JP2018098508A - 装着装置の装着ヘッドのキネマティック保持システム - Google Patents
装着装置の装着ヘッドのキネマティック保持システム Download PDFInfo
- Publication number
- JP2018098508A JP2018098508A JP2017236312A JP2017236312A JP2018098508A JP 2018098508 A JP2018098508 A JP 2018098508A JP 2017236312 A JP2017236312 A JP 2017236312A JP 2017236312 A JP2017236312 A JP 2017236312A JP 2018098508 A JP2018098508 A JP 2018098508A
- Authority
- JP
- Japan
- Prior art keywords
- mounting head
- mounting
- joint
- solid joint
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J17/00—Joints
- B25J17/02—Wrist joints
- B25J17/0208—Compliance devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0095—Gripping heads and other end effectors with an external support, i.e. a support which does not belong to the manipulator or the object to be gripped, e.g. for maintaining the gripping head in an accurate position, guiding it or preventing vibrations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
Abstract
【解決手段】装着装置の装着ヘッド2のキネマティック保持システムが、装着ヘッド支持体1と装着ヘッド2との間に継手4’から或る距離を置いて配置される少なくとも1つの可変長さの保持部材を含む装着ヘッド位置合わせデバイスを備える。この保持部材は、装着ヘッド支持体1に対する装着ヘッド2の回動位置を決める。保持部材の長さは、装着動作中に、装着ヘッドガイドデバイスの変形によって生じる装着ヘッド2の軸誤差(傾斜)を相殺するように、基板3に対する装着ヘッド2の押圧力によって生じる装着ヘッドガイドデバイスの変形に応じて変更可能である。
【選択図】図14
Description
1.装着プロセス中に部品7が基板3に接触すると、アクチュエーター(複数の場合もあり)13が、力が付与されない状態に切り換えられる。基板3と部品7との間の摩擦によって部品7が固定される。このとき生じる変形は、押圧力の印加中に相殺される。
2.部品7が基板3に接触するとすぐに、アクチュエーター(複数の場合もあり)13が、部品7を適所に保つために特定の力又は可変の力を加える。
3.部品7が基板3に接触した後で、アクチュエーター(複数の場合もあり)13が、部品7を適所に保つために特定の経路に沿って変位する。
Claims (4)
- 電子部品又は光学部品(7)を基板(3)上に実装する装着装置の装着ヘッド(2)のキネマティック保持システムであって、
前記装着ヘッド(2)を保持する装着ヘッド支持体(1)を備える装着ヘッドガイドデバイス(18)、及び
前記装着ヘッド支持体(1)に対する前記装着ヘッド(2)の位置合わせを調整する装着ヘッド位置合わせデバイスを備え、前記装着ヘッド位置合わせデバイスは固体継手(20)を含み、該継手(20)によって、前記装着ヘッド(2)が前記装着ヘッド支持体(1)上で傾き調整可能に支持され、前記固体継手(20)は、前記装着ヘッド支持体(1)に強固に接続されている少なくとも1つの第1の固体継手アーム(22)を有する少なくとも1つの固体継手要素(21)と、前記装着ヘッド(2)に強固に接続されているとともに、前記少なくとも1つの第1の固体継手アーム(22)に弾性的に接続されている少なくとも1つの第2の固体継手(23)を含み、該少なくとも1つの第2の固体継手アーム(23)は、前記装着ヘッドガイドデバイス(18)の変形によって生じる前記装着ヘッド(2)の軸誤差(傾斜)を相殺するように、前記基板(3)に対する前記装着ヘッド(2)の押圧力によって生じる前記装着ヘッドガイドデバイス(18)の変形に応じて、前記少なくとも1つの第1の固体継手アーム(22)に対して弾性変形可能である、キネマティック保持システム。 - 前記固体継手要素(21)は、2つの第1の固体継手アーム(22)と1つの第2の継手アーム(23)を備え、該2つの第1の固体継手アーム(22)は互いに平行に延び、前記装着ヘッド(2)の反対側に配置され、前記装着ヘッド(2)から横方向に離間し、かつ端部側が横行アーム(24)によって互いに接続されており、また、前記固体継手要素(21)は、前記2つの第1の固体継手アーム(22)間の中央に配置されているとともに前記横行アーム(24)にも接続されている、請求項1に記載のキネマティック保持システム。
- 前記固体継手(20)の回転軸(26)が、変形回転軸(25)に対して配置され、該変形回転軸(25)を中心に、前記固体継手(20)の前記回転軸(26)及び前記変形回転軸(25)を通る直線(1)が、前記装着ヘッド(2)の無負荷状態及び負荷状態において、前記変形回転軸(25)が配置される水平面(h)に対して−45°〜+45°の角度範囲にあるように、前記押圧力に反応して前記装着ヘッドガイドデバイス(18)の変形が生じる、請求項1又は2に記載の保持システム。
- 前記固体継手(20)の前記回転軸(26)は前記装着ヘッド(2)の無負荷状態では前記変形回転軸(25)の下に配置され、全装着力下では前記変形回転軸(25)の上に配置される、請求項3に記載の保持システム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012014558.6 | 2012-07-24 | ||
DE102012014558.6A DE102012014558B4 (de) | 2012-07-24 | 2012-07-24 | Kinematisches Haltesystem für einen Bestückkopf einer Bestückvorrichtung |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013147719A Division JP2014027270A (ja) | 2012-07-24 | 2013-07-16 | 装着装置の装着ヘッドのキネマティック保持システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018098508A true JP2018098508A (ja) | 2018-06-21 |
JP6547979B2 JP6547979B2 (ja) | 2019-07-24 |
Family
ID=49911952
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013147719A Withdrawn JP2014027270A (ja) | 2012-07-24 | 2013-07-16 | 装着装置の装着ヘッドのキネマティック保持システム |
JP2017236312A Active JP6547979B2 (ja) | 2012-07-24 | 2017-12-08 | 装着装置の装着ヘッドのキネマティック保持システム |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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JP2013147719A Withdrawn JP2014027270A (ja) | 2012-07-24 | 2013-07-16 | 装着装置の装着ヘッドのキネマティック保持システム |
Country Status (8)
Country | Link |
---|---|
US (2) | US9364953B2 (ja) |
JP (2) | JP2014027270A (ja) |
KR (2) | KR102080351B1 (ja) |
CN (1) | CN103579046B (ja) |
DE (1) | DE102012014558B4 (ja) |
MY (1) | MY183739A (ja) |
SG (1) | SG196716A1 (ja) |
TW (1) | TWI568553B (ja) |
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US10969761B2 (en) * | 2016-11-17 | 2021-04-06 | Fuji Corporation | Operation machine |
US10050008B1 (en) * | 2017-01-24 | 2018-08-14 | Asm Technology Singapore Pte Ltd | Method and system for automatic bond arm alignment |
DE102018115144A1 (de) * | 2018-06-23 | 2019-12-24 | Besi Switzerland Ag | Stellantrieb für einen Bondkopf |
KR102175151B1 (ko) * | 2019-01-04 | 2020-11-06 | 마점래 | 2차 전지 조립용 가변형 코킹장치 |
CN110369985A (zh) * | 2019-07-05 | 2019-10-25 | 烽禾升医疗设备(昆山)有限公司 | 一种异形笔夹入料机构 |
DE102020213148A1 (de) * | 2020-10-19 | 2022-04-21 | Mahle International Gmbh | Vorrichtung zur Montage eines Stopfens in einer Hohlwelle |
KR20220053390A (ko) | 2020-10-22 | 2022-04-29 | 삼성전자주식회사 | 반도체 공정 스테이지 구조체, 반도체 칩 픽업 시스템 및 픽업헤드 틸팅 제어 방법 |
EP4052868A1 (de) * | 2021-02-15 | 2022-09-07 | Stöger Automation GmbH | Automatisches schraubsystem zum verbinden von bauteilen |
CN117208572B (zh) * | 2023-11-09 | 2024-02-13 | 四川名人居门窗有限公司 | 一种玻璃吸盘车摆动结构 |
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2012
- 2012-07-24 DE DE102012014558.6A patent/DE102012014558B4/de active Active
-
2013
- 2013-06-19 SG SG2013047378A patent/SG196716A1/en unknown
- 2013-06-28 MY MYPI2013002482A patent/MY183739A/en unknown
- 2013-07-16 JP JP2013147719A patent/JP2014027270A/ja not_active Withdrawn
- 2013-07-18 CN CN201310304630.3A patent/CN103579046B/zh active Active
- 2013-07-22 TW TW102126092A patent/TWI568553B/zh active
- 2013-07-22 KR KR1020130086070A patent/KR102080351B1/ko active IP Right Grant
- 2013-07-23 US US13/949,000 patent/US9364953B2/en active Active
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2016
- 2016-02-23 US US15/051,583 patent/US9956692B2/en active Active
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2017
- 2017-12-08 JP JP2017236312A patent/JP6547979B2/ja active Active
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2019
- 2019-11-01 KR KR1020190138306A patent/KR102080447B1/ko active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002222820A (ja) * | 2001-01-26 | 2002-08-09 | Sony Corp | 物品組立装置 |
Also Published As
Publication number | Publication date |
---|---|
CN103579046A (zh) | 2014-02-12 |
DE102012014558B4 (de) | 2014-02-20 |
US20160167237A1 (en) | 2016-06-16 |
KR102080447B1 (ko) | 2020-02-21 |
MY183739A (en) | 2021-03-10 |
KR20190126040A (ko) | 2019-11-08 |
KR20140015197A (ko) | 2014-02-06 |
US9956692B2 (en) | 2018-05-01 |
DE102012014558A1 (de) | 2014-01-30 |
JP2014027270A (ja) | 2014-02-06 |
TWI568553B (zh) | 2017-02-01 |
KR102080351B1 (ko) | 2020-02-21 |
US20140030052A1 (en) | 2014-01-30 |
SG196716A1 (en) | 2014-02-13 |
CN103579046B (zh) | 2017-12-19 |
TW201412479A (zh) | 2014-04-01 |
JP6547979B2 (ja) | 2019-07-24 |
US9364953B2 (en) | 2016-06-14 |
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