JP2014003245A5 - - Google Patents

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Publication number
JP2014003245A5
JP2014003245A5 JP2012139213A JP2012139213A JP2014003245A5 JP 2014003245 A5 JP2014003245 A5 JP 2014003245A5 JP 2012139213 A JP2012139213 A JP 2012139213A JP 2012139213 A JP2012139213 A JP 2012139213A JP 2014003245 A5 JP2014003245 A5 JP 2014003245A5
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JP
Japan
Prior art keywords
laminate
plate member
sticking
plate
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012139213A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014003245A (ja
JP5977592B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2012139213A external-priority patent/JP5977592B2/ja
Priority to JP2012139213A priority Critical patent/JP5977592B2/ja
Priority to US14/408,903 priority patent/US9548232B2/en
Priority to KR1020167019018A priority patent/KR101678352B1/ko
Priority to PCT/JP2013/062816 priority patent/WO2013190926A1/ja
Priority to KR1020157000444A priority patent/KR20150031435A/ko
Priority to TW102117203A priority patent/TWI505939B/zh
Publication of JP2014003245A publication Critical patent/JP2014003245A/ja
Publication of JP2014003245A5 publication Critical patent/JP2014003245A5/ja
Publication of JP5977592B2 publication Critical patent/JP5977592B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012139213A 2012-06-20 2012-06-20 貼付装置 Active JP5977592B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2012139213A JP5977592B2 (ja) 2012-06-20 2012-06-20 貼付装置
KR1020157000444A KR20150031435A (ko) 2012-06-20 2013-05-07 첩부 장치
KR1020167019018A KR101678352B1 (ko) 2012-06-20 2013-05-07 첩부 장치
PCT/JP2013/062816 WO2013190926A1 (ja) 2012-06-20 2013-05-07 貼付装置
US14/408,903 US9548232B2 (en) 2012-06-20 2013-05-07 Attaching apparatus
TW102117203A TWI505939B (zh) 2012-06-20 2013-05-15 貼合裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012139213A JP5977592B2 (ja) 2012-06-20 2012-06-20 貼付装置

Publications (3)

Publication Number Publication Date
JP2014003245A JP2014003245A (ja) 2014-01-09
JP2014003245A5 true JP2014003245A5 (enExample) 2015-11-12
JP5977592B2 JP5977592B2 (ja) 2016-08-24

Family

ID=49768532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012139213A Active JP5977592B2 (ja) 2012-06-20 2012-06-20 貼付装置

Country Status (5)

Country Link
US (1) US9548232B2 (enExample)
JP (1) JP5977592B2 (enExample)
KR (2) KR20150031435A (enExample)
TW (1) TWI505939B (enExample)
WO (1) WO2013190926A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6855399B2 (ja) 2018-01-26 2021-04-07 株式会社スギノマシン ノズルの振れの測定方法及びその装置
JP7355709B2 (ja) * 2020-05-29 2023-10-03 株式会社 日立パワーデバイス 接合治具および半導体装置の製造方法
IT202100018458A1 (it) * 2021-07-13 2023-01-13 Amx Automatrix S R L Pressa di sinterizzazione

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3165453B2 (ja) 1991-01-31 2001-05-14 富士通株式会社 プラズマディスプレイパネルの製造方法
JPH07335512A (ja) * 1994-06-08 1995-12-22 Canon Inc 接合方法および接合装置および接合物
JPH09316399A (ja) * 1996-05-28 1997-12-09 Canon Inc 基板貼合せ装置及び基板貼合せ方法
JP2980073B2 (ja) 1997-08-29 1999-11-22 日本電気株式会社 熱圧着装置及びその制御方法
US6081414A (en) 1998-05-01 2000-06-27 Applied Materials, Inc. Apparatus for improved biasing and retaining of a workpiece in a workpiece processing system
JP2002192394A (ja) 2000-12-28 2002-07-10 Mitsubishi Gas Chem Co Inc 無機基板のプレス加工法およびプレス装置
JP3487833B2 (ja) * 2001-04-24 2004-01-19 株式会社 日立インダストリイズ 基板貼り合わせ方法及び貼り合わせ装置
JP2003241157A (ja) * 2002-02-21 2003-08-27 Shibaura Mechatronics Corp 基板貼り合わせ装置、基板貼り合わせ方法、及び液晶表示パネルの製造装置、並びに製造方法
JP2003347360A (ja) * 2002-05-31 2003-12-05 Sumitomo Electric Ind Ltd ボンディングステージ
KR100511854B1 (ko) 2002-06-18 2005-09-02 아네르바 가부시키가이샤 정전 흡착 장치
JP4245138B2 (ja) * 2003-03-11 2009-03-25 富士通株式会社 基板貼合せ装置及び基板貼合せ方法
JP4031732B2 (ja) * 2003-05-26 2008-01-09 京セラ株式会社 静電チャック
JP4513329B2 (ja) * 2004-01-16 2010-07-28 東京エレクトロン株式会社 処理装置
US20060000802A1 (en) * 2004-06-30 2006-01-05 Ajay Kumar Method and apparatus for photomask plasma etching
JP4480660B2 (ja) * 2005-10-27 2010-06-16 Ｎｅｃエンジニアリング株式会社 基板貼り合わせ装置
US20090041568A1 (en) * 2006-01-31 2009-02-12 Tokyo Electron Limited Substrate processing apparatus, substrate placing table used for same, and member exposed to plasma
KR20080002323A (ko) 2006-06-30 2008-01-04 엘지.필립스 엘시디 주식회사 합착 스테이지와 그 제어 장치 및 방법
JP5160802B2 (ja) 2007-03-27 2013-03-13 東京エレクトロン株式会社 プラズマ処理装置
TWI493609B (zh) 2007-10-23 2015-07-21 Semiconductor Energy Lab 半導體基板、顯示面板及顯示裝置的製造方法
KR100961871B1 (ko) 2008-04-02 2010-06-09 에이피시스템 주식회사 기판 접합 장치
WO2010019430A2 (en) 2008-08-12 2010-02-18 Applied Materials, Inc. Electrostatic chuck assembly
KR101359070B1 (ko) 2009-03-03 2014-02-05 도쿄엘렉트론가부시키가이샤 탑재대 구조, 성막 장치 및 원료 회수 방법
JP5482282B2 (ja) * 2009-03-03 2014-05-07 東京エレクトロン株式会社 載置台構造及び成膜装置
KR101522633B1 (ko) 2009-04-08 2015-05-22 주식회사 원익아이피에스 진공처리장치
FR2961630B1 (fr) 2010-06-22 2013-03-29 Soitec Silicon On Insulator Technologies Appareil de fabrication de dispositifs semi-conducteurs
KR101145756B1 (ko) 2010-07-30 2012-05-16 이지스코 주식회사 고무 점착식 척킹기구 및 이를 이용한 기판 합착장치
JP5379171B2 (ja) * 2010-08-23 2013-12-25 東京エレクトロン株式会社 接合システム、基板処理システム、接合方法、プログラム及びコンピュータ記憶媒体
CN103620744B (zh) * 2011-05-31 2017-09-29 应用材料公司 用于带有边缘、侧边及背面保护的干蚀刻的装置及方法
TWI585028B (zh) * 2013-01-30 2017-06-01 斯克林集團公司 剝離裝置及剝離方法

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