JP7333391B2 - 接合ヘッドのためのアクチュエータ - Google Patents

接合ヘッドのためのアクチュエータ Download PDF

Info

Publication number
JP7333391B2
JP7333391B2 JP2021520478A JP2021520478A JP7333391B2 JP 7333391 B2 JP7333391 B2 JP 7333391B2 JP 2021520478 A JP2021520478 A JP 2021520478A JP 2021520478 A JP2021520478 A JP 2021520478A JP 7333391 B2 JP7333391 B2 JP 7333391B2
Authority
JP
Japan
Prior art keywords
axis
movement
motion
contact surface
adjustment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021520478A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2019244136A5 (https=
JP2021529441A (ja
JP2021529441A5 (https=
Inventor
アエビシェール，マルクス
Original Assignee
ベシ スウィツァランド エージー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ベシ スウィツァランド エージー filed Critical ベシ スウィツァランド エージー
Publication of JP2021529441A publication Critical patent/JP2021529441A/ja
Publication of JPWO2019244136A5 publication Critical patent/JPWO2019244136A5/ja
Publication of JP2021529441A5 publication Critical patent/JP2021529441A5/ja
Application granted granted Critical
Publication of JP7333391B2 publication Critical patent/JP7333391B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2021520478A 2018-06-23 2019-06-23 接合ヘッドのためのアクチュエータ Active JP7333391B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102018115144.6A DE102018115144A1 (de) 2018-06-23 2018-06-23 Stellantrieb für einen Bondkopf
DE102018115144.6 2018-06-23
PCT/IB2019/055284 WO2019244136A2 (de) 2018-06-23 2019-06-23 Stellantrieb für einen bondkopf

Publications (4)

Publication Number Publication Date
JP2021529441A JP2021529441A (ja) 2021-10-28
JPWO2019244136A5 JPWO2019244136A5 (https=) 2022-07-19
JP2021529441A5 JP2021529441A5 (https=) 2022-07-19
JP7333391B2 true JP7333391B2 (ja) 2023-08-24

Family

ID=67766204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021520478A Active JP7333391B2 (ja) 2018-06-23 2019-06-23 接合ヘッドのためのアクチュエータ

Country Status (8)

Country Link
US (1) US12230599B2 (https=)
JP (1) JP7333391B2 (https=)
KR (1) KR102800366B1 (https=)
CN (1) CN113169091B (https=)
DE (1) DE102018115144A1 (https=)
MY (1) MY204833A (https=)
SG (1) SG11202012866TA (https=)
WO (1) WO2019244136A2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114005777B (zh) * 2021-12-24 2022-03-29 湖北三维半导体集成创新中心有限责任公司 键合装置和键合方法
CN113990790B (zh) * 2021-12-24 2022-03-18 湖北三维半导体集成创新中心有限责任公司 键合系统和键合方法
CN114005778B (zh) * 2021-12-24 2022-03-22 湖北三维半导体集成创新中心有限责任公司 键合系统和键合补偿方法
CN116417389B (zh) * 2023-06-08 2023-08-15 上海果纳半导体技术有限公司 晶圆盒搬运装置及方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000101294A (ja) 1998-09-18 2000-04-07 Sony Corp 部品装着装置
US20170156244A1 (en) 2014-08-13 2017-06-01 Shinkawa Ltd. Mounting apparatus and measuring method

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1022306A (ja) * 1996-06-28 1998-01-23 Hitachi Ltd ダイボンディング装置
JPH10107495A (ja) * 1996-09-26 1998-04-24 Matsushita Electric Ind Co Ltd 部品装着装置
JP3303705B2 (ja) * 1997-01-22 2002-07-22 松下電器産業株式会社 バンプ付電子部品の熱圧着装置
US6146912A (en) * 1999-05-11 2000-11-14 Trw Inc. Method for parallel alignment of a chip to substrate
JP2000340585A (ja) * 1999-05-31 2000-12-08 Sony Corp 平面平行度調整装置を備えた加工装置
JP2002280397A (ja) * 2001-03-19 2002-09-27 Furukawa Electric Co Ltd:The 面合わせ機構および面合わせ方法
JP2003040585A (ja) 2001-07-30 2003-02-13 Toyota Industries Corp オーダーピッカ
WO2004107432A1 (ja) * 2003-05-29 2004-12-09 Fujitsu Limited 電子部品の実装方法、取外し方法及びその装置
JP4642787B2 (ja) * 2006-05-09 2011-03-02 東京エレクトロン株式会社 基板搬送装置及び縦型熱処理装置
CN101632164B (zh) * 2006-10-31 2016-02-24 库力科及索法模压焊接有限责任公司 用于相对于基底定位和/或压制平面部件的装置及用于相对于基底定位拾取工具的方法
JP4958655B2 (ja) * 2007-06-27 2012-06-20 新光電気工業株式会社 電子部品実装装置および電子装置の製造方法
JP5065969B2 (ja) * 2008-03-31 2012-11-07 株式会社日立ハイテクインスツルメンツ 部品実装装置
KR101233221B1 (ko) * 2008-12-17 2013-02-15 세메스 주식회사 다이 본더용 피커 헤드
US8016010B2 (en) * 2009-09-02 2011-09-13 Asm Assembly Automation Ltd Rotary bonding tool which provides a large bond force
US8387851B1 (en) 2012-05-04 2013-03-05 Asm Technology Singapore Pte. Ltd. Apparatus for aligning a bonding tool of a die bonder
DE102012014558B4 (de) * 2012-07-24 2014-02-20 Datacon Technology Gmbh Kinematisches Haltesystem für einen Bestückkopf einer Bestückvorrichtung
SG11201504793TA (en) * 2012-12-21 2015-07-30 Shinkawa Kk Flip chip bonder and method for correcting flatness and deformation amount of bonding stage
CH707934B1 (de) * 2013-04-19 2017-04-28 Besi Switzerland Ag Verfahren zum Montieren von elektronischen oder optischen Bauelementen auf einem Substrat.
US10096568B2 (en) * 2014-09-18 2018-10-09 Asm Technology Singapore Pte Ltd Die bonding tool and system
CN104966687B (zh) * 2015-06-30 2017-08-25 北京中电科电子装备有限公司 一种键合头装置
KR102425309B1 (ko) * 2016-10-12 2022-07-26 삼성전자주식회사 본딩 헤드와 스테이지 사이의 평행도 보정 장치 및 이를 포함하는 칩 본더
WO2018146880A1 (ja) * 2017-02-09 2018-08-16 ボンドテック株式会社 部品実装システム、樹脂成形装置、部品実装方法および樹脂成形方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000101294A (ja) 1998-09-18 2000-04-07 Sony Corp 部品装着装置
US20170156244A1 (en) 2014-08-13 2017-06-01 Shinkawa Ltd. Mounting apparatus and measuring method

Also Published As

Publication number Publication date
WO2019244136A3 (de) 2020-03-12
US12230599B2 (en) 2025-02-18
KR102800366B1 (ko) 2025-04-25
CN113169091B (zh) 2024-12-17
US20210272925A1 (en) 2021-09-02
WO2019244136A8 (de) 2020-12-03
SG11202012866TA (en) 2021-02-25
CN113169091A (zh) 2021-07-23
WO2019244136A9 (de) 2020-05-07
KR20210022050A (ko) 2021-03-02
WO2019244136A2 (de) 2019-12-26
JP2021529441A (ja) 2021-10-28
DE102018115144A1 (de) 2019-12-24
MY204833A (en) 2024-09-18

Similar Documents

Publication Publication Date Title
JP7333391B2 (ja) 接合ヘッドのためのアクチュエータ
US6640423B1 (en) Apparatus and method for the placement and bonding of a die on a substrate
KR102394745B1 (ko) 전자 또는 광학 부품을 기판상에 실장하기 위한 방법 및 장치
JP2021529441A5 (https=)
US6456062B2 (en) Contact arm and electronic device testing apparatus using the same
US10492351B2 (en) Mounting apparatus and measuring method
TWI568553B (zh) 放置設備的放置頭之動態保持系統
JP5580163B2 (ja) 実装装置の平行度調整方法および平行度調整装置
EP0817973B1 (en) Interface apparatus for automatic test equipment
KR20130035263A (ko) 다이 본더 및 반도체 제조 방법
CN112771653B (zh) 顺应性裸晶附接工具、裸晶附接系统及其使用方法
TWI397970B (zh) 提供大鍵合力的旋轉鍵合工具
JPWO2019244136A5 (https=)
CN109950188B (zh) 设备和系统
KR101360007B1 (ko) 플립칩 본딩장치
HK40048985A (en) Actuating drive for a bonder head
JPH05131389A (ja) 対象物取扱装置
JP2002160187A (ja) 保持装置、搬送装置、ｉｃ検査装置、保持方法、搬送方法及びｉｃ検査方法
KR100866537B1 (ko) 콘택트유닛 구동장치, 그를 포함하는 테스트 핸들러, 및그를 포함하는 반도체 소자 제조방법
KR102844921B1 (ko) 전자부품 정렬 장치
JP2017106885A (ja) プローブユニット、プロービング機構および基板検査装置
JP2003017533A (ja) チップボンディング装置におけるチップ供給方法および装置
JP2023101842A (ja) 部品装着装置および部品装着方法
KR20230159508A (ko) 부품 이송 장치
KR20060033038A (ko) 부품장착 장치 및 부품장착 방법

Legal Events

Date Code Title Description
A529 Written submission of copy of amendment under article 34 pct

Free format text: JAPANESE INTERMEDIATE CODE: A529

Effective date: 20210204

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220621

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220708

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230202

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230427

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230721

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230814

R150 Certificate of patent or registration of utility model

Ref document number: 7333391

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150