DE102018115144A1 - Stellantrieb für einen Bondkopf - Google Patents

Stellantrieb für einen Bondkopf Download PDF

Info

Publication number
DE102018115144A1
DE102018115144A1 DE102018115144.6A DE102018115144A DE102018115144A1 DE 102018115144 A1 DE102018115144 A1 DE 102018115144A1 DE 102018115144 A DE102018115144 A DE 102018115144A DE 102018115144 A1 DE102018115144 A1 DE 102018115144A1
Authority
DE
Germany
Prior art keywords
axis
movement
bondhead
substrate
contact surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE102018115144.6A
Other languages
German (de)
English (en)
Inventor
Markus Aebischer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Besi Switzerland AG
Original Assignee
Besi Switzerland AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Switzerland AG filed Critical Besi Switzerland AG
Priority to DE102018115144.6A priority Critical patent/DE102018115144A1/de
Priority to CN201980055452.0A priority patent/CN113169091B/zh
Priority to KR1020217001107A priority patent/KR102800366B1/ko
Priority to SG11202012866TA priority patent/SG11202012866TA/en
Priority to JP2021520478A priority patent/JP7333391B2/ja
Priority to US17/252,756 priority patent/US12230599B2/en
Priority to MYPI2020006742A priority patent/MY204833A/en
Priority to PCT/IB2019/055284 priority patent/WO2019244136A2/de
Publication of DE102018115144A1 publication Critical patent/DE102018115144A1/de
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE102018115144.6A 2018-06-23 2018-06-23 Stellantrieb für einen Bondkopf Pending DE102018115144A1 (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DE102018115144.6A DE102018115144A1 (de) 2018-06-23 2018-06-23 Stellantrieb für einen Bondkopf
CN201980055452.0A CN113169091B (zh) 2018-06-23 2019-06-23 用于键合头的致动器
KR1020217001107A KR102800366B1 (ko) 2018-06-23 2019-06-23 본딩 헤드용 액추에이터
SG11202012866TA SG11202012866TA (en) 2018-06-23 2019-06-23 Actuator for a bonding head
JP2021520478A JP7333391B2 (ja) 2018-06-23 2019-06-23 接合ヘッドのためのアクチュエータ
US17/252,756 US12230599B2 (en) 2018-06-23 2019-06-23 Method for actuating a bonding head
MYPI2020006742A MY204833A (en) 2018-06-23 2019-06-23 Actuator for a bonding head
PCT/IB2019/055284 WO2019244136A2 (de) 2018-06-23 2019-06-23 Stellantrieb für einen bondkopf

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102018115144.6A DE102018115144A1 (de) 2018-06-23 2018-06-23 Stellantrieb für einen Bondkopf

Publications (1)

Publication Number Publication Date
DE102018115144A1 true DE102018115144A1 (de) 2019-12-24

Family

ID=67766204

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102018115144.6A Pending DE102018115144A1 (de) 2018-06-23 2018-06-23 Stellantrieb für einen Bondkopf

Country Status (8)

Country Link
US (1) US12230599B2 (https=)
JP (1) JP7333391B2 (https=)
KR (1) KR102800366B1 (https=)
CN (1) CN113169091B (https=)
DE (1) DE102018115144A1 (https=)
MY (1) MY204833A (https=)
SG (1) SG11202012866TA (https=)
WO (1) WO2019244136A2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114005777B (zh) * 2021-12-24 2022-03-29 湖北三维半导体集成创新中心有限责任公司 键合装置和键合方法
CN113990790B (zh) * 2021-12-24 2022-03-18 湖北三维半导体集成创新中心有限责任公司 键合系统和键合方法
CN114005778B (zh) * 2021-12-24 2022-03-22 湖北三维半导体集成创新中心有限责任公司 键合系统和键合补偿方法
CN116417389B (zh) * 2023-06-08 2023-08-15 上海果纳半导体技术有限公司 晶圆盒搬运装置及方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10107495A (ja) * 1996-09-26 1998-04-24 Matsushita Electric Ind Co Ltd 部品装着装置
WO2008052594A1 (de) * 2006-10-31 2008-05-08 Alphasem Gmbh Vorrichtung zum positionieren und/oder anpressen eines flächigen bauteils relativ zu einem substrat und verfahren zum positionieren eines aufnahmewerkzeugs relativ zu einem substrat
US8387851B1 (en) 2012-05-04 2013-03-05 Asm Technology Singapore Pte. Ltd. Apparatus for aligning a bonding tool of a die bonder
DE102012014558A1 (de) * 2012-07-24 2014-01-30 Datacon Technology Gmbh Kinematisches Haltesystem für einen Bestückkopf einer Bestückvorrichtung

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1022306A (ja) * 1996-06-28 1998-01-23 Hitachi Ltd ダイボンディング装置
JP3303705B2 (ja) * 1997-01-22 2002-07-22 松下電器産業株式会社 バンプ付電子部品の熱圧着装置
JP2000101294A (ja) * 1998-09-18 2000-04-07 Sony Corp 部品装着装置
US6146912A (en) * 1999-05-11 2000-11-14 Trw Inc. Method for parallel alignment of a chip to substrate
JP2000340585A (ja) * 1999-05-31 2000-12-08 Sony Corp 平面平行度調整装置を備えた加工装置
JP2002280397A (ja) * 2001-03-19 2002-09-27 Furukawa Electric Co Ltd:The 面合わせ機構および面合わせ方法
JP2003040585A (ja) 2001-07-30 2003-02-13 Toyota Industries Corp オーダーピッカ
WO2004107432A1 (ja) * 2003-05-29 2004-12-09 Fujitsu Limited 電子部品の実装方法、取外し方法及びその装置
JP4642787B2 (ja) * 2006-05-09 2011-03-02 東京エレクトロン株式会社 基板搬送装置及び縦型熱処理装置
JP4958655B2 (ja) * 2007-06-27 2012-06-20 新光電気工業株式会社 電子部品実装装置および電子装置の製造方法
JP5065969B2 (ja) * 2008-03-31 2012-11-07 株式会社日立ハイテクインスツルメンツ 部品実装装置
KR101233221B1 (ko) * 2008-12-17 2013-02-15 세메스 주식회사 다이 본더용 피커 헤드
US8016010B2 (en) * 2009-09-02 2011-09-13 Asm Assembly Automation Ltd Rotary bonding tool which provides a large bond force
SG11201504793TA (en) * 2012-12-21 2015-07-30 Shinkawa Kk Flip chip bonder and method for correcting flatness and deformation amount of bonding stage
CH707934B1 (de) * 2013-04-19 2017-04-28 Besi Switzerland Ag Verfahren zum Montieren von elektronischen oder optischen Bauelementen auf einem Substrat.
JP6422499B2 (ja) * 2014-08-13 2018-11-14 株式会社新川 実装装置および測定方法
US10096568B2 (en) * 2014-09-18 2018-10-09 Asm Technology Singapore Pte Ltd Die bonding tool and system
CN104966687B (zh) * 2015-06-30 2017-08-25 北京中电科电子装备有限公司 一种键合头装置
KR102425309B1 (ko) * 2016-10-12 2022-07-26 삼성전자주식회사 본딩 헤드와 스테이지 사이의 평행도 보정 장치 및 이를 포함하는 칩 본더
WO2018146880A1 (ja) * 2017-02-09 2018-08-16 ボンドテック株式会社 部品実装システム、樹脂成形装置、部品実装方法および樹脂成形方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10107495A (ja) * 1996-09-26 1998-04-24 Matsushita Electric Ind Co Ltd 部品装着装置
WO2008052594A1 (de) * 2006-10-31 2008-05-08 Alphasem Gmbh Vorrichtung zum positionieren und/oder anpressen eines flächigen bauteils relativ zu einem substrat und verfahren zum positionieren eines aufnahmewerkzeugs relativ zu einem substrat
US8387851B1 (en) 2012-05-04 2013-03-05 Asm Technology Singapore Pte. Ltd. Apparatus for aligning a bonding tool of a die bonder
DE102012014558A1 (de) * 2012-07-24 2014-01-30 Datacon Technology Gmbh Kinematisches Haltesystem für einen Bestückkopf einer Bestückvorrichtung

Also Published As

Publication number Publication date
WO2019244136A3 (de) 2020-03-12
US12230599B2 (en) 2025-02-18
KR102800366B1 (ko) 2025-04-25
CN113169091B (zh) 2024-12-17
US20210272925A1 (en) 2021-09-02
JP7333391B2 (ja) 2023-08-24
WO2019244136A8 (de) 2020-12-03
SG11202012866TA (en) 2021-02-25
CN113169091A (zh) 2021-07-23
WO2019244136A9 (de) 2020-05-07
KR20210022050A (ko) 2021-03-02
WO2019244136A2 (de) 2019-12-26
JP2021529441A (ja) 2021-10-28
MY204833A (en) 2024-09-18

Similar Documents

Publication Publication Date Title
DE69420500T2 (de) Messsystem
DE69508542T2 (de) Verfahren und Gerät zur automatischen Ankopplung eines Testkopfs an ein Schaltungsbehandlungsgerät
DE68920405T2 (de) Ausrichtungsvorrichtung.
DE102018115144A1 (de) Stellantrieb für einen Bondkopf
DE102012014558B4 (de) Kinematisches Haltesystem für einen Bestückkopf einer Bestückvorrichtung
CH707934A1 (de) Verfahren zum Montieren von elektronischen oder optischen Bauelementen auf einem Substrat.
DE102006021084B4 (de) Kalibrierungsverfahren für eine Parallelkinematikmechanismusmaschine
EP3332261A1 (de) Positioniereinrichtung für einen paralleltester zum testen von leiterplatten und paralleltester zum testen von leiterplatten
DE102020204746A1 (de) Überprüfvorrichtung und bearbeitungsvorrichtung mit derselben
DE10392404T5 (de) Messkopfausrichtungsvorrichtung
DE102010025760A1 (de) Vorrichtung zum Testen einer integrierten Schaltung
DE112016003448T5 (de) Tischvorrichtung, Positionierungsvorrichtung, Flachtafelanzeigen-Herstellungsvorrichtung und Präzisionsmaschine
EP3648152A1 (de) Verfahren zum anlernen oder kontrollieren eines roboters sowie hierfür verwendetes system
EP0877544A1 (de) Einrichtung und Verfahren zur Montage von Halbleiterchips auf einem Substrat
DE19805040A1 (de) Durchlichtbeleuchtung für Koordinatenmeßmaschinen
WO2024142028A1 (de) Verfahren und vorrichtung zur bestimmung eines positionierungsfehlers einer aufnehmbaren komponente
DE10028569A1 (de) Vorrichtung zum Positionieren scheibenförmiger Objekte
EP3083159B1 (de) Positioniereinrichtung
DE2930317C2 (de) Verfahren zur optisch optimalen Verbindung einer optischen Faser mit einem optoelektronischen Bauelement
DE112011100388T5 (de) Verfahren und Vorrichtung zum Überführen von Chips aus einem Wafer
DE102007005151A1 (de) Mehrfach-Bestückkopf mit kollektivem Drehantrieb und verfahrbarem Hubantrieb für Bauelement-Halteeinrichtungen
DE102005025130B4 (de) Handhabungsvorrichtung zur Manipulation von Mikrobauteilen
EP0998184B1 (de) Verfahren zum Handhaben von Bauteilen mittels eines Handhabungsgerätes und Handhabungsgerät zur Durchführung des Verfahrens
DE102024120242A1 (de) Verfahren zur Bauteilmontage und dafür geeignete Vorrichtung
DE102024112858A1 (de) Verfahren und Vorrichtung zur Positionierung eines Bauteils

Legal Events

Date Code Title Description
R012 Request for examination validly filed
R163 Identified publications notified
R016 Response to examination communication
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0021670000

Ipc: H10P0072000000