JP2014054718A5 - - Google Patents

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Publication number
JP2014054718A5
JP2014054718A5 JP2012202374A JP2012202374A JP2014054718A5 JP 2014054718 A5 JP2014054718 A5 JP 2014054718A5 JP 2012202374 A JP2012202374 A JP 2012202374A JP 2012202374 A JP2012202374 A JP 2012202374A JP 2014054718 A5 JP2014054718 A5 JP 2014054718A5
Authority
JP
Japan
Prior art keywords
wiring
mems
chip
pad
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2012202374A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014054718A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012202374A priority Critical patent/JP2014054718A/ja
Priority claimed from JP2012202374A external-priority patent/JP2014054718A/ja
Priority to CN201310397636.XA priority patent/CN103663348A/zh
Priority to US14/018,731 priority patent/US9437584B2/en
Publication of JP2014054718A publication Critical patent/JP2014054718A/ja
Publication of JP2014054718A5 publication Critical patent/JP2014054718A5/ja
Withdrawn legal-status Critical Current

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JP2012202374A 2012-09-14 2012-09-14 電子装置 Withdrawn JP2014054718A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012202374A JP2014054718A (ja) 2012-09-14 2012-09-14 電子装置
CN201310397636.XA CN103663348A (zh) 2012-09-14 2013-09-04 电子装置
US14/018,731 US9437584B2 (en) 2012-09-14 2013-09-05 Electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012202374A JP2014054718A (ja) 2012-09-14 2012-09-14 電子装置

Publications (2)

Publication Number Publication Date
JP2014054718A JP2014054718A (ja) 2014-03-27
JP2014054718A5 true JP2014054718A5 (enExample) 2014-05-08

Family

ID=50273639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012202374A Withdrawn JP2014054718A (ja) 2012-09-14 2012-09-14 電子装置

Country Status (3)

Country Link
US (1) US9437584B2 (enExample)
JP (1) JP2014054718A (enExample)
CN (1) CN103663348A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014221546A1 (de) * 2014-10-23 2016-04-28 Robert Bosch Gmbh Mikroelektronische Bauelementanordnung mit einer Mehrzahl von Substraten und entsprechendes Herstellungsverfahren
KR101720300B1 (ko) 2015-07-21 2017-03-28 주식회사 오킨스전자 접촉성이 개선된 범프를 포함하는 테스트 소켓용 ｍｅｍｓ 필름
KR102534734B1 (ko) 2018-09-03 2023-05-19 삼성전자 주식회사 반도체 패키지
JP7497604B2 (ja) * 2020-04-10 2024-06-11 セイコーエプソン株式会社 振動デバイス、電子機器および移動体

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005153067A (ja) * 2003-11-25 2005-06-16 Kyocera Corp 電子部品封止用基板およびそれを用いた電子装置の製造方法
JP2005335022A (ja) * 2004-05-28 2005-12-08 Sony Corp 微小デバイス及び電子機器
JP4688526B2 (ja) * 2005-03-03 2011-05-25 Ｏｋｉセミコンダクタ株式会社 半導体装置及びその製造方法
US7297574B2 (en) * 2005-06-17 2007-11-20 Infineon Technologies Ag Multi-chip device and method for producing a multi-chip device
US8022554B2 (en) 2006-06-15 2011-09-20 Sitime Corporation Stacked die package for MEMS resonator system
KR100807050B1 (ko) * 2006-08-23 2008-02-25 동부일렉트로닉스 주식회사 반도체 소자 및 그 제조방법
US7807583B2 (en) 2006-08-25 2010-10-05 Imec High aspect ratio via etch
JP5276289B2 (ja) 2006-08-25 2013-08-28 アイメック 高アスペクト比ビアエッチング
US7514775B2 (en) * 2006-10-09 2009-04-07 Taiwan Semiconductor Manufacturing Co., Ltd. Stacked structures and methods of fabricating stacked structures
KR100834826B1 (ko) 2007-01-25 2008-06-03 삼성전자주식회사 취급손상을 줄인 집적회로 모듈의 구조 및 모듈의 종단저항 배치방법
JP4792143B2 (ja) 2007-02-22 2011-10-12 株式会社デンソー 半導体装置およびその製造方法
JP2008288384A (ja) 2007-05-17 2008-11-27 Sony Corp ３次元積層デバイスとその製造方法、及び３次元積層デバイスの接合方法
KR100891805B1 (ko) 2007-05-25 2009-04-07 주식회사 네패스 웨이퍼 레벨 시스템 인 패키지 및 그 제조 방법
JP4825778B2 (ja) 2007-11-16 2011-11-30 株式会社日立製作所 半導体装置およびその製造方法
US20090194829A1 (en) * 2008-01-31 2009-08-06 Shine Chung MEMS Packaging Including Integrated Circuit Dies
WO2010047228A1 (ja) * 2008-10-21 2010-04-29 日本電気株式会社 配線基板およびその製造方法
JP2010112763A (ja) 2008-11-04 2010-05-20 Toshiba Corp 半導体装置およびその製造方法

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