KR20150127162A - 비아-인에이블 패키지-온-패키지 - Google Patents

비아-인에이블 패키지-온-패키지 Download PDF

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Publication number
KR20150127162A
KR20150127162A KR1020157027585A KR20157027585A KR20150127162A KR 20150127162 A KR20150127162 A KR 20150127162A KR 1020157027585 A KR1020157027585 A KR 1020157027585A KR 20157027585 A KR20157027585 A KR 20157027585A KR 20150127162 A KR20150127162 A KR 20150127162A
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KR
South Korea
Prior art keywords
package
die
substrate
integrated circuit
interposer
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Application number
KR1020157027585A
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English (en)
Korean (ko)
Inventor
더로다미 조셀린 리스크
비드야 라마찬드란
재식 이
Original Assignee
퀄컴 인코포레이티드
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Publication of KR20150127162A publication Critical patent/KR20150127162A/ko
Withdrawn legal-status Critical Current

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    • H10W70/611—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/073—Apertured devices mounted on one or more rods passed through the apertures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, the devices being individual devices of subclass H10D or integrated devices of class H10
    • H10W70/635—
    • H10W90/00—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H01L2224/1401—Structure
    • H01L2224/1403—Bump connectors having different sizes, e.g. different diameters, heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
    • H01L2224/1701—Structure
    • H01L2224/1703—Bump connectors having different sizes, e.g. different diameters, heights or widths
    • H10W70/60—
    • H10W72/07232—
    • H10W72/07252—
    • H10W72/07254—
    • H10W72/227—
    • H10W72/244—
    • H10W72/247—
    • H10W72/248—
    • H10W72/252—
    • H10W72/29—
    • H10W72/884—
    • H10W72/9226—
    • H10W72/923—
    • H10W72/944—
    • H10W74/15—
    • H10W90/297—
    • H10W90/722—
    • H10W90/724—
    • H10W90/732—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020157027585A 2013-03-08 2014-03-05 비아-인에이블 패키지-온-패키지 Withdrawn KR20150127162A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/791,223 US20140252561A1 (en) 2013-03-08 2013-03-08 Via-enabled package-on-package
US13/791,223 2013-03-08
PCT/US2014/020868 WO2014138285A1 (en) 2013-03-08 2014-03-05 Via-enabled package-on-package

Publications (1)

Publication Number Publication Date
KR20150127162A true KR20150127162A (ko) 2015-11-16

Family

ID=50382674

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157027585A Withdrawn KR20150127162A (ko) 2013-03-08 2014-03-05 비아-인에이블 패키지-온-패키지

Country Status (6)

Country Link
US (1) US20140252561A1 (enExample)
EP (1) EP2965357A1 (enExample)
JP (1) JP2016513872A (enExample)
KR (1) KR20150127162A (enExample)
CN (1) CN105027282A (enExample)
WO (1) WO2014138285A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9070644B2 (en) 2013-03-15 2015-06-30 Taiwan Semiconductor Manufacturing Company, Ltd. Packaging mechanisms for dies with different sizes of connectors
US9646894B2 (en) * 2013-03-15 2017-05-09 Taiwan Semiconductor Manufacturing Company, Ltd. Packaging mechanisms for dies with different sizes of connectors
KR102245770B1 (ko) * 2013-10-29 2021-04-28 삼성전자주식회사 반도체 패키지 장치
KR102198858B1 (ko) * 2014-07-24 2021-01-05 삼성전자 주식회사 인터포저 기판을 갖는 반도체 패키지 적층 구조체
US9859202B2 (en) * 2015-06-24 2018-01-02 Dyi-chung Hu Spacer connector
CN106672888B (zh) * 2015-11-11 2022-03-11 恩智浦美国有限公司 封装集成电路管芯的方法和器件
KR102372300B1 (ko) * 2015-11-26 2022-03-08 삼성전자주식회사 스택 패키지 및 그 제조 방법
US10181456B2 (en) * 2017-03-16 2019-01-15 Intel Corporation Multi-package integrated circuit assembly with package on package interconnects
US10438930B2 (en) * 2017-06-30 2019-10-08 Intel Corporation Package on package thermal transfer systems and methods
CN107564900B (zh) * 2017-08-29 2019-09-03 中国电子科技集团公司第五十八研究所 基于射频信号传输的扇出型封装结构及制造方法
US10636774B2 (en) 2017-09-06 2020-04-28 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming a 3D integrated system-in-package module
KR102519571B1 (ko) 2018-06-11 2023-04-10 삼성전자주식회사 반도체 패키지
KR102899838B1 (ko) * 2020-09-10 2025-12-11 삼성전기주식회사 전자부품 장치

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KR100817073B1 (ko) * 2006-11-03 2008-03-26 삼성전자주식회사 휨방지용 보강부재가 기판에 연결된 반도체 칩 스택 패키지
US8063846B2 (en) * 2006-12-28 2011-11-22 Sanyo Electric Co., Ltd. Semiconductor module and mobile apparatus
US8421244B2 (en) * 2007-05-08 2013-04-16 Samsung Electronics Co., Ltd. Semiconductor package and method of forming the same
JP2009141169A (ja) * 2007-12-07 2009-06-25 Shinko Electric Ind Co Ltd 半導体装置
US8106520B2 (en) * 2008-09-11 2012-01-31 Micron Technology, Inc. Signal delivery in stacked device
US9230898B2 (en) * 2009-08-17 2016-01-05 Stats Chippac Ltd. Integrated circuit packaging system with package-on-package and method of manufacture thereof
US8518752B2 (en) * 2009-12-02 2013-08-27 Stats Chippac Ltd. Integrated circuit packaging system with stackable package and method of manufacture thereof
US8519537B2 (en) * 2010-02-26 2013-08-27 Taiwan Semiconductor Manufacturing Company, Ltd. 3D semiconductor package interposer with die cavity
KR101695846B1 (ko) * 2010-03-02 2017-01-16 삼성전자 주식회사 적층형 반도체 패키지
US8541872B2 (en) * 2010-06-02 2013-09-24 Stats Chippac Ltd. Integrated circuit package system with package stacking and method of manufacture thereof
US8217502B2 (en) * 2010-06-08 2012-07-10 Stats Chippac Ltd. Integrated circuit packaging system with multipart conductive pillars and method of manufacture thereof
US20120193785A1 (en) * 2011-02-01 2012-08-02 Megica Corporation Multichip Packages
KR20120091691A (ko) * 2011-02-09 2012-08-20 삼성전자주식회사 휨 방지용 접합패턴을 갖는 반도체 소자 및 그 제조방법
US8716065B2 (en) * 2011-09-23 2014-05-06 Stats Chippac Ltd. Integrated circuit packaging system with encapsulation and method of manufacture thereof
JP2013077711A (ja) * 2011-09-30 2013-04-25 Sony Corp 半導体装置および半導体装置の製造方法
TWI476888B (zh) * 2011-10-31 2015-03-11 欣興電子股份有限公司 嵌埋穿孔中介層之封裝基板及其製法
KR101818507B1 (ko) * 2012-01-11 2018-01-15 삼성전자 주식회사 반도체 패키지
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US9478474B2 (en) * 2012-12-28 2016-10-25 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and apparatus for forming package-on-packages

Also Published As

Publication number Publication date
JP2016513872A (ja) 2016-05-16
EP2965357A1 (en) 2016-01-13
WO2014138285A1 (en) 2014-09-12
US20140252561A1 (en) 2014-09-11
CN105027282A (zh) 2015-11-04

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