MY183739A - Kinematic holding system for a placement head of a placement apparatus - Google Patents

Kinematic holding system for a placement head of a placement apparatus

Info

Publication number
MY183739A
MY183739A MYPI2013002482A MYPI2013002482A MY183739A MY 183739 A MY183739 A MY 183739A MY PI2013002482 A MYPI2013002482 A MY PI2013002482A MY PI2013002482 A MYPI2013002482 A MY PI2013002482A MY 183739 A MY183739 A MY 183739A
Authority
MY
Malaysia
Prior art keywords
placement head
placement
head
holding member
holding system
Prior art date
Application number
MYPI2013002482A
Other languages
English (en)
Inventor
Hannes Kostner
Dietmar Lackner
Florian Speer
Martin Widauer
Original Assignee
Besi Switzerland Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Switzerland Ag filed Critical Besi Switzerland Ag
Publication of MY183739A publication Critical patent/MY183739A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J17/00—Joints
    • B25J17/02—Wrist joints
    • B25J17/0208—Compliance devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Die Bonding (AREA)
MYPI2013002482A 2012-07-24 2013-06-28 Kinematic holding system for a placement head of a placement apparatus MY183739A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102012014558.6A DE102012014558B4 (de) 2012-07-24 2012-07-24 Kinematisches Haltesystem für einen Bestückkopf einer Bestückvorrichtung

Publications (1)

Publication Number Publication Date
MY183739A true MY183739A (en) 2021-03-10

Family

ID=49911952

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013002482A MY183739A (en) 2012-07-24 2013-06-28 Kinematic holding system for a placement head of a placement apparatus

Country Status (8)

Country Link
US (2) US9364953B2 (https=)
JP (2) JP2014027270A (https=)
KR (2) KR102080351B1 (https=)
CN (1) CN103579046B (https=)
DE (1) DE102012014558B4 (https=)
MY (1) MY183739A (https=)
SG (1) SG196716A1 (https=)
TW (1) TWI568553B (https=)

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KR102425309B1 (ko) * 2016-10-12 2022-07-26 삼성전자주식회사 본딩 헤드와 스테이지 사이의 평행도 보정 장치 및 이를 포함하는 칩 본더
US10969761B2 (en) * 2016-11-17 2021-04-06 Fuji Corporation Operation machine
US10050008B1 (en) * 2017-01-24 2018-08-14 Asm Technology Singapore Pte Ltd Method and system for automatic bond arm alignment
DE102018115144A1 (de) * 2018-06-23 2019-12-24 Besi Switzerland Ag Stellantrieb für einen Bondkopf
KR102175151B1 (ko) * 2019-01-04 2020-11-06 마점래 2차 전지 조립용 가변형 코킹장치
CN110369985B (zh) * 2019-07-05 2024-05-17 江苏烽禾升科技股份有限公司 一种异形笔夹入料机构
DE102020213148B4 (de) * 2020-10-19 2026-04-23 Mahle International Gmbh Vorrichtung zur Montage eines Stopfens in einer Hohlwelle
KR102874158B1 (ko) 2020-10-22 2025-10-22 삼성전자주식회사 반도체 공정 스테이지 구조체, 반도체 칩 픽업 시스템 및 픽업헤드 틸팅 제어 방법
EP4052868A1 (de) * 2021-02-15 2022-09-07 Stöger Automation GmbH Automatisches schraubsystem zum verbinden von bauteilen
CN115734512B (zh) * 2022-11-30 2026-02-06 格力电器(赣州)有限公司 存取结构
CN117208572B (zh) * 2023-11-09 2024-02-13 四川名人居门窗有限公司 一种玻璃吸盘车摆动结构

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JPH07122830B2 (ja) * 1989-05-31 1995-12-25 新技術事業団 超精密位置決め装置
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DE60034248T2 (de) * 1999-09-28 2008-02-28 Matsushita Electric Industrial Co., Ltd., Kadoma Methode zur erzeugung von daten für bauteilbestückungseinrichtung, bestückungsmethode und einrichtungen dafür
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WO2008100111A1 (en) 2007-02-15 2008-08-21 Jt Corporation Picker for transfer tool and transfer tool having the same
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EP2007187A1 (en) * 2007-06-19 2008-12-24 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Placement device and assembly device
EP2088844A1 (en) 2008-02-05 2009-08-12 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Placement device, assembly device and method of placing a component
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JP5403247B2 (ja) * 2009-09-07 2014-01-29 村田機械株式会社 基板移載装置
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Also Published As

Publication number Publication date
KR20140015197A (ko) 2014-02-06
US9364953B2 (en) 2016-06-14
TW201412479A (zh) 2014-04-01
JP2014027270A (ja) 2014-02-06
DE102012014558B4 (de) 2014-02-20
CN103579046A (zh) 2014-02-12
KR102080351B1 (ko) 2020-02-21
US20140030052A1 (en) 2014-01-30
DE102012014558A1 (de) 2014-01-30
CN103579046B (zh) 2017-12-19
KR102080447B1 (ko) 2020-02-21
US20160167237A1 (en) 2016-06-16
JP2018098508A (ja) 2018-06-21
TWI568553B (zh) 2017-02-01
JP6547979B2 (ja) 2019-07-24
US9956692B2 (en) 2018-05-01
KR20190126040A (ko) 2019-11-08
SG196716A1 (en) 2014-02-13

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