JP6547979B2 - 装着装置の装着ヘッドのキネマティック保持システム - Google Patents
装着装置の装着ヘッドのキネマティック保持システム Download PDFInfo
- Publication number
- JP6547979B2 JP6547979B2 JP2017236312A JP2017236312A JP6547979B2 JP 6547979 B2 JP6547979 B2 JP 6547979B2 JP 2017236312 A JP2017236312 A JP 2017236312A JP 2017236312 A JP2017236312 A JP 2017236312A JP 6547979 B2 JP6547979 B2 JP 6547979B2
- Authority
- JP
- Japan
- Prior art keywords
- mounting head
- deformation
- mounting
- solid
- joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J17/00—Joints
- B25J17/02—Wrist joints
- B25J17/0208—Compliance devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0095—Gripping heads and other end effectors with an external support, i.e. a support which does not belong to the manipulator or the object to be gripped, e.g. for maintaining the gripping head in an accurate position, guiding it or preventing vibrations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
Description
1.装着プロセス中に部品7が基板3に接触すると、アクチュエーター(複数の場合もあり)13が、力が付与されない状態に切り換えられる。基板3と部品7との間の摩擦によって部品7が固定される。このとき生じる変形は、押圧力の印加中に相殺される。
2.部品7が基板3に接触するとすぐに、アクチュエーター(複数の場合もあり)13が、部品7を適所に保つために特定の力又は可変の力を加える。
3.部品7が基板3に接触した後で、アクチュエーター(複数の場合もあり)13が、部品7を適所に保つために特定の経路に沿って変位する。
Claims (3)
- 電子部品又は光学部品(7)を基板(3)上に実装する装着装置の装着ヘッド(2)のキネマティック保持システムであって、
前記装着ヘッド(2)を保持する装着ヘッド支持体(1)を備える装着ヘッドガイドデバイス(18)、及び
前記装着ヘッド支持体(1)に対する前記装着ヘッド(2)の位置合わせを調整する装着ヘッド位置合わせデバイスを備え、
前記装着ヘッド位置合わせデバイスは固体継手(20)を含み、前記固体継手(20)によって、前記装着ヘッド(2)が前記装着ヘッド支持体(1)上で傾き調整可能に支持され、
前記固体継手(20)は、前記装着ヘッド支持体(1)に強固に接続されている少なくとも1つの第1の固体継手アーム(22)、および、前記装着ヘッド(2)に強固に接続されているとともに、前記少なくとも1つの第1の固体継手アーム(22)に弾性的にかつ一体的に接続されている少なくとも1つの第2の固体継手アーム(23)を含む少なくとも1つの固体継手要素(21)の一部であり、
前記少なくとも1つの第2の固体継手アーム(23)は、前記装着ヘッドガイドデバイス(18)の変形によって生じる前記装着ヘッド(2)の軸誤差を相殺するように、前記基板(3)に対する前記装着ヘッド(2)の押圧力によって生じる前記装着ヘッドガイドデバイス(18)の変形に応じて、前記少なくとも1つの第1の固体継手アーム(22)に対して弾性変形可能であり、
前記少なくとも1つの固体継手要素(21)は、2つの第1の固体継手アーム(22)と1つの第2の個体継手アーム(23)を備え、
前記2つの第1の固体継手アーム(22)は互いに平行に延伸し、前記装着ヘッド(2)を挟んで反対側に配置され、前記装着ヘッド(2)から横方向に離間し、かつ端部側が横行アーム(24)によって互いに接続されており、
前記1つの第2の固体継手アーム(23)は、前記2つの第1の固体継手アーム(22)間の中央に配置されているとともに前記横行アーム(24)にも接続されている、キネマティック保持システム。 - 前記固体継手(20)の回転軸(26)が、変形回転軸(25)に対して配置され、前記変形回転軸(25)を中心に、前記固体継手(20)の前記回転軸(26)及び前記変形回転軸(25)を通る直線(l)が、前記装着ヘッド(2)の無負荷状態及び負荷状態において、前記変形回転軸(25)が配置される水平面(h)に対して−45°〜+45°の角度範囲にあるように、前記押圧力に反応して前記装着ヘッドガイドデバイス(18)の変形が生じる、請求項1に記載のキネマティック保持システム。
- 前記固体継手(20)の前記回転軸(26)は前記装着ヘッド(2)の無負荷状態では前記変形回転軸(25)の下に配置され、全装着力下では前記変形回転軸(25)の上に配置される、請求項2に記載のキネマティック保持システム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012014558.6 | 2012-07-24 | ||
DE102012014558.6A DE102012014558B4 (de) | 2012-07-24 | 2012-07-24 | Kinematisches Haltesystem für einen Bestückkopf einer Bestückvorrichtung |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013147719A Division JP2014027270A (ja) | 2012-07-24 | 2013-07-16 | 装着装置の装着ヘッドのキネマティック保持システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018098508A JP2018098508A (ja) | 2018-06-21 |
JP6547979B2 true JP6547979B2 (ja) | 2019-07-24 |
Family
ID=49911952
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013147719A Withdrawn JP2014027270A (ja) | 2012-07-24 | 2013-07-16 | 装着装置の装着ヘッドのキネマティック保持システム |
JP2017236312A Active JP6547979B2 (ja) | 2012-07-24 | 2017-12-08 | 装着装置の装着ヘッドのキネマティック保持システム |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013147719A Withdrawn JP2014027270A (ja) | 2012-07-24 | 2013-07-16 | 装着装置の装着ヘッドのキネマティック保持システム |
Country Status (8)
Country | Link |
---|---|
US (2) | US9364953B2 (ja) |
JP (2) | JP2014027270A (ja) |
KR (2) | KR102080351B1 (ja) |
CN (1) | CN103579046B (ja) |
DE (1) | DE102012014558B4 (ja) |
MY (1) | MY183739A (ja) |
SG (1) | SG196716A1 (ja) |
TW (1) | TWI568553B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102425309B1 (ko) * | 2016-10-12 | 2022-07-26 | 삼성전자주식회사 | 본딩 헤드와 스테이지 사이의 평행도 보정 장치 및 이를 포함하는 칩 본더 |
CN109997426B (zh) * | 2016-11-17 | 2020-11-24 | 株式会社富士 | 作业机 |
US10050008B1 (en) * | 2017-01-24 | 2018-08-14 | Asm Technology Singapore Pte Ltd | Method and system for automatic bond arm alignment |
DE102018115144A1 (de) * | 2018-06-23 | 2019-12-24 | Besi Switzerland Ag | Stellantrieb für einen Bondkopf |
KR102175151B1 (ko) * | 2019-01-04 | 2020-11-06 | 마점래 | 2차 전지 조립용 가변형 코킹장치 |
CN110369985A (zh) * | 2019-07-05 | 2019-10-25 | 烽禾升医疗设备(昆山)有限公司 | 一种异形笔夹入料机构 |
DE102020213148A1 (de) * | 2020-10-19 | 2022-04-21 | Mahle International Gmbh | Vorrichtung zur Montage eines Stopfens in einer Hohlwelle |
KR20220053390A (ko) | 2020-10-22 | 2022-04-29 | 삼성전자주식회사 | 반도체 공정 스테이지 구조체, 반도체 칩 픽업 시스템 및 픽업헤드 틸팅 제어 방법 |
EP4052868A1 (de) * | 2021-02-15 | 2022-09-07 | Stöger Automation GmbH | Automatisches schraubsystem zum verbinden von bauteilen |
CN117208572B (zh) * | 2023-11-09 | 2024-02-13 | 四川名人居门窗有限公司 | 一种玻璃吸盘车摆动结构 |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2527967B1 (fr) * | 1982-06-07 | 1985-07-19 | Merlin Gerin | Robot industriel perfectionne pilote par un automate programmable |
WO1986004479A1 (en) * | 1985-01-21 | 1986-07-31 | Fuji Machine Mfg. Co., Ltd. | Method of and apparatus for detecting electronic device-holding position and electronic device-mounting apparatus |
JPH07122830B2 (ja) * | 1989-05-31 | 1995-12-25 | 新技術事業団 | 超精密位置決め装置 |
TW278212B (ja) | 1992-05-06 | 1996-06-11 | Sumitomo Electric Industries | |
JP3099254B2 (ja) | 1994-02-28 | 2000-10-16 | 安藤電気株式会社 | 浮動機構つき吸着ハンドおよび搬送接触機構 |
US5614118A (en) * | 1994-10-27 | 1997-03-25 | Weber; Wolfgang | Hot plate welder with pivotably movable carriage unit |
JPH08162797A (ja) * | 1994-12-08 | 1996-06-21 | Matsushita Electric Ind Co Ltd | 電子部品実装装置 |
US5697480A (en) | 1995-03-22 | 1997-12-16 | Syron Engineering & Manufacturing Corporation | Breakaway mount for robot arm |
JP3853402B2 (ja) * | 1995-07-13 | 2006-12-06 | 東レエンジニアリング株式会社 | チップボンディング装置 |
JPH09283990A (ja) * | 1996-04-10 | 1997-10-31 | Toshiba Corp | マウントヘッド及びボンディング装置 |
JPH10107495A (ja) | 1996-09-26 | 1998-04-24 | Matsushita Electric Ind Co Ltd | 部品装着装置 |
JP3421968B2 (ja) | 1999-02-23 | 2003-06-30 | エヌイーシーマシナリー株式会社 | コレット及びそれを用いたマウント装置 |
US6345728B1 (en) * | 1999-04-28 | 2002-02-12 | Matsushita Electric Industrial Co., Ltd. | Component feeding method and apparatus |
JP2000332495A (ja) | 1999-05-25 | 2000-11-30 | Sony Corp | 部品装着装置及び部品装着方法 |
DE60034248T2 (de) * | 1999-09-28 | 2008-02-28 | Matsushita Electric Industrial Co., Ltd., Kadoma | Methode zur erzeugung von daten für bauteilbestückungseinrichtung, bestückungsmethode und einrichtungen dafür |
EP1339098B1 (en) * | 2000-02-17 | 2009-09-02 | Panasonic Corporation | Component mounting apparatus and component mounting method |
JP2002222820A (ja) * | 2001-01-26 | 2002-08-09 | Sony Corp | 物品組立装置 |
US6463359B2 (en) * | 2001-02-20 | 2002-10-08 | Infotech Ag | Micro-alignment pick-up head |
JP4616514B2 (ja) * | 2001-06-07 | 2011-01-19 | 富士機械製造株式会社 | 電気部品装着システムおよびそれにおける位置誤差検出方法 |
JP4303463B2 (ja) * | 2002-11-29 | 2009-07-29 | パナソニック株式会社 | 基板搬送装置及び部品実装における基板搬送方法 |
JP4334892B2 (ja) * | 2003-03-20 | 2009-09-30 | パナソニック株式会社 | 部品実装方法 |
JP4390503B2 (ja) * | 2003-08-27 | 2009-12-24 | パナソニック株式会社 | 部品実装装置及び部品実装方法 |
WO2008052594A1 (de) | 2006-10-31 | 2008-05-08 | Alphasem Gmbh | Vorrichtung zum positionieren und/oder anpressen eines flächigen bauteils relativ zu einem substrat und verfahren zum positionieren eines aufnahmewerkzeugs relativ zu einem substrat |
KR100921398B1 (ko) * | 2007-02-15 | 2009-10-14 | (주)제이티 | 이송툴의 픽커 및 그를 가지는 이송툴 |
WO2008100111A1 (en) | 2007-02-15 | 2008-08-21 | Jt Corporation | Picker for transfer tool and transfer tool having the same |
EP2007187A1 (en) * | 2007-06-19 | 2008-12-24 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Placement device and assembly device |
EP2088844A1 (en) | 2008-02-05 | 2009-08-12 | Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO | Placement device, assembly device and method of placing a component |
US8442661B1 (en) * | 2008-11-25 | 2013-05-14 | Anybots 2.0, Inc. | Remotely controlled self-balancing robot including a stabilized laser pointer |
JP5403247B2 (ja) * | 2009-09-07 | 2014-01-29 | 村田機械株式会社 | 基板移載装置 |
JP2011245595A (ja) * | 2010-05-27 | 2011-12-08 | Sharp Corp | 移載ハンドおよび移載方法 |
-
2012
- 2012-07-24 DE DE102012014558.6A patent/DE102012014558B4/de active Active
-
2013
- 2013-06-19 SG SG2013047378A patent/SG196716A1/en unknown
- 2013-06-28 MY MYPI2013002482A patent/MY183739A/en unknown
- 2013-07-16 JP JP2013147719A patent/JP2014027270A/ja not_active Withdrawn
- 2013-07-18 CN CN201310304630.3A patent/CN103579046B/zh active Active
- 2013-07-22 TW TW102126092A patent/TWI568553B/zh active
- 2013-07-22 KR KR1020130086070A patent/KR102080351B1/ko active IP Right Grant
- 2013-07-23 US US13/949,000 patent/US9364953B2/en active Active
-
2016
- 2016-02-23 US US15/051,583 patent/US9956692B2/en active Active
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2017
- 2017-12-08 JP JP2017236312A patent/JP6547979B2/ja active Active
-
2019
- 2019-11-01 KR KR1020190138306A patent/KR102080447B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
US9956692B2 (en) | 2018-05-01 |
DE102012014558B4 (de) | 2014-02-20 |
JP2018098508A (ja) | 2018-06-21 |
US9364953B2 (en) | 2016-06-14 |
DE102012014558A1 (de) | 2014-01-30 |
MY183739A (en) | 2021-03-10 |
CN103579046B (zh) | 2017-12-19 |
KR102080447B1 (ko) | 2020-02-21 |
CN103579046A (zh) | 2014-02-12 |
TWI568553B (zh) | 2017-02-01 |
KR102080351B1 (ko) | 2020-02-21 |
US20140030052A1 (en) | 2014-01-30 |
KR20140015197A (ko) | 2014-02-06 |
KR20190126040A (ko) | 2019-11-08 |
SG196716A1 (en) | 2014-02-13 |
US20160167237A1 (en) | 2016-06-16 |
JP2014027270A (ja) | 2014-02-06 |
TW201412479A (zh) | 2014-04-01 |
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