JP2016513872A5 - - Google Patents

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Publication number
JP2016513872A5
JP2016513872A5 JP2015561619A JP2015561619A JP2016513872A5 JP 2016513872 A5 JP2016513872 A5 JP 2016513872A5 JP 2015561619 A JP2015561619 A JP 2015561619A JP 2015561619 A JP2015561619 A JP 2015561619A JP 2016513872 A5 JP2016513872 A5 JP 2016513872A5
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JP
Japan
Prior art keywords
package
integrated circuit
die
substrate
tsvs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015561619A
Other languages
English (en)
Japanese (ja)
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JP2016513872A (ja
Filing date
Publication date
Priority claimed from US13/791,223 external-priority patent/US20140252561A1/en
Application filed filed Critical
Publication of JP2016513872A publication Critical patent/JP2016513872A/ja
Publication of JP2016513872A5 publication Critical patent/JP2016513872A5/ja
Pending legal-status Critical Current

Links

JP2015561619A 2013-03-08 2014-03-05 ビア使用パッケージオンパッケージ Pending JP2016513872A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/791,223 US20140252561A1 (en) 2013-03-08 2013-03-08 Via-enabled package-on-package
US13/791,223 2013-03-08
PCT/US2014/020868 WO2014138285A1 (en) 2013-03-08 2014-03-05 Via-enabled package-on-package

Publications (2)

Publication Number Publication Date
JP2016513872A JP2016513872A (ja) 2016-05-16
JP2016513872A5 true JP2016513872A5 (enExample) 2017-03-23

Family

ID=50382674

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015561619A Pending JP2016513872A (ja) 2013-03-08 2014-03-05 ビア使用パッケージオンパッケージ

Country Status (6)

Country Link
US (1) US20140252561A1 (enExample)
EP (1) EP2965357A1 (enExample)
JP (1) JP2016513872A (enExample)
KR (1) KR20150127162A (enExample)
CN (1) CN105027282A (enExample)
WO (1) WO2014138285A1 (enExample)

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Publication number Priority date Publication date Assignee Title
US9070644B2 (en) 2013-03-15 2015-06-30 Taiwan Semiconductor Manufacturing Company, Ltd. Packaging mechanisms for dies with different sizes of connectors
US9646894B2 (en) 2013-03-15 2017-05-09 Taiwan Semiconductor Manufacturing Company, Ltd. Packaging mechanisms for dies with different sizes of connectors
KR102245770B1 (ko) * 2013-10-29 2021-04-28 삼성전자주식회사 반도체 패키지 장치
KR102198858B1 (ko) * 2014-07-24 2021-01-05 삼성전자 주식회사 인터포저 기판을 갖는 반도체 패키지 적층 구조체
US9859202B2 (en) * 2015-06-24 2018-01-02 Dyi-chung Hu Spacer connector
CN106672888B (zh) * 2015-11-11 2022-03-11 恩智浦美国有限公司 封装集成电路管芯的方法和器件
KR102372300B1 (ko) * 2015-11-26 2022-03-08 삼성전자주식회사 스택 패키지 및 그 제조 방법
US10181456B2 (en) * 2017-03-16 2019-01-15 Intel Corporation Multi-package integrated circuit assembly with package on package interconnects
US10438930B2 (en) 2017-06-30 2019-10-08 Intel Corporation Package on package thermal transfer systems and methods
CN107564900B (zh) * 2017-08-29 2019-09-03 中国电子科技集团公司第五十八研究所 基于射频信号传输的扇出型封装结构及制造方法
US10636774B2 (en) * 2017-09-06 2020-04-28 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming a 3D integrated system-in-package module
KR102519571B1 (ko) 2018-06-11 2023-04-10 삼성전자주식회사 반도체 패키지

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
KR100817073B1 (ko) * 2006-11-03 2008-03-26 삼성전자주식회사 휨방지용 보강부재가 기판에 연결된 반도체 칩 스택 패키지
US8063846B2 (en) * 2006-12-28 2011-11-22 Sanyo Electric Co., Ltd. Semiconductor module and mobile apparatus
US8421244B2 (en) * 2007-05-08 2013-04-16 Samsung Electronics Co., Ltd. Semiconductor package and method of forming the same
JP2009141169A (ja) * 2007-12-07 2009-06-25 Shinko Electric Ind Co Ltd 半導体装置
US8106520B2 (en) * 2008-09-11 2012-01-31 Micron Technology, Inc. Signal delivery in stacked device
US9230898B2 (en) * 2009-08-17 2016-01-05 Stats Chippac Ltd. Integrated circuit packaging system with package-on-package and method of manufacture thereof
US8518752B2 (en) * 2009-12-02 2013-08-27 Stats Chippac Ltd. Integrated circuit packaging system with stackable package and method of manufacture thereof
US8519537B2 (en) * 2010-02-26 2013-08-27 Taiwan Semiconductor Manufacturing Company, Ltd. 3D semiconductor package interposer with die cavity
KR101695846B1 (ko) * 2010-03-02 2017-01-16 삼성전자 주식회사 적층형 반도체 패키지
US8541872B2 (en) * 2010-06-02 2013-09-24 Stats Chippac Ltd. Integrated circuit package system with package stacking and method of manufacture thereof
US8217502B2 (en) * 2010-06-08 2012-07-10 Stats Chippac Ltd. Integrated circuit packaging system with multipart conductive pillars and method of manufacture thereof
US20120193785A1 (en) * 2011-02-01 2012-08-02 Megica Corporation Multichip Packages
KR20120091691A (ko) * 2011-02-09 2012-08-20 삼성전자주식회사 휨 방지용 접합패턴을 갖는 반도체 소자 및 그 제조방법
US8716065B2 (en) * 2011-09-23 2014-05-06 Stats Chippac Ltd. Integrated circuit packaging system with encapsulation and method of manufacture thereof
JP2013077711A (ja) * 2011-09-30 2013-04-25 Sony Corp 半導体装置および半導体装置の製造方法
TWI476888B (zh) * 2011-10-31 2015-03-11 欣興電子股份有限公司 嵌埋穿孔中介層之封裝基板及其製法
KR101818507B1 (ko) * 2012-01-11 2018-01-15 삼성전자 주식회사 반도체 패키지
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US9478474B2 (en) * 2012-12-28 2016-10-25 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and apparatus for forming package-on-packages

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