SG11202012866TA - Actuator for a bonding head - Google Patents

Actuator for a bonding head

Info

Publication number
SG11202012866TA
SG11202012866TA SG11202012866TA SG11202012866TA SG11202012866TA SG 11202012866T A SG11202012866T A SG 11202012866TA SG 11202012866T A SG11202012866T A SG 11202012866TA SG 11202012866T A SG11202012866T A SG 11202012866TA SG 11202012866T A SG11202012866T A SG 11202012866TA
Authority
SG
Singapore
Prior art keywords
actuator
bonding head
bonding
head
Prior art date
Application number
SG11202012866TA
Other languages
English (en)
Inventor
Markus Aebischer
Original Assignee
Besi Switzerland Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Switzerland Ag filed Critical Besi Switzerland Ag
Publication of SG11202012866TA publication Critical patent/SG11202012866TA/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
SG11202012866TA 2018-06-23 2019-06-23 Actuator for a bonding head SG11202012866TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018115144.6A DE102018115144A1 (de) 2018-06-23 2018-06-23 Stellantrieb für einen Bondkopf
PCT/IB2019/055284 WO2019244136A2 (de) 2018-06-23 2019-06-23 Stellantrieb für einen bondkopf

Publications (1)

Publication Number Publication Date
SG11202012866TA true SG11202012866TA (en) 2021-02-25

Family

ID=67766204

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202012866TA SG11202012866TA (en) 2018-06-23 2019-06-23 Actuator for a bonding head

Country Status (8)

Country Link
US (1) US12230599B2 (https=)
JP (1) JP7333391B2 (https=)
KR (1) KR102800366B1 (https=)
CN (1) CN113169091B (https=)
DE (1) DE102018115144A1 (https=)
MY (1) MY204833A (https=)
SG (1) SG11202012866TA (https=)
WO (1) WO2019244136A2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114005777B (zh) * 2021-12-24 2022-03-29 湖北三维半导体集成创新中心有限责任公司 键合装置和键合方法
CN113990790B (zh) * 2021-12-24 2022-03-18 湖北三维半导体集成创新中心有限责任公司 键合系统和键合方法
CN114005778B (zh) * 2021-12-24 2022-03-22 湖北三维半导体集成创新中心有限责任公司 键合系统和键合补偿方法
CN116417389B (zh) * 2023-06-08 2023-08-15 上海果纳半导体技术有限公司 晶圆盒搬运装置及方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1022306A (ja) * 1996-06-28 1998-01-23 Hitachi Ltd ダイボンディング装置
JPH10107495A (ja) * 1996-09-26 1998-04-24 Matsushita Electric Ind Co Ltd 部品装着装置
JP3303705B2 (ja) * 1997-01-22 2002-07-22 松下電器産業株式会社 バンプ付電子部品の熱圧着装置
JP2000101294A (ja) * 1998-09-18 2000-04-07 Sony Corp 部品装着装置
US6146912A (en) * 1999-05-11 2000-11-14 Trw Inc. Method for parallel alignment of a chip to substrate
JP2000340585A (ja) * 1999-05-31 2000-12-08 Sony Corp 平面平行度調整装置を備えた加工装置
JP2002280397A (ja) * 2001-03-19 2002-09-27 Furukawa Electric Co Ltd:The 面合わせ機構および面合わせ方法
JP2003040585A (ja) 2001-07-30 2003-02-13 Toyota Industries Corp オーダーピッカ
WO2004107432A1 (ja) * 2003-05-29 2004-12-09 Fujitsu Limited 電子部品の実装方法、取外し方法及びその装置
JP4642787B2 (ja) * 2006-05-09 2011-03-02 東京エレクトロン株式会社 基板搬送装置及び縦型熱処理装置
CN101632164B (zh) * 2006-10-31 2016-02-24 库力科及索法模压焊接有限责任公司 用于相对于基底定位和/或压制平面部件的装置及用于相对于基底定位拾取工具的方法
JP4958655B2 (ja) * 2007-06-27 2012-06-20 新光電気工業株式会社 電子部品実装装置および電子装置の製造方法
JP5065969B2 (ja) * 2008-03-31 2012-11-07 株式会社日立ハイテクインスツルメンツ 部品実装装置
KR101233221B1 (ko) * 2008-12-17 2013-02-15 세메스 주식회사 다이 본더용 피커 헤드
US8016010B2 (en) * 2009-09-02 2011-09-13 Asm Assembly Automation Ltd Rotary bonding tool which provides a large bond force
US8387851B1 (en) 2012-05-04 2013-03-05 Asm Technology Singapore Pte. Ltd. Apparatus for aligning a bonding tool of a die bonder
DE102012014558B4 (de) * 2012-07-24 2014-02-20 Datacon Technology Gmbh Kinematisches Haltesystem für einen Bestückkopf einer Bestückvorrichtung
SG11201504793TA (en) * 2012-12-21 2015-07-30 Shinkawa Kk Flip chip bonder and method for correcting flatness and deformation amount of bonding stage
CH707934B1 (de) * 2013-04-19 2017-04-28 Besi Switzerland Ag Verfahren zum Montieren von elektronischen oder optischen Bauelementen auf einem Substrat.
JP6422499B2 (ja) * 2014-08-13 2018-11-14 株式会社新川 実装装置および測定方法
US10096568B2 (en) * 2014-09-18 2018-10-09 Asm Technology Singapore Pte Ltd Die bonding tool and system
CN104966687B (zh) * 2015-06-30 2017-08-25 北京中电科电子装备有限公司 一种键合头装置
KR102425309B1 (ko) * 2016-10-12 2022-07-26 삼성전자주식회사 본딩 헤드와 스테이지 사이의 평행도 보정 장치 및 이를 포함하는 칩 본더
WO2018146880A1 (ja) * 2017-02-09 2018-08-16 ボンドテック株式会社 部品実装システム、樹脂成形装置、部品実装方法および樹脂成形方法

Also Published As

Publication number Publication date
WO2019244136A3 (de) 2020-03-12
US12230599B2 (en) 2025-02-18
KR102800366B1 (ko) 2025-04-25
CN113169091B (zh) 2024-12-17
US20210272925A1 (en) 2021-09-02
JP7333391B2 (ja) 2023-08-24
WO2019244136A8 (de) 2020-12-03
CN113169091A (zh) 2021-07-23
WO2019244136A9 (de) 2020-05-07
KR20210022050A (ko) 2021-03-02
WO2019244136A2 (de) 2019-12-26
JP2021529441A (ja) 2021-10-28
DE102018115144A1 (de) 2019-12-24
MY204833A (en) 2024-09-18

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