JP6826214B2 - 酸化物接合ウエハスタックにおけるダイ封入 - Google Patents

酸化物接合ウエハスタックにおけるダイ封入 Download PDF

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JP6826214B2
JP6826214B2 JP2019563579A JP2019563579A JP6826214B2 JP 6826214 B2 JP6826214 B2 JP 6826214B2 JP 2019563579 A JP2019563579 A JP 2019563579A JP 2019563579 A JP2019563579 A JP 2019563579A JP 6826214 B2 JP6826214 B2 JP 6826214B2
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wafer
semiconductor
cavity
integrated circuit
assembly
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JP2020520128A (ja
JP2020520128A5 (enExample
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ジェイ． ドラブ，ジョン
ジェイ． ドラブ，ジョン
ジー． ミルン，ジェイソン
ジー． ミルン，ジェイソン
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Raytheon Co
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Raytheon Co
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    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/134—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being in grooves in the semiconductor body
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    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07252—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in structures or sizes
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    • H10W72/251—Materials
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    • H10W90/791—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads
    • H10W90/792—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads between multiple chips

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  • Wire Bonding (AREA)
  • Micromachines (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2019563579A 2017-05-16 2017-11-16 酸化物接合ウエハスタックにおけるダイ封入 Active JP6826214B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/596,663 2017-05-16
US15/596,663 US10242967B2 (en) 2017-05-16 2017-05-16 Die encapsulation in oxide bonded wafer stack
PCT/US2017/061922 WO2018212785A1 (en) 2017-05-16 2017-11-16 Die encapsulation in oxide bonded wafer stack

Publications (3)

Publication Number Publication Date
JP2020520128A JP2020520128A (ja) 2020-07-02
JP2020520128A5 JP2020520128A5 (enExample) 2020-08-13
JP6826214B2 true JP6826214B2 (ja) 2021-02-03

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US (2) US10242967B2 (enExample)
EP (1) EP3625825A1 (enExample)
JP (1) JP6826214B2 (enExample)
KR (2) KR102301805B1 (enExample)
CN (1) CN110494975A (enExample)
CA (1) CA3062895C (enExample)
IL (1) IL268996B (enExample)
SG (1) SG11201907133XA (enExample)
TW (1) TWI711090B (enExample)
WO (1) WO2018212785A1 (enExample)

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Publication number Priority date Publication date Assignee Title
AU2017281280B2 (en) * 2016-06-20 2022-01-06 Butterfly Network, Inc. Electrical contact arrangement for microfabricated ultrasonic transducer
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