WO2019244136A3 - Stellantrieb für einen bondkopf - Google Patents
Stellantrieb für einen bondkopf Download PDFInfo
- Publication number
- WO2019244136A3 WO2019244136A3 PCT/IB2019/055284 IB2019055284W WO2019244136A3 WO 2019244136 A3 WO2019244136 A3 WO 2019244136A3 IB 2019055284 W IB2019055284 W IB 2019055284W WO 2019244136 A3 WO2019244136 A3 WO 2019244136A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- movement
- axis
- rotation
- pinion
- along
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75702—Means for aligning in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
- H01L2224/75822—Rotational mechanism
- H01L2224/75823—Pivoting mechanism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
- H01L2224/75824—Translational mechanism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75841—Means for moving parts of the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75841—Means for moving parts of the bonding head
- H01L2224/75842—Rotational mechanism
- H01L2224/75843—Pivoting mechanism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/759—Means for monitoring the connection process
- H01L2224/75901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201980055452.0A CN113169091A (zh) | 2018-06-23 | 2019-06-23 | 用于键合头的致动器 |
JP2021520478A JP7333391B2 (ja) | 2018-06-23 | 2019-06-23 | 接合ヘッドのためのアクチュエータ |
SG11202012866TA SG11202012866TA (en) | 2018-06-23 | 2019-06-23 | Actuator for a bonding head |
US17/252,756 US20210272925A1 (en) | 2018-06-23 | 2019-06-23 | Actuator for a Bonding Head |
KR1020217001107A KR20210022050A (ko) | 2018-06-23 | 2019-06-23 | 본딩 헤드용 액추에이터 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102018115144.6A DE102018115144A1 (de) | 2018-06-23 | 2018-06-23 | Stellantrieb für einen Bondkopf |
DE102018115144.6 | 2018-06-23 |
Publications (4)
Publication Number | Publication Date |
---|---|
WO2019244136A2 WO2019244136A2 (de) | 2019-12-26 |
WO2019244136A3 true WO2019244136A3 (de) | 2020-03-12 |
WO2019244136A9 WO2019244136A9 (de) | 2020-05-07 |
WO2019244136A8 WO2019244136A8 (de) | 2020-12-03 |
Family
ID=67766204
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2019/055284 WO2019244136A2 (de) | 2018-06-23 | 2019-06-23 | Stellantrieb für einen bondkopf |
Country Status (7)
Country | Link |
---|---|
US (1) | US20210272925A1 (de) |
JP (1) | JP7333391B2 (de) |
KR (1) | KR20210022050A (de) |
CN (1) | CN113169091A (de) |
DE (1) | DE102018115144A1 (de) |
SG (1) | SG11202012866TA (de) |
WO (1) | WO2019244136A2 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114005777B (zh) * | 2021-12-24 | 2022-03-29 | 湖北三维半导体集成创新中心有限责任公司 | 键合装置和键合方法 |
CN113990790B (zh) * | 2021-12-24 | 2022-03-18 | 湖北三维半导体集成创新中心有限责任公司 | 键合系统和键合方法 |
CN114005778B (zh) * | 2021-12-24 | 2022-03-22 | 湖北三维半导体集成创新中心有限责任公司 | 键合系统和键合补偿方法 |
CN116417389B (zh) * | 2023-06-08 | 2023-08-15 | 上海果纳半导体技术有限公司 | 晶圆盒搬运装置及方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998014041A1 (fr) * | 1996-09-26 | 1998-04-02 | Matsushita Electric Industrial Co., Ltd. | Dispositif de montage d'elements |
JPH10209223A (ja) * | 1997-01-22 | 1998-08-07 | Matsushita Electric Ind Co Ltd | バンプ付電子部品の圧着装置 |
JP2000101294A (ja) * | 1998-09-18 | 2000-04-07 | Sony Corp | 部品装着装置 |
JP2000340585A (ja) * | 1999-05-31 | 2000-12-08 | Sony Corp | 平面平行度調整装置を備えた加工装置 |
KR20100069973A (ko) * | 2008-12-17 | 2010-06-25 | 세크론 주식회사 | 다이 본더용 피커 헤드 |
US8387851B1 (en) * | 2012-05-04 | 2013-03-05 | Asm Technology Singapore Pte. Ltd. | Apparatus for aligning a bonding tool of a die bonder |
US20170156244A1 (en) * | 2014-08-13 | 2017-06-01 | Shinkawa Ltd. | Mounting apparatus and measuring method |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6146912A (en) * | 1999-05-11 | 2000-11-14 | Trw Inc. | Method for parallel alignment of a chip to substrate |
JP2002280397A (ja) * | 2001-03-19 | 2002-09-27 | Furukawa Electric Co Ltd:The | 面合わせ機構および面合わせ方法 |
KR20090077009A (ko) * | 2006-10-31 | 2009-07-13 | 알파셈 게엠베하 | 기판에 대한 면형 구성요소의 위치 결정 및/또는 가압 장치와 기판에 대한 피킹 공구의 위치 결정 방법 |
JP5065969B2 (ja) * | 2008-03-31 | 2012-11-07 | 株式会社日立ハイテクインスツルメンツ | 部品実装装置 |
US8016010B2 (en) * | 2009-09-02 | 2011-09-13 | Asm Assembly Automation Ltd | Rotary bonding tool which provides a large bond force |
DE102012014558B4 (de) * | 2012-07-24 | 2014-02-20 | Datacon Technology Gmbh | Kinematisches Haltesystem für einen Bestückkopf einer Bestückvorrichtung |
CN104966687B (zh) * | 2015-06-30 | 2017-08-25 | 北京中电科电子装备有限公司 | 一种键合头装置 |
-
2018
- 2018-06-23 DE DE102018115144.6A patent/DE102018115144A1/de active Pending
-
2019
- 2019-06-23 KR KR1020217001107A patent/KR20210022050A/ko not_active Application Discontinuation
- 2019-06-23 CN CN201980055452.0A patent/CN113169091A/zh active Pending
- 2019-06-23 WO PCT/IB2019/055284 patent/WO2019244136A2/de active Application Filing
- 2019-06-23 SG SG11202012866TA patent/SG11202012866TA/en unknown
- 2019-06-23 JP JP2021520478A patent/JP7333391B2/ja active Active
- 2019-06-23 US US17/252,756 patent/US20210272925A1/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998014041A1 (fr) * | 1996-09-26 | 1998-04-02 | Matsushita Electric Industrial Co., Ltd. | Dispositif de montage d'elements |
JPH10209223A (ja) * | 1997-01-22 | 1998-08-07 | Matsushita Electric Ind Co Ltd | バンプ付電子部品の圧着装置 |
JP2000101294A (ja) * | 1998-09-18 | 2000-04-07 | Sony Corp | 部品装着装置 |
JP2000340585A (ja) * | 1999-05-31 | 2000-12-08 | Sony Corp | 平面平行度調整装置を備えた加工装置 |
KR20100069973A (ko) * | 2008-12-17 | 2010-06-25 | 세크론 주식회사 | 다이 본더용 피커 헤드 |
US8387851B1 (en) * | 2012-05-04 | 2013-03-05 | Asm Technology Singapore Pte. Ltd. | Apparatus for aligning a bonding tool of a die bonder |
US20170156244A1 (en) * | 2014-08-13 | 2017-06-01 | Shinkawa Ltd. | Mounting apparatus and measuring method |
Also Published As
Publication number | Publication date |
---|---|
JP7333391B2 (ja) | 2023-08-24 |
WO2019244136A8 (de) | 2020-12-03 |
WO2019244136A9 (de) | 2020-05-07 |
SG11202012866TA (en) | 2021-02-25 |
CN113169091A (zh) | 2021-07-23 |
WO2019244136A2 (de) | 2019-12-26 |
KR20210022050A (ko) | 2021-03-02 |
DE102018115144A1 (de) | 2019-12-24 |
US20210272925A1 (en) | 2021-09-02 |
JP2021529441A (ja) | 2021-10-28 |
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