CN103487175B - 一种塑料封装的压力传感器的制作方法 - Google Patents
一种塑料封装的压力传感器的制作方法 Download PDFInfo
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- CN103487175B CN103487175B CN201310390339.2A CN201310390339A CN103487175B CN 103487175 B CN103487175 B CN 103487175B CN 201310390339 A CN201310390339 A CN 201310390339A CN 103487175 B CN103487175 B CN 103487175B
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- pressure sensor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
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CN201310390339.2A CN103487175B (zh) | 2013-09-02 | 2013-09-02 | 一种塑料封装的压力传感器的制作方法 |
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CN201310390339.2A CN103487175B (zh) | 2013-09-02 | 2013-09-02 | 一种塑料封装的压力传感器的制作方法 |
Publications (2)
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CN103487175A CN103487175A (zh) | 2014-01-01 |
CN103487175B true CN103487175B (zh) | 2015-09-30 |
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CN201310390339.2A Active CN103487175B (zh) | 2013-09-02 | 2013-09-02 | 一种塑料封装的压力传感器的制作方法 |
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Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109742034A (zh) * | 2014-01-26 | 2019-05-10 | 清华大学 | 一种封装结构、封装方法及在封装方法中使用的模板 |
CN104198107B (zh) * | 2014-09-11 | 2017-03-08 | 武汉飞恩微电子有限公司 | 一种压力传感器及其制造方法 |
CN104236628A (zh) * | 2014-09-16 | 2014-12-24 | 武汉大学 | 一种四自由度组合传感器 |
CN105021323A (zh) * | 2015-07-09 | 2015-11-04 | 瑞声声学科技(深圳)有限公司 | 按压传感器装置 |
CN106098570B (zh) * | 2016-06-23 | 2019-01-01 | 江阴芯智联电子科技有限公司 | 空腔式塑料封装模块结构及其制造方法 |
CN107764459B (zh) * | 2016-08-17 | 2020-04-21 | 苏州明皜传感科技有限公司 | 压力传感器以及其制造方法 |
TWI624022B (zh) * | 2016-11-15 | 2018-05-11 | 致伸科技股份有限公司 | 指紋辨識模組及其製造方法 |
CN107271029A (zh) * | 2017-06-06 | 2017-10-20 | 纽威仕微电子(无锡)有限公司 | 一种水听器集成模块及其制造工艺 |
CN107588889A (zh) * | 2017-09-05 | 2018-01-16 | 武汉飞恩微电子有限公司 | 一种耐流体冰冻的介质隔离封装压力传感器 |
CN109437090A (zh) * | 2018-06-04 | 2019-03-08 | 徐景辉 | 一种新型无引线键合的mems传感器封装方法 |
CN108847442B (zh) * | 2018-06-30 | 2022-01-25 | 山东昊润自动化技术有限公司 | 一种压力芯片封装方法 |
CN110255491A (zh) * | 2019-06-27 | 2019-09-20 | 中国科学院微电子研究所 | Mems压力传感器封装结构及封装方法 |
CN110987280A (zh) * | 2019-12-02 | 2020-04-10 | 歌尔科技有限公司 | 防水防尘压力传感器及其加工方法 |
CN111009481B (zh) * | 2019-12-19 | 2023-04-18 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | 芯片基板大压力倒装键合柔性加压方法 |
CN111693207B (zh) * | 2020-05-20 | 2022-03-22 | 江苏大学 | 一种油箱蒸汽压力传感器封装结构及其制备工艺 |
CN114566452B (zh) * | 2022-04-29 | 2022-07-15 | 武汉飞恩微电子有限公司 | 基座与芯片黏合装置及含其的压力传感器自动封装生产线 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1865864A (zh) * | 2005-05-20 | 2006-11-22 | 上海飞恩微电子有限公司 | 胎压温度监测系统的多功能传感器集成芯片 |
CN101110406A (zh) * | 2006-07-20 | 2008-01-23 | 威宇科技测试封装有限公司 | 一种多芯片封装结构及其封装方法 |
CN101488476A (zh) * | 2009-02-25 | 2009-07-22 | 晶方半导体科技(苏州)有限公司 | 封装方法 |
CN101704326A (zh) * | 2009-11-13 | 2010-05-12 | 广东省粤晶高科股份有限公司 | 一种汽车轮胎压力传感器的塑封工艺 |
CN101927669A (zh) * | 2010-09-19 | 2010-12-29 | 广东省粤晶高科股份有限公司 | 一种轮胎压力监测装置的封装工艺 |
CN201852672U (zh) * | 2010-10-29 | 2011-06-01 | 刘胜 | 塑料封装的压力传感器 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102010064120B4 (de) * | 2010-12-23 | 2023-05-25 | Robert Bosch Gmbh | Bauteil und Verfahren zu dessen Herstellung |
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2013
- 2013-09-02 CN CN201310390339.2A patent/CN103487175B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1865864A (zh) * | 2005-05-20 | 2006-11-22 | 上海飞恩微电子有限公司 | 胎压温度监测系统的多功能传感器集成芯片 |
CN101110406A (zh) * | 2006-07-20 | 2008-01-23 | 威宇科技测试封装有限公司 | 一种多芯片封装结构及其封装方法 |
CN101488476A (zh) * | 2009-02-25 | 2009-07-22 | 晶方半导体科技(苏州)有限公司 | 封装方法 |
CN101704326A (zh) * | 2009-11-13 | 2010-05-12 | 广东省粤晶高科股份有限公司 | 一种汽车轮胎压力传感器的塑封工艺 |
CN101927669A (zh) * | 2010-09-19 | 2010-12-29 | 广东省粤晶高科股份有限公司 | 一种轮胎压力监测装置的封装工艺 |
CN201852672U (zh) * | 2010-10-29 | 2011-06-01 | 刘胜 | 塑料封装的压力传感器 |
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Effective date of registration: 20151021 Address after: 430075, No. 999, hi tech Road, East Lake hi tech Zone, Hubei, Wuhan Province, No. 14, building A, overseas talent building, future science and Technology City Patentee after: Wuhan FineMEMS Inc. Address before: 214135, Wuxi New District, Taihu Jiangsu international science and Technology Park, sensor network, University Science and Technology Park, building 530, C903 Patentee before: Wuxi Hui Sidun Science and Technology Ltd. Patentee before: Wuhan FineMEMS Inc. |