JP2014032190A - オーバーモールドパッケージ内の容量性圧力センサ - Google Patents

オーバーモールドパッケージ内の容量性圧力センサ Download PDF

Info

Publication number
JP2014032190A
JP2014032190A JP2013156660A JP2013156660A JP2014032190A JP 2014032190 A JP2014032190 A JP 2014032190A JP 2013156660 A JP2013156660 A JP 2013156660A JP 2013156660 A JP2013156660 A JP 2013156660A JP 2014032190 A JP2014032190 A JP 2014032190A
Authority
JP
Japan
Prior art keywords
pressure sensor
semiconductor device
sensor die
package
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013156660A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014032190A5 (enExample
Inventor
Wen Jiang
ウェン ジアン
G Mcdonald William
ジー マクドナルド ウイリアム
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
Freescale Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freescale Semiconductor Inc filed Critical Freescale Semiconductor Inc
Publication of JP2014032190A publication Critical patent/JP2014032190A/ja
Publication of JP2014032190A5 publication Critical patent/JP2014032190A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/145—Housings with stress relieving means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007—Fluidic connecting means
    • G01L19/0038—Fluidic connecting means being part of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0627—Protection against aggressive medium in general
    • G01L19/0654—Protection against aggressive medium in general against moisture or humidity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/141—Monolithic housings, e.g. molded or one-piece housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Child & Adolescent Psychology (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
JP2013156660A 2012-07-31 2013-07-29 オーバーモールドパッケージ内の容量性圧力センサ Pending JP2014032190A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/562,853 2012-07-31
US13/562,853 US9146170B2 (en) 2012-07-31 2012-07-31 Capacitive pressure sensor in an overmolded package

Publications (2)

Publication Number Publication Date
JP2014032190A true JP2014032190A (ja) 2014-02-20
JP2014032190A5 JP2014032190A5 (enExample) 2016-09-08

Family

ID=48795493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013156660A Pending JP2014032190A (ja) 2012-07-31 2013-07-29 オーバーモールドパッケージ内の容量性圧力センサ

Country Status (4)

Country Link
US (1) US9146170B2 (enExample)
EP (1) EP2693184A3 (enExample)
JP (1) JP2014032190A (enExample)
CN (1) CN103575453A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017518087A (ja) * 2014-05-15 2017-07-06 ノヴァラング ゲゼルシャフト ミット ベシュレンクテル ハフツング 医療技術的測定システム、及び前記測定システムの製造方法
DE102017103121A1 (de) 2016-03-02 2017-09-07 Omron Corporation Drucksensor
CN108508277A (zh) * 2017-02-28 2018-09-07 马克西姆综合产品公司 平坦化的电容式传感器阵列
US10391227B2 (en) 2014-05-15 2019-08-27 Novalung Gmbh Medico-technical measuring device and measuring method
US10814054B2 (en) 2015-10-23 2020-10-27 Novalung Gmbh Intermediate element for a medical extracorporeal fluid line, and system and method associated therewith

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8590387B2 (en) * 2011-03-31 2013-11-26 DePuy Synthes Products, LLC Absolute capacitive micro pressure sensor
KR101450219B1 (ko) 2013-04-17 2014-10-15 주식회사 아이티엠반도체 배터리 보호회로 모듈 패키지
JP6382529B2 (ja) 2014-02-27 2018-08-29 株式会社ブリヂストン 機能部品取付台座、及び、タイヤ
US9638596B2 (en) 2014-04-08 2017-05-02 Freescale Semiconductor, Inc. Cavity-down pressure sensor device
US10308505B1 (en) 2014-08-11 2019-06-04 Hrl Laboratories, Llc Method and apparatus for the monolithic encapsulation of a micro-scale inertial navigation sensor suite
CN104409428A (zh) * 2014-09-30 2015-03-11 广东合微集成电路技术有限公司 一种集成传感器及其封装方法
US9598280B2 (en) * 2014-11-10 2017-03-21 Nxp Usa, Inc. Environmental sensor structure
US9579511B2 (en) 2014-12-15 2017-02-28 Medtronic, Inc. Medical device with surface mounted lead connector
CN105181230A (zh) * 2015-08-06 2015-12-23 苏州敏芯微电子技术有限公司 压力传感器及其封装方法
US20170081179A1 (en) 2015-09-22 2017-03-23 Freescale Semiconductor, Inc. Mems sensor with side port and method of fabricating same
KR101803408B1 (ko) * 2016-03-23 2017-11-30 주식회사 아이티엠반도체 압력 센서 장치와 압력 센서 조립체 및 압력 센서 장치의 제조 방법
US10190925B2 (en) * 2016-07-18 2019-01-29 Honeywell International Inc. Low cost overmolded leadframe force sensor with multiple mounting positions
CN106477512B (zh) * 2016-11-23 2018-07-31 苏州敏芯微电子技术股份有限公司 压力传感器及其封装方法
US10295427B2 (en) * 2017-04-04 2019-05-21 Sensata Technologies, Inc. Multi-chamber pressure sensing apparatus
US20180335360A1 (en) * 2017-05-16 2018-11-22 Honeywell International Inc. Ported Pressure Sensor With No Internally Trapped Fluid
US10836223B1 (en) 2019-12-17 2020-11-17 The Goodyear Tire & Rubber Company Encapsulated embedded tire sensor unit
CN111086755B (zh) * 2019-12-23 2022-04-15 业成科技（成都）有限公司 包装组件
US11498829B2 (en) 2020-01-16 2022-11-15 Nxp Usa, Inc. No-gel pressure sensor package
DE102020108775B4 (de) 2020-03-30 2022-08-18 Infineon Technologies Ag Sensorpackages und verfahren zur herstellung von sensorpackages
US11938762B2 (en) 2020-08-19 2024-03-26 The Goodyear Tire & Rubber Company Tire sensor attachment structure
US11823968B2 (en) 2020-08-27 2023-11-21 Nxp Usa, Inc. Semiconductor device package having stress isolation and method therefor
CN115985859A (zh) 2021-10-14 2023-04-18 恩智浦美国有限公司 形成于半导体封装模塑料中的腔和形成方法
DE102021128378A1 (de) * 2021-10-29 2023-05-04 B. Braun Melsungen Aktiengesellschaft Gelgekoppelte Drucksensoreinrichtung mit störeinflussunabhängiger Kontaktseite zur Anbindung an einen Infusionsschlauch

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0584897U (ja) * 1993-03-23 1993-11-16 シチズン時計株式会社 気圧測定機能付時計
JPH07225240A (ja) * 1994-02-14 1995-08-22 Omron Corp 半導体加速度センサ及び半導体加速度センサ装置並びに半導体圧力センサ及び半導体圧力センサ装置
JPH0979928A (ja) * 1995-09-12 1997-03-28 Nagano Keiki Seisakusho Ltd 半導体圧力センサ装置
JPH09126927A (ja) * 1995-09-05 1997-05-16 Motorola Inc 垂直一体化センサ構造および方法
JPH09304211A (ja) * 1996-05-15 1997-11-28 Omron Corp 静電容量型圧力センサのパッケージング構造およびパッケージング方法
JP2009512202A (ja) * 2005-10-14 2009-03-19 エスティーマイクロエレクトロニクス エス．アール．エル． 集積デバイス用の基板レベル・アセンブリ、その製造プロセス、および関連する集積デバイス
US20100055821A1 (en) * 2008-08-28 2010-03-04 Buehler Johannes Method for manufacturing an intergrated pressure sensor
JP2010203857A (ja) * 2009-03-02 2010-09-16 Alps Electric Co Ltd 圧力センサのパッケージ構造

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3880009A (en) * 1973-05-24 1975-04-29 Bunker Ramo Pressure transducer
US4881410A (en) * 1987-06-01 1989-11-21 The Regents Of The University Of Michigan Ultraminiature pressure sensor and method of making same
US5323051A (en) 1991-12-16 1994-06-21 Motorola, Inc. Semiconductor wafer level package
JPH06148016A (ja) * 1992-11-05 1994-05-27 Tokin Corp 静電容量型圧力センサ
DE60231067D1 (de) * 2001-07-10 2009-03-19 Commissariat Energie Atomique Eine Kraftmesseinrichtung beinhaltender Reifen
CN100367527C (zh) * 2003-07-11 2008-02-06 友达光电股份有限公司 电容式半导体压力传感器
US7875942B2 (en) 2007-01-04 2011-01-25 Stmicroelectronics, S.R.L. Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type
EP2096651A4 (en) * 2007-02-14 2014-09-24 Panasonic Corp CAPACITOR
US20090134481A1 (en) * 2007-11-28 2009-05-28 Analog Devices, Inc. Molded Sensor Package and Assembly Method
US7644625B2 (en) * 2007-12-14 2010-01-12 Honeywell International Inc. Differential pressure sense die based on silicon piezoresistive technology
DE102008004358A1 (de) * 2008-01-15 2009-07-16 Robert Bosch Gmbh Druckausgleichseinheit
US8297125B2 (en) * 2008-05-23 2012-10-30 Honeywell International Inc. Media isolated differential pressure sensor with cap
US8230745B2 (en) * 2008-11-19 2012-07-31 Honeywell International Inc. Wet/wet differential pressure sensor based on microelectronic packaging process
US8359927B2 (en) 2009-08-12 2013-01-29 Freescale Semiconductor, Inc. Molded differential PRT pressure sensor

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0584897U (ja) * 1993-03-23 1993-11-16 シチズン時計株式会社 気圧測定機能付時計
JPH07225240A (ja) * 1994-02-14 1995-08-22 Omron Corp 半導体加速度センサ及び半導体加速度センサ装置並びに半導体圧力センサ及び半導体圧力センサ装置
JPH09126927A (ja) * 1995-09-05 1997-05-16 Motorola Inc 垂直一体化センサ構造および方法
JPH0979928A (ja) * 1995-09-12 1997-03-28 Nagano Keiki Seisakusho Ltd 半導体圧力センサ装置
JPH09304211A (ja) * 1996-05-15 1997-11-28 Omron Corp 静電容量型圧力センサのパッケージング構造およびパッケージング方法
JP2009512202A (ja) * 2005-10-14 2009-03-19 エスティーマイクロエレクトロニクス エス．アール．エル． 集積デバイス用の基板レベル・アセンブリ、その製造プロセス、および関連する集積デバイス
US20100055821A1 (en) * 2008-08-28 2010-03-04 Buehler Johannes Method for manufacturing an intergrated pressure sensor
JP2010203857A (ja) * 2009-03-02 2010-09-16 Alps Electric Co Ltd 圧力センサのパッケージ構造

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017518087A (ja) * 2014-05-15 2017-07-06 ノヴァラング ゲゼルシャフト ミット ベシュレンクテル ハフツング 医療技術的測定システム、及び前記測定システムの製造方法
US10391227B2 (en) 2014-05-15 2019-08-27 Novalung Gmbh Medico-technical measuring device and measuring method
US10463306B2 (en) 2014-05-15 2019-11-05 Novalung Gmbh Medical measuring system and method for production of the measuring system
US11357899B2 (en) 2014-05-15 2022-06-14 Novalung Gmbh Measuring device and method for measuring a property of a fluid in a line
US10814054B2 (en) 2015-10-23 2020-10-27 Novalung Gmbh Intermediate element for a medical extracorporeal fluid line, and system and method associated therewith
DE102017103121A1 (de) 2016-03-02 2017-09-07 Omron Corporation Drucksensor
KR20170102804A (ko) 2016-03-02 2017-09-12 오므론 가부시키가이샤 압력 센서
CN108508277A (zh) * 2017-02-28 2018-09-07 马克西姆综合产品公司 平坦化的电容式传感器阵列

Also Published As

Publication number Publication date
EP2693184A2 (en) 2014-02-05
US9146170B2 (en) 2015-09-29
EP2693184A3 (en) 2015-08-12
US20140033814A1 (en) 2014-02-06
CN103575453A (zh) 2014-02-12

Similar Documents

Publication Publication Date Title
JP2014032190A (ja) オーバーモールドパッケージ内の容量性圧力センサ
US8686550B2 (en) Method and apparatus for high pressure sensor device
US9040352B2 (en) Film-assist molded gel-fill cavity package with overflow reservoir
US9209121B2 (en) Double-sided package
US10151658B2 (en) Pressure-sensing integrated circuit device with diaphragm
US7900521B2 (en) Exposed pad backside pressure sensor package
US20140374848A1 (en) Semiconductor sensor device with metal lid
US20090314095A1 (en) Pressure sensing device package and manufacturing method thereof
US9890034B2 (en) Cavity type pressure sensor device
US20150270206A1 (en) Pressure sensor device with through silicon via
JP5351943B2 (ja) 両面センサパッケージとして使用される装置
US11127645B2 (en) Grounding lids in integrated circuit devices
CN101253399A (zh) 具有基片和壳体的传感器装置及制造传感器装置的方法
US9633932B2 (en) Lead frame package having discharge hole and method of manufacturing the same
US8307714B1 (en) Dual port pressure sensor
EP2090873B1 (en) Integrated circuit package
US7832278B2 (en) Multi-chip package
CN105293421A (zh) 微机电感测装置封装结构及制造工艺
CN109830477B (zh) 集成电路封装体及其制造方法与注塑治具
GB2432457A (en) Sensor arrangement and method for fabricating a sensor arrangement
US9508632B1 (en) Apparatus and methods for stackable packaging
WO2009143676A1 (en) Multi-chip package
CN113838839B (zh) 感测组件封装结构及其封装方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160725

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160725

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170525

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170530

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20180109