B2 (enExample) |
| KR (2) | KR102196673B1 (enExample) |
| CN (1) | CN110494975A (enExample) |
| CA (1) | CA3062895C (enExample) |
| IL (1) | IL268996B (enExample) |
| SG (1) | SG11201907133XA (enExample) |
| TW (1) | TWI711090B (enExample) |
| WO (1) | WO2018212785A1 (enExample) |
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| US10447274B2 (en) | 2017-07-11 | 2019-10-15 | iCometrue Company Ltd. | Logic drive based on standard commodity FPGA IC chips using non-volatile memory cells |
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| US11227838B2 (en) | 2019-07-02 | 2022-01-18 | iCometrue Company Ltd. | Logic drive based on multichip package comprising standard commodity FPGA IC chip with cooperating or supporting circuits |
| US10985154B2 (en) | 2019-07-02 | 2021-04-20 | iCometrue Company Ltd. | Logic drive based on multichip package comprising standard commodity FPGA IC chip with cryptography circuits |
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| US11452199B2 (en) | 2019-09-12 | 2022-09-20 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Electronic module with single or multiple components partially surrounded by a thermal decoupling gap |
| US11637056B2 (en) | 2019-09-20 | 2023-04-25 | iCometrue Company Ltd. | 3D chip package based on through-silicon-via interconnection elevator |
| CN112670191A (zh) * | 2019-10-16 | 2021-04-16 | 长鑫存储技术有限公司 | 半导体封装方法、半导体封装结构及封装体 |
| US11387204B2 (en) * | 2020-01-16 | 2022-07-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor structure and method of fabricating the same |
| US11600526B2 (en) | 2020-01-22 | 2023-03-07 | iCometrue Company Ltd. | Chip package based on through-silicon-via connector and silicon interconnection bridge |
| US11784101B2 (en) * | 2020-03-02 | 2023-10-10 | Amkor Technology Singapore Holding Pte. Ltd. | Semiconductor devices comprising a lid structure and methods of manufacturing semiconductor devices comprising a lid structure |
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| CN112331617B (zh) * | 2020-11-05 | 2023-06-09 | 联合微电子中心有限责任公司 | 一种埋入式键合工艺三维集成方法 |
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| US12176278B2 (en) | 2021-05-30 | 2024-12-24 | iCometrue Company Ltd. | 3D chip package based on vertical-through-via connector |
| US11688700B2 (en) | 2021-06-11 | 2023-06-27 | Raytheon Company | Die package having security features |
| US12278255B2 (en) | 2021-06-11 | 2025-04-15 | Raytheon Company | Thin film obscurant for microelectronics |
| CN113471083B (zh) * | 2021-09-03 | 2021-11-02 | 南通汇丰电子科技有限公司 | 一种半导体堆叠封装结构及其制备方法 |
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| CN114408857B (zh) * | 2022-03-28 | 2022-09-06 | 南京声息芯影科技有限公司 | 有源晶圆键合架构的CMUT-on-CMOS的超声换能器及制造方法 |
| WO2025004919A1 (ja) * | 2023-06-26 | 2025-01-02 | 株式会社村田製作所 | 複合部品 |
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-
2017
- 2017-05-16 US US15/596,663 patent/US10242967B2/en active Active
- 2017-11-16 SG SG11201907133XA patent/SG11201907133XA/en unknown
- 2017-11-16 WO PCT/US2017/061922 patent/WO2018212785A1/en not_active Ceased
- 2017-11-16 JP JP2019563579A patent/JP6826214B2/ja active Active
- 2017-11-16 KR KR1020197030560A patent/KR102196673B1/ko active Active
- 2017-11-16 CA CA3062895A patent/CA3062895C/en active Active
- 2017-11-16 KR KR1020207036818A patent/KR102301805B1/ko active Active
- 2017-11-16 CN CN201780089481.XA patent/CN110494975A/zh active Pending
- 2017-11-16 EP EP17817341.5A patent/EP3625825A1/en active Pending
- 2017-12-11 TW TW106143303A patent/TWI711090B/zh active
-
2019
- 2019-03-25 US US16/363,356 patent/US10784234B2/en active Active
- 2019-08-29 IL IL268996A patent/IL268996B/en active IP Right Grant
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