CN103575453A - 成型封装中的电容压力传感器 - Google Patents

成型封装中的电容压力传感器 Download PDF

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Publication number
CN103575453A
CN103575453A CN201310328779.5A CN201310328779A CN103575453A CN 103575453 A CN103575453 A CN 103575453A CN 201310328779 A CN201310328779 A CN 201310328779A CN 103575453 A CN103575453 A CN 103575453A
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CN
China
Prior art keywords
pressure sensor
semiconductor device
sensor die
pressure
major surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310328779.5A
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English (en)
Chinese (zh)
Inventor
温剑
威廉·G·麦克唐纳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
Freescale Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freescale Semiconductor Inc filed Critical Freescale Semiconductor Inc
Publication of CN103575453A publication Critical patent/CN103575453A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/145—Housings with stress relieving means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007—Fluidic connecting means
    • G01L19/0038—Fluidic connecting means being part of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0627—Protection against aggressive medium in general
    • G01L19/0654—Protection against aggressive medium in general against moisture or humidity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/141—Monolithic housings, e.g. molded or one-piece housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Child & Adolescent Psychology (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
CN201310328779.5A 2012-07-31 2013-07-31 成型封装中的电容压力传感器 Pending CN103575453A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/562,853 2012-07-31
US13/562,853 US9146170B2 (en) 2012-07-31 2012-07-31 Capacitive pressure sensor in an overmolded package

Publications (1)

Publication Number Publication Date
CN103575453A true CN103575453A (zh) 2014-02-12

Family

ID=48795493

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310328779.5A Pending CN103575453A (zh) 2012-07-31 2013-07-31 成型封装中的电容压力传感器

Country Status (4)

Country Link
US (1) US9146170B2 (enExample)
EP (1) EP2693184A3 (enExample)
JP (1) JP2014032190A (enExample)
CN (1) CN103575453A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104409428A (zh) * 2014-09-30 2015-03-11 广东合微集成电路技术有限公司 一种集成传感器及其封装方法
CN105181230A (zh) * 2015-08-06 2015-12-23 苏州敏芯微电子技术有限公司 压力传感器及其封装方法
CN106034397A (zh) * 2014-02-27 2016-10-19 株式会社普利司通 功能部件安装基座和轮胎
CN106477512A (zh) * 2016-11-23 2017-03-08 苏州敏芯微电子技术股份有限公司 压力传感器及其封装方法
CN108463691A (zh) * 2016-03-23 2018-08-28 Itm半导体有限公司 压力传感器装置与压力传感器组合体及压力传感器装置的制造方法
CN108871662A (zh) * 2017-05-16 2018-11-23 霍尼韦尔国际公司 不存在内部捕获的流体的具有端口的压力传感器
CN111086755A (zh) * 2019-12-23 2020-05-01 业成科技（成都）有限公司 包装组件

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8590387B2 (en) * 2011-03-31 2013-11-26 DePuy Synthes Products, LLC Absolute capacitive micro pressure sensor
KR101450221B1 (ko) * 2013-04-17 2014-10-15 주식회사 아이티엠반도체 배터리 보호회로 모듈 패키지
US9638596B2 (en) 2014-04-08 2017-05-02 Freescale Semiconductor, Inc. Cavity-down pressure sensor device
US10391227B2 (en) 2014-05-15 2019-08-27 Novalung Gmbh Medico-technical measuring device and measuring method
WO2015172890A1 (de) * 2014-05-15 2015-11-19 Novalung Gmbh Medizintechnisches messsystem und verfahren zur herstellung des messsystems
US10308505B1 (en) 2014-08-11 2019-06-04 Hrl Laboratories, Llc Method and apparatus for the monolithic encapsulation of a micro-scale inertial navigation sensor suite
US9598280B2 (en) * 2014-11-10 2017-03-21 Nxp Usa, Inc. Environmental sensor structure
US9579511B2 (en) 2014-12-15 2017-02-28 Medtronic, Inc. Medical device with surface mounted lead connector
US20170081179A1 (en) 2015-09-22 2017-03-23 Freescale Semiconductor, Inc. Mems sensor with side port and method of fabricating same
EP3159026A1 (de) 2015-10-23 2017-04-26 novalung GmbH Zwischenelement für eine medizintechnische extrakorporale fluidleitung, medizintechnisches extrakorporales fluidsystem und verfahren zum messen eines in einem medizintechnischen extrakorporalen fluidsystem geführten fluid des menschlichen oder tierischen körpers enthaltenen gases
JP6665588B2 (ja) 2016-03-02 2020-03-13 オムロン株式会社 圧力センサ
US10190925B2 (en) * 2016-07-18 2019-01-29 Honeywell International Inc. Low cost overmolded leadframe force sensor with multiple mounting positions
US20180245950A1 (en) * 2017-02-28 2018-08-30 Maxim Integrated Products, Inc. Planarized capacitive sensor array
US10295427B2 (en) * 2017-04-04 2019-05-21 Sensata Technologies, Inc. Multi-chamber pressure sensing apparatus
US10836223B1 (en) 2019-12-17 2020-11-17 The Goodyear Tire & Rubber Company Encapsulated embedded tire sensor unit
US11498829B2 (en) 2020-01-16 2022-11-15 Nxp Usa, Inc. No-gel pressure sensor package
DE102020108775B4 (de) 2020-03-30 2022-08-18 Infineon Technologies Ag Sensorpackages und verfahren zur herstellung von sensorpackages
US11938762B2 (en) 2020-08-19 2024-03-26 The Goodyear Tire & Rubber Company Tire sensor attachment structure
US11823968B2 (en) 2020-08-27 2023-11-21 Nxp Usa, Inc. Semiconductor device package having stress isolation and method therefor
CN115985859A (zh) 2021-10-14 2023-04-18 恩智浦美国有限公司 形成于半导体封装模塑料中的腔和形成方法
DE102021128378A1 (de) * 2021-10-29 2023-05-04 B. Braun Melsungen Aktiengesellschaft Gelgekoppelte Drucksensoreinrichtung mit störeinflussunabhängiger Kontaktseite zur Anbindung an einen Infusionsschlauch

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4881410A (en) * 1987-06-01 1989-11-21 The Regents Of The University Of Michigan Ultraminiature pressure sensor and method of making same
JPH06148016A (ja) * 1992-11-05 1994-05-27 Tokin Corp 静電容量型圧力センサ
CN1571182A (zh) * 2003-07-11 2005-01-26 友达光电股份有限公司 电容式半导体压力传感器
CN101331080A (zh) * 2005-10-14 2008-12-24 意法半导体股份有限公司 用于集成器件的衬底级组件、其制造工艺及相关集成器件
US20110036174A1 (en) * 2009-08-12 2011-02-17 Hooper Stephen R Molded Differential PRT Pressure Sensor

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3880009A (en) * 1973-05-24 1975-04-29 Bunker Ramo Pressure transducer
US5323051A (en) 1991-12-16 1994-06-21 Motorola, Inc. Semiconductor wafer level package
JPH0584897U (ja) * 1993-03-23 1993-11-16 シチズン時計株式会社 気圧測定機能付時計
JPH07225240A (ja) * 1994-02-14 1995-08-22 Omron Corp 半導体加速度センサ及び半導体加速度センサ装置並びに半導体圧力センサ及び半導体圧力センサ装置
US5600071A (en) * 1995-09-05 1997-02-04 Motorola, Inc. Vertically integrated sensor structure and method
JPH0979928A (ja) * 1995-09-12 1997-03-28 Nagano Keiki Seisakusho Ltd 半導体圧力センサ装置
JPH09304211A (ja) * 1996-05-15 1997-11-28 Omron Corp 静電容量型圧力センサのパッケージング構造およびパッケージング方法
DE60231067D1 (de) * 2001-07-10 2009-03-19 Commissariat Energie Atomique Eine Kraftmesseinrichtung beinhaltender Reifen
US7875942B2 (en) 2007-01-04 2011-01-25 Stmicroelectronics, S.R.L. Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type
JP5083220B2 (ja) * 2007-02-14 2012-11-28 パナソニック株式会社 コンデンサ
US20090134481A1 (en) * 2007-11-28 2009-05-28 Analog Devices, Inc. Molded Sensor Package and Assembly Method
US7644625B2 (en) * 2007-12-14 2010-01-12 Honeywell International Inc. Differential pressure sense die based on silicon piezoresistive technology
DE102008004358A1 (de) * 2008-01-15 2009-07-16 Robert Bosch Gmbh Druckausgleichseinheit
US8297125B2 (en) * 2008-05-23 2012-10-30 Honeywell International Inc. Media isolated differential pressure sensor with cap
EP2159558A1 (en) * 2008-08-28 2010-03-03 Sensirion AG A method for manufacturing an integrated pressure sensor
US8230745B2 (en) * 2008-11-19 2012-07-31 Honeywell International Inc. Wet/wet differential pressure sensor based on microelectronic packaging process
JP2010203857A (ja) * 2009-03-02 2010-09-16 Alps Electric Co Ltd 圧力センサのパッケージ構造

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4881410A (en) * 1987-06-01 1989-11-21 The Regents Of The University Of Michigan Ultraminiature pressure sensor and method of making same
JPH06148016A (ja) * 1992-11-05 1994-05-27 Tokin Corp 静電容量型圧力センサ
CN1571182A (zh) * 2003-07-11 2005-01-26 友达光电股份有限公司 电容式半导体压力传感器
CN101331080A (zh) * 2005-10-14 2008-12-24 意法半导体股份有限公司 用于集成器件的衬底级组件、其制造工艺及相关集成器件
US20110036174A1 (en) * 2009-08-12 2011-02-17 Hooper Stephen R Molded Differential PRT Pressure Sensor

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106034397A (zh) * 2014-02-27 2016-10-19 株式会社普利司通 功能部件安装基座和轮胎
US9987889B2 (en) 2014-02-27 2018-06-05 Bridgestone Corporation Functional component mounting base and tire
CN104409428A (zh) * 2014-09-30 2015-03-11 广东合微集成电路技术有限公司 一种集成传感器及其封装方法
CN105181230A (zh) * 2015-08-06 2015-12-23 苏州敏芯微电子技术有限公司 压力传感器及其封装方法
CN108463691A (zh) * 2016-03-23 2018-08-28 Itm半导体有限公司 压力传感器装置与压力传感器组合体及压力传感器装置的制造方法
CN106477512A (zh) * 2016-11-23 2017-03-08 苏州敏芯微电子技术股份有限公司 压力传感器及其封装方法
CN106477512B (zh) * 2016-11-23 2018-07-31 苏州敏芯微电子技术股份有限公司 压力传感器及其封装方法
CN108871662A (zh) * 2017-05-16 2018-11-23 霍尼韦尔国际公司 不存在内部捕获的流体的具有端口的压力传感器
CN111086755A (zh) * 2019-12-23 2020-05-01 业成科技（成都）有限公司 包装组件
CN111086755B (zh) * 2019-12-23 2022-04-15 业成科技（成都）有限公司 包装组件

Also Published As

Publication number Publication date
EP2693184A3 (en) 2015-08-12
US9146170B2 (en) 2015-09-29
EP2693184A2 (en) 2014-02-05
US20140033814A1 (en) 2014-02-06
JP2014032190A (ja) 2014-02-20

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Application publication date: 20140212