JP2014027270A - 装着装置の装着ヘッドのキネマティック保持システム - Google Patents

装着装置の装着ヘッドのキネマティック保持システム Download PDF

Info

Publication number
JP2014027270A
JP2014027270A JP2013147719A JP2013147719A JP2014027270A JP 2014027270 A JP2014027270 A JP 2014027270A JP 2013147719 A JP2013147719 A JP 2013147719A JP 2013147719 A JP2013147719 A JP 2013147719A JP 2014027270 A JP2014027270 A JP 2014027270A
Authority
JP
Japan
Prior art keywords
mounting head
joint
mounting
holding system
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2013147719A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014027270A5 (https=
Inventor
Kostner Hannes
ハンネス コストナー
Dietmar Lackner
ディートマー ラクナー
Florian Speer
フロリアン シュペール
Widauer Martin
マルティン ヴィダウアー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
VESI SWITZERLAND AG
Original Assignee
VESI SWITZERLAND AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by VESI SWITZERLAND AG filed Critical VESI SWITZERLAND AG
Publication of JP2014027270A publication Critical patent/JP2014027270A/ja
Publication of JP2014027270A5 publication Critical patent/JP2014027270A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J17/00—Joints
    • B25J17/02—Wrist joints
    • B25J17/0208—Compliance devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Die Bonding (AREA)
JP2013147719A 2012-07-24 2013-07-16 装着装置の装着ヘッドのキネマティック保持システム Withdrawn JP2014027270A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012014558.6 2012-07-24
DE102012014558.6A DE102012014558B4 (de) 2012-07-24 2012-07-24 Kinematisches Haltesystem für einen Bestückkopf einer Bestückvorrichtung

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017236312A Division JP6547979B2 (ja) 2012-07-24 2017-12-08 装着装置の装着ヘッドのキネマティック保持システム

Publications (2)

Publication Number Publication Date
JP2014027270A true JP2014027270A (ja) 2014-02-06
JP2014027270A5 JP2014027270A5 (https=) 2016-08-18

Family

ID=49911952

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2013147719A Withdrawn JP2014027270A (ja) 2012-07-24 2013-07-16 装着装置の装着ヘッドのキネマティック保持システム
JP2017236312A Active JP6547979B2 (ja) 2012-07-24 2017-12-08 装着装置の装着ヘッドのキネマティック保持システム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2017236312A Active JP6547979B2 (ja) 2012-07-24 2017-12-08 装着装置の装着ヘッドのキネマティック保持システム

Country Status (8)

Country Link
US (2) US9364953B2 (https=)
JP (2) JP2014027270A (https=)
KR (2) KR102080351B1 (https=)
CN (1) CN103579046B (https=)
DE (1) DE102012014558B4 (https=)
MY (1) MY183739A (https=)
SG (1) SG196716A1 (https=)
TW (1) TWI568553B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018092228A1 (ja) * 2016-11-17 2018-05-24 株式会社Ｆｕｊｉ 作業機

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102425309B1 (ko) * 2016-10-12 2022-07-26 삼성전자주식회사 본딩 헤드와 스테이지 사이의 평행도 보정 장치 및 이를 포함하는 칩 본더
US10050008B1 (en) * 2017-01-24 2018-08-14 Asm Technology Singapore Pte Ltd Method and system for automatic bond arm alignment
DE102018115144A1 (de) * 2018-06-23 2019-12-24 Besi Switzerland Ag Stellantrieb für einen Bondkopf
KR102175151B1 (ko) * 2019-01-04 2020-11-06 마점래 2차 전지 조립용 가변형 코킹장치
CN110369985B (zh) * 2019-07-05 2024-05-17 江苏烽禾升科技股份有限公司 一种异形笔夹入料机构
DE102020213148B4 (de) * 2020-10-19 2026-04-23 Mahle International Gmbh Vorrichtung zur Montage eines Stopfens in einer Hohlwelle
KR102874158B1 (ko) 2020-10-22 2025-10-22 삼성전자주식회사 반도체 공정 스테이지 구조체, 반도체 칩 픽업 시스템 및 픽업헤드 틸팅 제어 방법
EP4052868A1 (de) * 2021-02-15 2022-09-07 Stöger Automation GmbH Automatisches schraubsystem zum verbinden von bauteilen
CN115734512B (zh) * 2022-11-30 2026-02-06 格力电器(赣州)有限公司 存取结构
CN117208572B (zh) * 2023-11-09 2024-02-13 四川名人居门窗有限公司 一种玻璃吸盘车摆动结构

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09283990A (ja) * 1996-04-10 1997-10-31 Toshiba Corp マウントヘッド及びボンディング装置
JP2002222820A (ja) * 2001-01-26 2002-08-09 Sony Corp 物品組立装置
JP2011245595A (ja) * 2010-05-27 2011-12-08 Sharp Corp 移載ハンドおよび移載方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2527967B1 (fr) * 1982-06-07 1985-07-19 Merlin Gerin Robot industriel perfectionne pilote par un automate programmable
US4747198A (en) * 1985-01-21 1988-05-31 Fuji Machine Mfg. Co., Ltd. Method and apparatus for detecting hold-position of electronic component, and apparatus for mounting electronic component
JPH07122830B2 (ja) * 1989-05-31 1995-12-25 新技術事業団 超精密位置決め装置
TW278212B (https=) 1992-05-06 1996-06-11 Sumitomo Electric Industries
JP3099254B2 (ja) 1994-02-28 2000-10-16 安藤電気株式会社 浮動機構つき吸着ハンドおよび搬送接触機構
US5614118A (en) * 1994-10-27 1997-03-25 Weber; Wolfgang Hot plate welder with pivotably movable carriage unit
JPH08162797A (ja) * 1994-12-08 1996-06-21 Matsushita Electric Ind Co Ltd 電子部品実装装置
US5697480A (en) * 1995-03-22 1997-12-16 Syron Engineering & Manufacturing Corporation Breakaway mount for robot arm
JP3853402B2 (ja) * 1995-07-13 2006-12-06 東レエンジニアリング株式会社 チップボンディング装置
JPH10107495A (ja) 1996-09-26 1998-04-24 Matsushita Electric Ind Co Ltd 部品装着装置
JP3421968B2 (ja) 1999-02-23 2003-06-30 エヌイーシーマシナリー株式会社 コレット及びそれを用いたマウント装置
US6345728B1 (en) * 1999-04-28 2002-02-12 Matsushita Electric Industrial Co., Ltd. Component feeding method and apparatus
JP2000332495A (ja) 1999-05-25 2000-11-30 Sony Corp 部品装着装置及び部品装着方法
DE60034248T2 (de) * 1999-09-28 2008-02-28 Matsushita Electric Industrial Co., Ltd., Kadoma Methode zur erzeugung von daten für bauteilbestückungseinrichtung, bestückungsmethode und einrichtungen dafür
US7089073B2 (en) * 2000-02-17 2006-08-08 Matsushita Electric Industrial Co., Ltd. Component mounting apparatus and component mounting method, and recognition apparatus for a component mount panel, component mounting apparatus for a liquid crystal panel, and component mounting method for a liquid crystal panel
US6463359B2 (en) * 2001-02-20 2002-10-08 Infotech Ag Micro-alignment pick-up head
JP4616514B2 (ja) * 2001-06-07 2011-01-19 富士機械製造株式会社 電気部品装着システムおよびそれにおける位置誤差検出方法
JP4303463B2 (ja) * 2002-11-29 2009-07-29 パナソニック株式会社 基板搬送装置及び部品実装における基板搬送方法
JP4334892B2 (ja) * 2003-03-20 2009-09-30 パナソニック株式会社 部品実装方法
JP4390503B2 (ja) * 2003-08-27 2009-12-24 パナソニック株式会社 部品実装装置及び部品実装方法
CN101632164B (zh) 2006-10-31 2016-02-24 库力科及索法模压焊接有限责任公司 用于相对于基底定位和/或压制平面部件的装置及用于相对于基底定位拾取工具的方法
WO2008100111A1 (en) 2007-02-15 2008-08-21 Jt Corporation Picker for transfer tool and transfer tool having the same
KR100921398B1 (ko) * 2007-02-15 2009-10-14 (주)제이티 이송툴의 픽커 및 그를 가지는 이송툴
EP2007187A1 (en) * 2007-06-19 2008-12-24 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Placement device and assembly device
EP2088844A1 (en) 2008-02-05 2009-08-12 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Placement device, assembly device and method of placing a component
US8442661B1 (en) * 2008-11-25 2013-05-14 Anybots 2.0, Inc. Remotely controlled self-balancing robot including a stabilized laser pointer
JP5403247B2 (ja) * 2009-09-07 2014-01-29 村田機械株式会社 基板移載装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09283990A (ja) * 1996-04-10 1997-10-31 Toshiba Corp マウントヘッド及びボンディング装置
JP2002222820A (ja) * 2001-01-26 2002-08-09 Sony Corp 物品組立装置
JP2011245595A (ja) * 2010-05-27 2011-12-08 Sharp Corp 移載ハンドおよび移載方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018092228A1 (ja) * 2016-11-17 2018-05-24 株式会社Ｆｕｊｉ 作業機
JPWO2018092228A1 (ja) * 2016-11-17 2019-07-18 株式会社Ｆｕｊｉ 作業機

Also Published As

Publication number Publication date
MY183739A (en) 2021-03-10
KR20140015197A (ko) 2014-02-06
US9364953B2 (en) 2016-06-14
TW201412479A (zh) 2014-04-01
DE102012014558B4 (de) 2014-02-20
CN103579046A (zh) 2014-02-12
KR102080351B1 (ko) 2020-02-21
US20140030052A1 (en) 2014-01-30
DE102012014558A1 (de) 2014-01-30
CN103579046B (zh) 2017-12-19
KR102080447B1 (ko) 2020-02-21
US20160167237A1 (en) 2016-06-16
JP2018098508A (ja) 2018-06-21
TWI568553B (zh) 2017-02-01
JP6547979B2 (ja) 2019-07-24
US9956692B2 (en) 2018-05-01
KR20190126040A (ko) 2019-11-08
SG196716A1 (en) 2014-02-13

Similar Documents

Publication Publication Date Title
JP6547979B2 (ja) 装着装置の装着ヘッドのキネマティック保持システム
CN100580545C (zh) 用于样本检测和处理的高分辨率动态定位机构
KR102394745B1 (ko) 전자 또는 광학 부품을 기판상에 실장하기 위한 방법 및 장치
JP5751736B2 (ja) ロボット運動補償装置
JP6111065B2 (ja) 自動教示システム及び教示方法
JP5580163B2 (ja) 実装装置の平行度調整方法および平行度調整装置
JP7718990B2 (ja) ロボット支援表面加工における位置決め誤差の補正
JP2014027270A5 (https=)
KR101848994B1 (ko) 병진형 델타 로봇 및 이를 포함하는 수술용 로봇
US6758721B2 (en) Apparatus and method for lapping magnetic heads
JP2021529441A (ja) 接合ヘッドのためのアクチュエータ
JP2021529441A5 (https=)
JP3042092B2 (ja) 対象物取扱装置
TWI900950B (zh) 線性致動器的兩軸運動
US20240186278A1 (en) Mounting device and mounting method
KR20140022778A (ko) 능동형 자기 베어링 상에 장착된 로봇의 조정 방법
US10500725B2 (en) Device and method for compensating weight
TWI294324B (en) Wire bonder
CN221960946U (zh) 一种晶圆预对准用装载装置
US20060104787A1 (en) Substrate delivering apparatus
CN120237076B (zh) 晶圆搬运末端执行器位姿调整机构、搬运系统及搬运方法
JP2005332836A (ja) 電子部品実装機
JPWO2019244136A5 (https=)
HK40048985A (en) Actuating drive for a bonder head

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160704

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160705

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20161102

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170707

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170815

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20171115

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20180105

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180205