CN103579046B - 放置设备的放置头的运动学保持系统 - Google Patents

放置设备的放置头的运动学保持系统 Download PDF

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Publication number
CN103579046B
CN103579046B CN201310304630.3A CN201310304630A CN103579046B CN 103579046 B CN103579046 B CN 103579046B CN 201310304630 A CN201310304630 A CN 201310304630A CN 103579046 B CN103579046 B CN 103579046B
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CN
China
Prior art keywords
placement head
placement
axis
deformation
rigid joint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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CN201310304630.3A
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English (en)
Chinese (zh)
Other versions
CN103579046A (zh
Inventor
翰尼斯·科斯特纳
迪特马尔·莱克纳
弗洛里安·斯皮尔
马丁·维道尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Besi Switzerland AG
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Besi Switzerland AG
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Publication date
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Publication of CN103579046A publication Critical patent/CN103579046A/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J17/00—Joints
    • B25J17/02—Wrist joints
    • B25J17/0208—Compliance devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Die Bonding (AREA)
CN201310304630.3A 2012-07-24 2013-07-18 放置设备的放置头的运动学保持系统 Active CN103579046B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012014558.6 2012-07-24
DE102012014558.6A DE102012014558B4 (de) 2012-07-24 2012-07-24 Kinematisches Haltesystem für einen Bestückkopf einer Bestückvorrichtung

Publications (2)

Publication Number Publication Date
CN103579046A CN103579046A (zh) 2014-02-12
CN103579046B true CN103579046B (zh) 2017-12-19

Family

ID=49911952

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310304630.3A Active CN103579046B (zh) 2012-07-24 2013-07-18 放置设备的放置头的运动学保持系统

Country Status (8)

Country Link
US (2) US9364953B2 (https=)
JP (2) JP2014027270A (https=)
KR (2) KR102080351B1 (https=)
CN (1) CN103579046B (https=)
DE (1) DE102012014558B4 (https=)
MY (1) MY183739A (https=)
SG (1) SG196716A1 (https=)
TW (1) TWI568553B (https=)

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KR102425309B1 (ko) * 2016-10-12 2022-07-26 삼성전자주식회사 본딩 헤드와 스테이지 사이의 평행도 보정 장치 및 이를 포함하는 칩 본더
US10969761B2 (en) * 2016-11-17 2021-04-06 Fuji Corporation Operation machine
US10050008B1 (en) * 2017-01-24 2018-08-14 Asm Technology Singapore Pte Ltd Method and system for automatic bond arm alignment
DE102018115144A1 (de) * 2018-06-23 2019-12-24 Besi Switzerland Ag Stellantrieb für einen Bondkopf
KR102175151B1 (ko) * 2019-01-04 2020-11-06 마점래 2차 전지 조립용 가변형 코킹장치
CN110369985B (zh) * 2019-07-05 2024-05-17 江苏烽禾升科技股份有限公司 一种异形笔夹入料机构
DE102020213148B4 (de) * 2020-10-19 2026-04-23 Mahle International Gmbh Vorrichtung zur Montage eines Stopfens in einer Hohlwelle
KR102874158B1 (ko) 2020-10-22 2025-10-22 삼성전자주식회사 반도체 공정 스테이지 구조체, 반도체 칩 픽업 시스템 및 픽업헤드 틸팅 제어 방법
EP4052868A1 (de) * 2021-02-15 2022-09-07 Stöger Automation GmbH Automatisches schraubsystem zum verbinden von bauteilen
CN115734512B (zh) * 2022-11-30 2026-02-06 格力电器(赣州)有限公司 存取结构
CN117208572B (zh) * 2023-11-09 2024-02-13 四川名人居门窗有限公司 一种玻璃吸盘车摆动结构

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CN1823399A (zh) * 2003-08-27 2006-08-23 松下电器产业株式会社 元件安装设备和元件安装方法
CN101632165A (zh) * 2007-02-15 2010-01-20 宰体有限公司 用于传输工具的拾取器以及具有该拾取器的传输工具

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US5079493A (en) * 1989-05-31 1992-01-07 Research Development Corporation Of Japan Ultra-precise positioning system
CN1823399A (zh) * 2003-08-27 2006-08-23 松下电器产业株式会社 元件安装设备和元件安装方法
CN101632165A (zh) * 2007-02-15 2010-01-20 宰体有限公司 用于传输工具的拾取器以及具有该拾取器的传输工具

Also Published As

Publication number Publication date
MY183739A (en) 2021-03-10
KR20140015197A (ko) 2014-02-06
US9364953B2 (en) 2016-06-14
TW201412479A (zh) 2014-04-01
JP2014027270A (ja) 2014-02-06
DE102012014558B4 (de) 2014-02-20
CN103579046A (zh) 2014-02-12
KR102080351B1 (ko) 2020-02-21
US20140030052A1 (en) 2014-01-30
DE102012014558A1 (de) 2014-01-30
KR102080447B1 (ko) 2020-02-21
US20160167237A1 (en) 2016-06-16
JP2018098508A (ja) 2018-06-21
TWI568553B (zh) 2017-02-01
JP6547979B2 (ja) 2019-07-24
US9956692B2 (en) 2018-05-01
KR20190126040A (ko) 2019-11-08
SG196716A1 (en) 2014-02-13

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