JP2014032190A5 - - Google Patents

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Publication number
JP2014032190A5
JP2014032190A5 JP2013156660A JP2013156660A JP2014032190A5 JP 2014032190 A5 JP2014032190 A5 JP 2014032190A5 JP 2013156660 A JP2013156660 A JP 2013156660A JP 2013156660 A JP2013156660 A JP 2013156660A JP 2014032190 A5 JP2014032190 A5 JP 2014032190A5
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JP
Japan
Prior art keywords
semiconductor device
pressure sensor
sensor die
package
cap wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013156660A
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English (en)
Japanese (ja)
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JP2014032190A (ja
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Publication date
Priority claimed from US13/562,853 external-priority patent/US9146170B2/en
Application filed filed Critical
Publication of JP2014032190A publication Critical patent/JP2014032190A/ja
Publication of JP2014032190A5 publication Critical patent/JP2014032190A5/ja
Pending legal-status Critical Current

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JP2013156660A 2012-07-31 2013-07-29 オーバーモールドパッケージ内の容量性圧力センサ Pending JP2014032190A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/562,853 2012-07-31
US13/562,853 US9146170B2 (en) 2012-07-31 2012-07-31 Capacitive pressure sensor in an overmolded package

Publications (2)

Publication Number Publication Date
JP2014032190A JP2014032190A (ja) 2014-02-20
JP2014032190A5 true JP2014032190A5 (enExample) 2016-09-08

Family

ID=48795493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013156660A Pending JP2014032190A (ja) 2012-07-31 2013-07-29 オーバーモールドパッケージ内の容量性圧力センサ

Country Status (4)

Country Link
US (1) US9146170B2 (enExample)
EP (1) EP2693184A3 (enExample)
JP (1) JP2014032190A (enExample)
CN (1) CN103575453A (enExample)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8590387B2 (en) * 2011-03-31 2013-11-26 DePuy Synthes Products, LLC Absolute capacitive micro pressure sensor
KR101450219B1 (ko) 2013-04-17 2014-10-15 주식회사 아이티엠반도체 배터리 보호회로 모듈 패키지
JP6382529B2 (ja) 2014-02-27 2018-08-29 株式会社ブリヂストン 機能部品取付台座、及び、タイヤ
US9638596B2 (en) 2014-04-08 2017-05-02 Freescale Semiconductor, Inc. Cavity-down pressure sensor device
JP6636943B2 (ja) 2014-05-15 2020-01-29 ノヴァラング ゲゼルシャフト ミット ベシュレンクテル ハフツング 医療技術的測定装置、及び測定方法
WO2015172890A1 (de) * 2014-05-15 2015-11-19 Novalung Gmbh Medizintechnisches messsystem und verfahren zur herstellung des messsystems
US10308505B1 (en) 2014-08-11 2019-06-04 Hrl Laboratories, Llc Method and apparatus for the monolithic encapsulation of a micro-scale inertial navigation sensor suite
CN104409428A (zh) * 2014-09-30 2015-03-11 广东合微集成电路技术有限公司 一种集成传感器及其封装方法
US9598280B2 (en) * 2014-11-10 2017-03-21 Nxp Usa, Inc. Environmental sensor structure
US9579511B2 (en) 2014-12-15 2017-02-28 Medtronic, Inc. Medical device with surface mounted lead connector
CN105181230A (zh) * 2015-08-06 2015-12-23 苏州敏芯微电子技术有限公司 压力传感器及其封装方法
US20170081179A1 (en) 2015-09-22 2017-03-23 Freescale Semiconductor, Inc. Mems sensor with side port and method of fabricating same
EP3159026A1 (de) 2015-10-23 2017-04-26 novalung GmbH Zwischenelement für eine medizintechnische extrakorporale fluidleitung, medizintechnisches extrakorporales fluidsystem und verfahren zum messen eines in einem medizintechnischen extrakorporalen fluidsystem geführten fluid des menschlichen oder tierischen körpers enthaltenen gases
JP6665588B2 (ja) 2016-03-02 2020-03-13 オムロン株式会社 圧力センサ
KR101803408B1 (ko) * 2016-03-23 2017-11-30 주식회사 아이티엠반도체 압력 센서 장치와 압력 센서 조립체 및 압력 센서 장치의 제조 방법
US10190925B2 (en) * 2016-07-18 2019-01-29 Honeywell International Inc. Low cost overmolded leadframe force sensor with multiple mounting positions
CN106477512B (zh) * 2016-11-23 2018-07-31 苏州敏芯微电子技术股份有限公司 压力传感器及其封装方法
US20180245950A1 (en) * 2017-02-28 2018-08-30 Maxim Integrated Products, Inc. Planarized capacitive sensor array
US10295427B2 (en) * 2017-04-04 2019-05-21 Sensata Technologies, Inc. Multi-chamber pressure sensing apparatus
US20180335360A1 (en) * 2017-05-16 2018-11-22 Honeywell International Inc. Ported Pressure Sensor With No Internally Trapped Fluid
US10836223B1 (en) 2019-12-17 2020-11-17 The Goodyear Tire & Rubber Company Encapsulated embedded tire sensor unit
CN111086755B (zh) * 2019-12-23 2022-04-15 业成科技（成都）有限公司 包装组件
US11498829B2 (en) 2020-01-16 2022-11-15 Nxp Usa, Inc. No-gel pressure sensor package
DE102020108775B4 (de) 2020-03-30 2022-08-18 Infineon Technologies Ag Sensorpackages und verfahren zur herstellung von sensorpackages
US11938762B2 (en) 2020-08-19 2024-03-26 The Goodyear Tire & Rubber Company Tire sensor attachment structure
US11823968B2 (en) 2020-08-27 2023-11-21 Nxp Usa, Inc. Semiconductor device package having stress isolation and method therefor
CN115985859A (zh) 2021-10-14 2023-04-18 恩智浦美国有限公司 形成于半导体封装模塑料中的腔和形成方法
DE102021128378A1 (de) * 2021-10-29 2023-05-04 B. Braun Melsungen Aktiengesellschaft Gelgekoppelte Drucksensoreinrichtung mit störeinflussunabhängiger Kontaktseite zur Anbindung an einen Infusionsschlauch

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3880009A (en) * 1973-05-24 1975-04-29 Bunker Ramo Pressure transducer
US4881410A (en) * 1987-06-01 1989-11-21 The Regents Of The University Of Michigan Ultraminiature pressure sensor and method of making same
US5323051A (en) 1991-12-16 1994-06-21 Motorola, Inc. Semiconductor wafer level package
JPH06148016A (ja) * 1992-11-05 1994-05-27 Tokin Corp 静電容量型圧力センサ
JPH0584897U (ja) * 1993-03-23 1993-11-16 シチズン時計株式会社 気圧測定機能付時計
JPH07225240A (ja) * 1994-02-14 1995-08-22 Omron Corp 半導体加速度センサ及び半導体加速度センサ装置並びに半導体圧力センサ及び半導体圧力センサ装置
US5600071A (en) * 1995-09-05 1997-02-04 Motorola, Inc. Vertically integrated sensor structure and method
JPH0979928A (ja) * 1995-09-12 1997-03-28 Nagano Keiki Seisakusho Ltd 半導体圧力センサ装置
JPH09304211A (ja) * 1996-05-15 1997-11-28 Omron Corp 静電容量型圧力センサのパッケージング構造およびパッケージング方法
DE60231067D1 (de) * 2001-07-10 2009-03-19 Commissariat Energie Atomique Eine Kraftmesseinrichtung beinhaltender Reifen
CN100367527C (zh) * 2003-07-11 2008-02-06 友达光电股份有限公司 电容式半导体压力传感器
EP1945561B1 (en) * 2005-10-14 2018-10-24 STMicroelectronics Srl Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device
US7875942B2 (en) 2007-01-04 2011-01-25 Stmicroelectronics, S.R.L. Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type
EP2096651A4 (en) * 2007-02-14 2014-09-24 Panasonic Corp CAPACITOR
US20090134481A1 (en) * 2007-11-28 2009-05-28 Analog Devices, Inc. Molded Sensor Package and Assembly Method
US7644625B2 (en) * 2007-12-14 2010-01-12 Honeywell International Inc. Differential pressure sense die based on silicon piezoresistive technology
DE102008004358A1 (de) * 2008-01-15 2009-07-16 Robert Bosch Gmbh Druckausgleichseinheit
US8297125B2 (en) * 2008-05-23 2012-10-30 Honeywell International Inc. Media isolated differential pressure sensor with cap
EP2159558A1 (en) * 2008-08-28 2010-03-03 Sensirion AG A method for manufacturing an integrated pressure sensor
US8230745B2 (en) * 2008-11-19 2012-07-31 Honeywell International Inc. Wet/wet differential pressure sensor based on microelectronic packaging process
JP2010203857A (ja) * 2009-03-02 2010-09-16 Alps Electric Co Ltd 圧力センサのパッケージ構造
US8359927B2 (en) 2009-08-12 2013-01-29 Freescale Semiconductor, Inc. Molded differential PRT pressure sensor

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