KR102080351B1 - 배치 장치의 배치 헤드를 위한 기구학적 유지 시스템 - Google Patents

배치 장치의 배치 헤드를 위한 기구학적 유지 시스템 Download PDF

Info

Publication number
KR102080351B1
KR102080351B1 KR1020130086070A KR20130086070A KR102080351B1 KR 102080351 B1 KR102080351 B1 KR 102080351B1 KR 1020130086070 A KR1020130086070 A KR 1020130086070A KR 20130086070 A KR20130086070 A KR 20130086070A KR 102080351 B1 KR102080351 B1 KR 102080351B1
Authority
KR
South Korea
Prior art keywords
placement head
head
placement
variable
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020130086070A
Other languages
English (en)
Korean (ko)
Other versions
KR20140015197A (ko
Inventor
하네스 코스트너
디트마르 라크네르
플로리안 슈페어
마르틴 비트아우어
Original Assignee
베시 스위처랜드 아게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 베시 스위처랜드 아게 filed Critical 베시 스위처랜드 아게
Publication of KR20140015197A publication Critical patent/KR20140015197A/ko
Application granted granted Critical
Publication of KR102080351B1 publication Critical patent/KR102080351B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J17/00—Joints
    • B25J17/02—Wrist joints
    • B25J17/0208—Compliance devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Die Bonding (AREA)
KR1020130086070A 2012-07-24 2013-07-22 배치 장치의 배치 헤드를 위한 기구학적 유지 시스템 Active KR102080351B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012014558.6 2012-07-24
DE102012014558.6A DE102012014558B4 (de) 2012-07-24 2012-07-24 Kinematisches Haltesystem für einen Bestückkopf einer Bestückvorrichtung

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020190138306A Division KR102080447B1 (ko) 2012-07-24 2019-11-01 배치 장치의 배치 헤드를 위한 기구학적 유지 시스템

Publications (2)

Publication Number Publication Date
KR20140015197A KR20140015197A (ko) 2014-02-06
KR102080351B1 true KR102080351B1 (ko) 2020-02-21

Family

ID=49911952

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020130086070A Active KR102080351B1 (ko) 2012-07-24 2013-07-22 배치 장치의 배치 헤드를 위한 기구학적 유지 시스템
KR1020190138306A Active KR102080447B1 (ko) 2012-07-24 2019-11-01 배치 장치의 배치 헤드를 위한 기구학적 유지 시스템

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020190138306A Active KR102080447B1 (ko) 2012-07-24 2019-11-01 배치 장치의 배치 헤드를 위한 기구학적 유지 시스템

Country Status (8)

Country Link
US (2) US9364953B2 (https=)
JP (2) JP2014027270A (https=)
KR (2) KR102080351B1 (https=)
CN (1) CN103579046B (https=)
DE (1) DE102012014558B4 (https=)
MY (1) MY183739A (https=)
SG (1) SG196716A1 (https=)
TW (1) TWI568553B (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102425309B1 (ko) * 2016-10-12 2022-07-26 삼성전자주식회사 본딩 헤드와 스테이지 사이의 평행도 보정 장치 및 이를 포함하는 칩 본더
US10969761B2 (en) * 2016-11-17 2021-04-06 Fuji Corporation Operation machine
US10050008B1 (en) * 2017-01-24 2018-08-14 Asm Technology Singapore Pte Ltd Method and system for automatic bond arm alignment
DE102018115144A1 (de) * 2018-06-23 2019-12-24 Besi Switzerland Ag Stellantrieb für einen Bondkopf
KR102175151B1 (ko) * 2019-01-04 2020-11-06 마점래 2차 전지 조립용 가변형 코킹장치
CN110369985B (zh) * 2019-07-05 2024-05-17 江苏烽禾升科技股份有限公司 一种异形笔夹入料机构
DE102020213148B4 (de) * 2020-10-19 2026-04-23 Mahle International Gmbh Vorrichtung zur Montage eines Stopfens in einer Hohlwelle
KR102874158B1 (ko) 2020-10-22 2025-10-22 삼성전자주식회사 반도체 공정 스테이지 구조체, 반도체 칩 픽업 시스템 및 픽업헤드 틸팅 제어 방법
EP4052868A1 (de) * 2021-02-15 2022-09-07 Stöger Automation GmbH Automatisches schraubsystem zum verbinden von bauteilen
CN115734512B (zh) * 2022-11-30 2026-02-06 格力电器(赣州)有限公司 存取结构
CN117208572B (zh) * 2023-11-09 2024-02-13 四川名人居门窗有限公司 一种玻璃吸盘车摆动结构

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5614118A (en) 1994-10-27 1997-03-25 Weber; Wolfgang Hot plate welder with pivotably movable carriage unit
US5697480A (en) 1995-03-22 1997-12-16 Syron Engineering & Manufacturing Corporation Breakaway mount for robot arm
JP2002222820A (ja) 2001-01-26 2002-08-09 Sony Corp 物品組立装置
JP2011245595A (ja) 2010-05-27 2011-12-08 Sharp Corp 移載ハンドおよび移載方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2527967B1 (fr) * 1982-06-07 1985-07-19 Merlin Gerin Robot industriel perfectionne pilote par un automate programmable
US4747198A (en) * 1985-01-21 1988-05-31 Fuji Machine Mfg. Co., Ltd. Method and apparatus for detecting hold-position of electronic component, and apparatus for mounting electronic component
JPH07122830B2 (ja) * 1989-05-31 1995-12-25 新技術事業団 超精密位置決め装置
TW278212B (https=) 1992-05-06 1996-06-11 Sumitomo Electric Industries
JP3099254B2 (ja) 1994-02-28 2000-10-16 安藤電気株式会社 浮動機構つき吸着ハンドおよび搬送接触機構
JPH08162797A (ja) * 1994-12-08 1996-06-21 Matsushita Electric Ind Co Ltd 電子部品実装装置
JP3853402B2 (ja) * 1995-07-13 2006-12-06 東レエンジニアリング株式会社 チップボンディング装置
JPH09283990A (ja) * 1996-04-10 1997-10-31 Toshiba Corp マウントヘッド及びボンディング装置
JPH10107495A (ja) 1996-09-26 1998-04-24 Matsushita Electric Ind Co Ltd 部品装着装置
JP3421968B2 (ja) 1999-02-23 2003-06-30 エヌイーシーマシナリー株式会社 コレット及びそれを用いたマウント装置
US6345728B1 (en) * 1999-04-28 2002-02-12 Matsushita Electric Industrial Co., Ltd. Component feeding method and apparatus
JP2000332495A (ja) 1999-05-25 2000-11-30 Sony Corp 部品装着装置及び部品装着方法
DE60034248T2 (de) * 1999-09-28 2008-02-28 Matsushita Electric Industrial Co., Ltd., Kadoma Methode zur erzeugung von daten für bauteilbestückungseinrichtung, bestückungsmethode und einrichtungen dafür
US7089073B2 (en) * 2000-02-17 2006-08-08 Matsushita Electric Industrial Co., Ltd. Component mounting apparatus and component mounting method, and recognition apparatus for a component mount panel, component mounting apparatus for a liquid crystal panel, and component mounting method for a liquid crystal panel
US6463359B2 (en) * 2001-02-20 2002-10-08 Infotech Ag Micro-alignment pick-up head
JP4616514B2 (ja) * 2001-06-07 2011-01-19 富士機械製造株式会社 電気部品装着システムおよびそれにおける位置誤差検出方法
JP4303463B2 (ja) * 2002-11-29 2009-07-29 パナソニック株式会社 基板搬送装置及び部品実装における基板搬送方法
JP4334892B2 (ja) * 2003-03-20 2009-09-30 パナソニック株式会社 部品実装方法
JP4390503B2 (ja) * 2003-08-27 2009-12-24 パナソニック株式会社 部品実装装置及び部品実装方法
CN101632164B (zh) 2006-10-31 2016-02-24 库力科及索法模压焊接有限责任公司 用于相对于基底定位和/或压制平面部件的装置及用于相对于基底定位拾取工具的方法
WO2008100111A1 (en) 2007-02-15 2008-08-21 Jt Corporation Picker for transfer tool and transfer tool having the same
KR100921398B1 (ko) * 2007-02-15 2009-10-14 (주)제이티 이송툴의 픽커 및 그를 가지는 이송툴
EP2007187A1 (en) * 2007-06-19 2008-12-24 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Placement device and assembly device
EP2088844A1 (en) 2008-02-05 2009-08-12 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Placement device, assembly device and method of placing a component
US8442661B1 (en) * 2008-11-25 2013-05-14 Anybots 2.0, Inc. Remotely controlled self-balancing robot including a stabilized laser pointer
JP5403247B2 (ja) * 2009-09-07 2014-01-29 村田機械株式会社 基板移載装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5614118A (en) 1994-10-27 1997-03-25 Weber; Wolfgang Hot plate welder with pivotably movable carriage unit
US5697480A (en) 1995-03-22 1997-12-16 Syron Engineering & Manufacturing Corporation Breakaway mount for robot arm
JP2002222820A (ja) 2001-01-26 2002-08-09 Sony Corp 物品組立装置
JP2011245595A (ja) 2010-05-27 2011-12-08 Sharp Corp 移載ハンドおよび移載方法

Also Published As

Publication number Publication date
MY183739A (en) 2021-03-10
KR20140015197A (ko) 2014-02-06
US9364953B2 (en) 2016-06-14
TW201412479A (zh) 2014-04-01
JP2014027270A (ja) 2014-02-06
DE102012014558B4 (de) 2014-02-20
CN103579046A (zh) 2014-02-12
US20140030052A1 (en) 2014-01-30
DE102012014558A1 (de) 2014-01-30
CN103579046B (zh) 2017-12-19
KR102080447B1 (ko) 2020-02-21
US20160167237A1 (en) 2016-06-16
JP2018098508A (ja) 2018-06-21
TWI568553B (zh) 2017-02-01
JP6547979B2 (ja) 2019-07-24
US9956692B2 (en) 2018-05-01
KR20190126040A (ko) 2019-11-08
SG196716A1 (en) 2014-02-13

Similar Documents

Publication Publication Date Title
KR102080447B1 (ko) 배치 장치의 배치 헤드를 위한 기구학적 유지 시스템
CN100580545C (zh) 用于样本检测和处理的高分辨率动态定位机构
EP0327949B1 (en) Alignment stage device
CN113710420B (zh) 用于机器人辅助加工表面的装置
US20110062641A1 (en) Stage equipped with alignment function, processing apparatus having the stage equipped with alignment function, and method of aligning substrate
KR102394745B1 (ko) 전자 또는 광학 부품을 기판상에 실장하기 위한 방법 및 장치
JP7718990B2 (ja) ロボット支援表面加工における位置決め誤差の補正
KR20230062387A (ko) 슬라이드 유닛 및 스크라이브 헤드
JPH106199A (ja) 曲面研磨方法、及び曲面研磨装置
US6758721B2 (en) Apparatus and method for lapping magnetic heads
TWI397970B (zh) 提供大鍵合力的旋轉鍵合工具
TWI480968B (zh) 用於提供大鍵合力的晶粒鍵合機
JP3901529B2 (ja) 接合装置
US20240186278A1 (en) Mounting device and mounting method
JPH05131389A (ja) 対象物取扱装置
US20170113347A1 (en) Device and method for compensating weight
JP2000190273A (ja) エンドエフェクタのティルト機構
KR20210001920A (ko) 스크라이브 헤드 및 스크라이브 장치
US20060104787A1 (en) Substrate delivering apparatus
JPH10154012A (ja) ステージ機構
JP6709994B2 (ja) ステージ装置
KR20200124165A (ko) 스크라이브 헤드 및 스크라이브 장치
JP2003062733A (ja) ステージ装置
JPH06138947A (ja) 直線運動体の姿勢誤差制御装置
JPH05288254A (ja) テーブル送り装置

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

A107 Divisional application of patent
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0107 Divisional application

St.27 status event code: A-0-1-A10-A18-div-PA0107

St.27 status event code: A-0-1-A10-A16-div-PA0107

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

R17 Change to representative recorded

Free format text: ST27 STATUS EVENT CODE: A-5-5-R10-R17-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

R17-X000 Change to representative recorded

St.27 status event code: A-5-5-R10-R17-oth-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000