TW201615035A - Microelectro-mechanical systems microphone package device and MEMS packaging method thereof - Google Patents

Microelectro-mechanical systems microphone package device and MEMS packaging method thereof

Info

Publication number
TW201615035A
TW201615035A TW103136650A TW103136650A TW201615035A TW 201615035 A TW201615035 A TW 201615035A TW 103136650 A TW103136650 A TW 103136650A TW 103136650 A TW103136650 A TW 103136650A TW 201615035 A TW201615035 A TW 201615035A
Authority
TW
Taiwan
Prior art keywords
seal ring
package device
microelectro
chip
packaging method
Prior art date
Application number
TW103136650A
Other languages
Chinese (zh)
Other versions
TWI539827B (en
Inventor
Tsung-Min Hsieh
Chien-Hsing Lee
Chih-Hsien Chung
yong-wei Chen
Jhyy-Cheng Liou
Original Assignee
Solid State System Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Solid State System Co Ltd filed Critical Solid State System Co Ltd
Publication of TW201615035A publication Critical patent/TW201615035A/en
Application granted granted Critical
Publication of TWI539827B publication Critical patent/TWI539827B/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R23/00—Transducers other than those covered by groups H04R9/00 - H04R21/00
    • H04R23/006—Transducers other than those covered by groups H04R9/00 - H04R21/00 using solid state devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

A MEMS microphone package device includes a MEMS microphone chip as an integrated circuit chip. An acoustic sensing structure is embedded in the integrated circuit chip. An adhesive structure adheres on outer sidewall of the microphone chip. A bottom portion of the adhesive structure protrudes out from first surface of the microphone chip and adheres on a surface of a substrate, having interconnection structure, to form a first seal ring. A space between the acoustic sensing structure and the substrate and sealed by the first seal ring forms a second chamber. A cover adheres to top portion of the adhesive structure, covering over the cavity on the second surface of the microphone chip. The top portion of the adhesive structure forms as a second seal ring. A space between the cover and the second surface of the microphone chip and sealed by the second seal ring forms a first chamber.
TW103136650A 2014-10-02 2014-10-23 Microelectro-mechanical systems microphone package device and mems packaging method thereof TWI539827B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/505,495 US9271087B1 (en) 2014-10-02 2014-10-02 Microelectro-mechanical systems (MEMS) microphone package device and MEMS packaging method thereof

Publications (2)

Publication Number Publication Date
TW201615035A true TW201615035A (en) 2016-04-16
TWI539827B TWI539827B (en) 2016-06-21

Family

ID=55314829

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103136650A TWI539827B (en) 2014-10-02 2014-10-23 Microelectro-mechanical systems microphone package device and mems packaging method thereof

Country Status (3)

Country Link
US (1) US9271087B1 (en)
CN (1) CN105704628A (en)
TW (1) TWI539827B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110868679A (en) * 2018-08-27 2020-03-06 鑫创科技股份有限公司 Microphone packaging structure

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109286885A (en) * 2017-07-19 2019-01-29 钰太芯微电子科技（上海）有限公司 A kind of improved microphone hybrid package structure
DE112018005833T5 (en) * 2017-11-14 2020-07-30 Knowles Electronics, Llc SENSOR PACKAGE WITH PENETRATION PROTECTION
TWI732228B (en) * 2019-02-19 2021-07-01 美律實業股份有限公司 Microphone package structure
CN111866695A (en) * 2019-04-30 2020-10-30 讯芯电子科技（中山）有限公司 Microphone device manufacturing method and microphone device
US20200385263A1 (en) * 2019-06-06 2020-12-10 Solid State System Co., Ltd. Package structure of micro-electro-mechanical-system (mems) microphone package and packaging method thereof
US10841710B1 (en) * 2019-06-20 2020-11-17 Solid State System Co., Ltd. Package structure of micro-electro-mechanical-system microphone package and method for packaging the same
CN111918191A (en) * 2020-07-24 2020-11-10 钰太芯微电子科技（上海）有限公司 Combined packaged microphone

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005086535A1 (en) * 2004-03-09 2005-09-15 Matsushita Electric Industrial Co., Ltd. Electret capacitor microphone
JP2007081614A (en) * 2005-09-13 2007-03-29 Star Micronics Co Ltd Condenser microphone
US7436054B2 (en) * 2006-03-03 2008-10-14 Silicon Matrix, Pte. Ltd. MEMS microphone with a stacked PCB package and method of producing the same
CN101494230A (en) * 2008-01-21 2009-07-29 矽品精密工业股份有限公司 Sensing type semiconductor package and production method thereof
US8193596B2 (en) * 2008-09-03 2012-06-05 Solid State System Co., Ltd. Micro-electro-mechanical systems (MEMS) package
US20100086146A1 (en) * 2008-10-02 2010-04-08 Fortemedia, Inc. Silicon-based microphone package
US8325951B2 (en) * 2009-01-20 2012-12-04 General Mems Corporation Miniature MEMS condenser microphone packages and fabrication method thereof
TWM473663U (en) * 2013-08-19 2014-03-01 Upi Semiconductor Corp MEMS microphone device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110868679A (en) * 2018-08-27 2020-03-06 鑫创科技股份有限公司 Microphone packaging structure
US10728674B2 (en) 2018-08-27 2020-07-28 Solid State System Co., Ltd. Microphone package
TWI735843B (en) * 2018-08-27 2021-08-11 鑫創科技股份有限公司 Micro-electro-mechanical-system microphone package

Also Published As

Publication number Publication date
US9271087B1 (en) 2016-02-23
CN105704628A (en) 2016-06-22
TWI539827B (en) 2016-06-21

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