JP2021529441A5 - - Google Patents

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Publication number
JP2021529441A5
JP2021529441A5 JP2021520478A JP2021520478A JP2021529441A5 JP 2021529441 A5 JP2021529441 A5 JP 2021529441A5 JP 2021520478 A JP2021520478 A JP 2021520478A JP 2021520478 A JP2021520478 A JP 2021520478A JP 2021529441 A5 JP2021529441 A5 JP 2021529441A5
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JP
Japan
Prior art keywords
axis
movable axis
contact surface
substrate
moving
Prior art date
Application number
JP2021520478A
Other languages
English (en)
Japanese (ja)
Other versions
JP7333391B2 (ja
JPWO2019244136A5 (https=
JP2021529441A (ja
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Priority claimed from DE102018115144.6A external-priority patent/DE102018115144A1/de
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Publication of JP2021529441A publication Critical patent/JP2021529441A/ja
Publication of JPWO2019244136A5 publication Critical patent/JPWO2019244136A5/ja
Publication of JP2021529441A5 publication Critical patent/JP2021529441A5/ja
Application granted granted Critical
Publication of JP7333391B2 publication Critical patent/JP7333391B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2021520478A 2018-06-23 2019-06-23 接合ヘッドのためのアクチュエータ Active JP7333391B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102018115144.6A DE102018115144A1 (de) 2018-06-23 2018-06-23 Stellantrieb für einen Bondkopf
DE102018115144.6 2018-06-23
PCT/IB2019/055284 WO2019244136A2 (de) 2018-06-23 2019-06-23 Stellantrieb für einen bondkopf

Publications (4)

Publication Number Publication Date
JP2021529441A JP2021529441A (ja) 2021-10-28
JPWO2019244136A5 JPWO2019244136A5 (https=) 2022-07-19
JP2021529441A5 true JP2021529441A5 (https=) 2022-07-19
JP7333391B2 JP7333391B2 (ja) 2023-08-24

Family

ID=67766204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021520478A Active JP7333391B2 (ja) 2018-06-23 2019-06-23 接合ヘッドのためのアクチュエータ

Country Status (8)

Country Link
US (1) US12230599B2 (https=)
JP (1) JP7333391B2 (https=)
KR (1) KR102800366B1 (https=)
CN (1) CN113169091B (https=)
DE (1) DE102018115144A1 (https=)
MY (1) MY204833A (https=)
SG (1) SG11202012866TA (https=)
WO (1) WO2019244136A2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114005777B (zh) * 2021-12-24 2022-03-29 湖北三维半导体集成创新中心有限责任公司 键合装置和键合方法
CN113990790B (zh) * 2021-12-24 2022-03-18 湖北三维半导体集成创新中心有限责任公司 键合系统和键合方法
CN114005778B (zh) * 2021-12-24 2022-03-22 湖北三维半导体集成创新中心有限责任公司 键合系统和键合补偿方法
CN116417389B (zh) * 2023-06-08 2023-08-15 上海果纳半导体技术有限公司 晶圆盒搬运装置及方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1022306A (ja) * 1996-06-28 1998-01-23 Hitachi Ltd ダイボンディング装置
JPH10107495A (ja) * 1996-09-26 1998-04-24 Matsushita Electric Ind Co Ltd 部品装着装置
JP3303705B2 (ja) * 1997-01-22 2002-07-22 松下電器産業株式会社 バンプ付電子部品の熱圧着装置
JP2000101294A (ja) * 1998-09-18 2000-04-07 Sony Corp 部品装着装置
US6146912A (en) * 1999-05-11 2000-11-14 Trw Inc. Method for parallel alignment of a chip to substrate
JP2000340585A (ja) * 1999-05-31 2000-12-08 Sony Corp 平面平行度調整装置を備えた加工装置
JP2002280397A (ja) * 2001-03-19 2002-09-27 Furukawa Electric Co Ltd:The 面合わせ機構および面合わせ方法
JP2003040585A (ja) 2001-07-30 2003-02-13 Toyota Industries Corp オーダーピッカ
WO2004107432A1 (ja) * 2003-05-29 2004-12-09 Fujitsu Limited 電子部品の実装方法、取外し方法及びその装置
JP4642787B2 (ja) * 2006-05-09 2011-03-02 東京エレクトロン株式会社 基板搬送装置及び縦型熱処理装置
CN101632164B (zh) * 2006-10-31 2016-02-24 库力科及索法模压焊接有限责任公司 用于相对于基底定位和/或压制平面部件的装置及用于相对于基底定位拾取工具的方法
JP4958655B2 (ja) * 2007-06-27 2012-06-20 新光電気工業株式会社 電子部品実装装置および電子装置の製造方法
JP5065969B2 (ja) * 2008-03-31 2012-11-07 株式会社日立ハイテクインスツルメンツ 部品実装装置
KR101233221B1 (ko) * 2008-12-17 2013-02-15 세메스 주식회사 다이 본더용 피커 헤드
US8016010B2 (en) * 2009-09-02 2011-09-13 Asm Assembly Automation Ltd Rotary bonding tool which provides a large bond force
US8387851B1 (en) 2012-05-04 2013-03-05 Asm Technology Singapore Pte. Ltd. Apparatus for aligning a bonding tool of a die bonder
DE102012014558B4 (de) * 2012-07-24 2014-02-20 Datacon Technology Gmbh Kinematisches Haltesystem für einen Bestückkopf einer Bestückvorrichtung
SG11201504793TA (en) * 2012-12-21 2015-07-30 Shinkawa Kk Flip chip bonder and method for correcting flatness and deformation amount of bonding stage
CH707934B1 (de) * 2013-04-19 2017-04-28 Besi Switzerland Ag Verfahren zum Montieren von elektronischen oder optischen Bauelementen auf einem Substrat.
JP6422499B2 (ja) * 2014-08-13 2018-11-14 株式会社新川 実装装置および測定方法
US10096568B2 (en) * 2014-09-18 2018-10-09 Asm Technology Singapore Pte Ltd Die bonding tool and system
CN104966687B (zh) * 2015-06-30 2017-08-25 北京中电科电子装备有限公司 一种键合头装置
KR102425309B1 (ko) * 2016-10-12 2022-07-26 삼성전자주식회사 본딩 헤드와 스테이지 사이의 평행도 보정 장치 및 이를 포함하는 칩 본더
WO2018146880A1 (ja) * 2017-02-09 2018-08-16 ボンドテック株式会社 部品実装システム、樹脂成形装置、部品実装方法および樹脂成形方法

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