TWI568553B - 放置設備的放置頭之動態保持系統 - Google Patents

放置設備的放置頭之動態保持系統 Download PDF

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Publication number
TWI568553B
TWI568553B TW102126092A TW102126092A TWI568553B TW I568553 B TWI568553 B TW I568553B TW 102126092 A TW102126092 A TW 102126092A TW 102126092 A TW102126092 A TW 102126092A TW I568553 B TWI568553 B TW I568553B
Authority
TW
Taiwan
Prior art keywords
placement head
placement
joint
head
deformation
Prior art date
Application number
TW102126092A
Other languages
English (en)
Chinese (zh)
Other versions
TW201412479A (zh
Inventor
漢斯 寇斯納
迪特馬 拉克納
弗羅里安 史貝爾
馬汀 威道爾
Original Assignee
貝西瑞士股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 貝西瑞士股份有限公司 filed Critical 貝西瑞士股份有限公司
Publication of TW201412479A publication Critical patent/TW201412479A/zh
Application granted granted Critical
Publication of TWI568553B publication Critical patent/TWI568553B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J17/00—Joints
    • B25J17/02—Wrist joints
    • B25J17/0208—Compliance devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Die Bonding (AREA)
TW102126092A 2012-07-24 2013-07-22 放置設備的放置頭之動態保持系統 TWI568553B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102012014558.6A DE102012014558B4 (de) 2012-07-24 2012-07-24 Kinematisches Haltesystem für einen Bestückkopf einer Bestückvorrichtung

Publications (2)

Publication Number Publication Date
TW201412479A TW201412479A (zh) 2014-04-01
TWI568553B true TWI568553B (zh) 2017-02-01

Family

ID=49911952

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102126092A TWI568553B (zh) 2012-07-24 2013-07-22 放置設備的放置頭之動態保持系統

Country Status (8)

Country Link
US (2) US9364953B2 (https=)
JP (2) JP2014027270A (https=)
KR (2) KR102080351B1 (https=)
CN (1) CN103579046B (https=)
DE (1) DE102012014558B4 (https=)
MY (1) MY183739A (https=)
SG (1) SG196716A1 (https=)
TW (1) TWI568553B (https=)

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KR102425309B1 (ko) * 2016-10-12 2022-07-26 삼성전자주식회사 본딩 헤드와 스테이지 사이의 평행도 보정 장치 및 이를 포함하는 칩 본더
US10969761B2 (en) * 2016-11-17 2021-04-06 Fuji Corporation Operation machine
US10050008B1 (en) * 2017-01-24 2018-08-14 Asm Technology Singapore Pte Ltd Method and system for automatic bond arm alignment
DE102018115144A1 (de) * 2018-06-23 2019-12-24 Besi Switzerland Ag Stellantrieb für einen Bondkopf
KR102175151B1 (ko) * 2019-01-04 2020-11-06 마점래 2차 전지 조립용 가변형 코킹장치
CN110369985B (zh) * 2019-07-05 2024-05-17 江苏烽禾升科技股份有限公司 一种异形笔夹入料机构
DE102020213148B4 (de) * 2020-10-19 2026-04-23 Mahle International Gmbh Vorrichtung zur Montage eines Stopfens in einer Hohlwelle
KR102874158B1 (ko) 2020-10-22 2025-10-22 삼성전자주식회사 반도체 공정 스테이지 구조체, 반도체 칩 픽업 시스템 및 픽업헤드 틸팅 제어 방법
EP4052868A1 (de) * 2021-02-15 2022-09-07 Stöger Automation GmbH Automatisches schraubsystem zum verbinden von bauteilen
CN115734512B (zh) * 2022-11-30 2026-02-06 格力电器(赣州)有限公司 存取结构
CN117208572B (zh) * 2023-11-09 2024-02-13 四川名人居门窗有限公司 一种玻璃吸盘车摆动结构

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US5697480A (en) * 1995-03-22 1997-12-16 Syron Engineering & Manufacturing Corporation Breakaway mount for robot arm
TW201109559A (en) * 2009-09-07 2011-03-16 Murata Machinery Ltd Substrate transfer apparatus

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5614118A (en) * 1994-10-27 1997-03-25 Weber; Wolfgang Hot plate welder with pivotably movable carriage unit
US5697480A (en) * 1995-03-22 1997-12-16 Syron Engineering & Manufacturing Corporation Breakaway mount for robot arm
TW201109559A (en) * 2009-09-07 2011-03-16 Murata Machinery Ltd Substrate transfer apparatus

Also Published As

Publication number Publication date
MY183739A (en) 2021-03-10
KR20140015197A (ko) 2014-02-06
US9364953B2 (en) 2016-06-14
TW201412479A (zh) 2014-04-01
JP2014027270A (ja) 2014-02-06
DE102012014558B4 (de) 2014-02-20
CN103579046A (zh) 2014-02-12
KR102080351B1 (ko) 2020-02-21
US20140030052A1 (en) 2014-01-30
DE102012014558A1 (de) 2014-01-30
CN103579046B (zh) 2017-12-19
KR102080447B1 (ko) 2020-02-21
US20160167237A1 (en) 2016-06-16
JP2018098508A (ja) 2018-06-21
JP6547979B2 (ja) 2019-07-24
US9956692B2 (en) 2018-05-01
KR20190126040A (ko) 2019-11-08
SG196716A1 (en) 2014-02-13

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