JP5977592B2 - 貼付装置 - Google Patents

貼付装置 Download PDF

Info

Publication number
JP5977592B2
JP5977592B2 JP2012139213A JP2012139213A JP5977592B2 JP 5977592 B2 JP5977592 B2 JP 5977592B2 JP 2012139213 A JP2012139213 A JP 2012139213A JP 2012139213 A JP2012139213 A JP 2012139213A JP 5977592 B2 JP5977592 B2 JP 5977592B2
Authority
JP
Japan
Prior art keywords
plate
support
plate member
laminate
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012139213A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014003245A5 (enExample
JP2014003245A (ja
Inventor
純一 桂川
純一 桂川
吉浩 稲尾
吉浩 稲尾
加藤　茂
茂 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2012139213A priority Critical patent/JP5977592B2/ja
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to US14/408,903 priority patent/US9548232B2/en
Priority to KR1020157000444A priority patent/KR20150031435A/ko
Priority to KR1020167019018A priority patent/KR101678352B1/ko
Priority to PCT/JP2013/062816 priority patent/WO2013190926A1/ja
Priority to TW102117203A priority patent/TWI505939B/zh
Publication of JP2014003245A publication Critical patent/JP2014003245A/ja
Publication of JP2014003245A5 publication Critical patent/JP2014003245A5/ja
Application granted granted Critical
Publication of JP5977592B2 publication Critical patent/JP5977592B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2012139213A 2012-06-20 2012-06-20 貼付装置 Active JP5977592B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2012139213A JP5977592B2 (ja) 2012-06-20 2012-06-20 貼付装置
KR1020157000444A KR20150031435A (ko) 2012-06-20 2013-05-07 첩부 장치
KR1020167019018A KR101678352B1 (ko) 2012-06-20 2013-05-07 첩부 장치
PCT/JP2013/062816 WO2013190926A1 (ja) 2012-06-20 2013-05-07 貼付装置
US14/408,903 US9548232B2 (en) 2012-06-20 2013-05-07 Attaching apparatus
TW102117203A TWI505939B (zh) 2012-06-20 2013-05-15 貼合裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012139213A JP5977592B2 (ja) 2012-06-20 2012-06-20 貼付装置

Publications (3)

Publication Number Publication Date
JP2014003245A JP2014003245A (ja) 2014-01-09
JP2014003245A5 JP2014003245A5 (enExample) 2015-11-12
JP5977592B2 true JP5977592B2 (ja) 2016-08-24

Family

ID=49768532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012139213A Active JP5977592B2 (ja) 2012-06-20 2012-06-20 貼付装置

Country Status (5)

Country Link
US (1) US9548232B2 (enExample)
JP (1) JP5977592B2 (enExample)
KR (2) KR20150031435A (enExample)
TW (1) TWI505939B (enExample)
WO (1) WO2013190926A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6855399B2 (ja) 2018-01-26 2021-04-07 株式会社スギノマシン ノズルの振れの測定方法及びその装置
JP7355709B2 (ja) * 2020-05-29 2023-10-03 株式会社 日立パワーデバイス 接合治具および半導体装置の製造方法
IT202100018458A1 (it) * 2021-07-13 2023-01-13 Amx Automatrix S R L Pressa di sinterizzazione

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3165453B2 (ja) 1991-01-31 2001-05-14 富士通株式会社 プラズマディスプレイパネルの製造方法
JPH07335512A (ja) * 1994-06-08 1995-12-22 Canon Inc 接合方法および接合装置および接合物
JPH09316399A (ja) * 1996-05-28 1997-12-09 Canon Inc 基板貼合せ装置及び基板貼合せ方法
JP2980073B2 (ja) 1997-08-29 1999-11-22 日本電気株式会社 熱圧着装置及びその制御方法
US6081414A (en) 1998-05-01 2000-06-27 Applied Materials, Inc. Apparatus for improved biasing and retaining of a workpiece in a workpiece processing system
JP2002192394A (ja) 2000-12-28 2002-07-10 Mitsubishi Gas Chem Co Inc 無機基板のプレス加工法およびプレス装置
JP3487833B2 (ja) * 2001-04-24 2004-01-19 株式会社 日立インダストリイズ 基板貼り合わせ方法及び貼り合わせ装置
JP2003241157A (ja) * 2002-02-21 2003-08-27 Shibaura Mechatronics Corp 基板貼り合わせ装置、基板貼り合わせ方法、及び液晶表示パネルの製造装置、並びに製造方法
JP2003347360A (ja) * 2002-05-31 2003-12-05 Sumitomo Electric Ind Ltd ボンディングステージ
KR100511854B1 (ko) 2002-06-18 2005-09-02 아네르바 가부시키가이샤 정전 흡착 장치
JP4245138B2 (ja) * 2003-03-11 2009-03-25 富士通株式会社 基板貼合せ装置及び基板貼合せ方法
JP4031732B2 (ja) * 2003-05-26 2008-01-09 京セラ株式会社 静電チャック
JP4513329B2 (ja) * 2004-01-16 2010-07-28 東京エレクトロン株式会社 処理装置
US20060000802A1 (en) * 2004-06-30 2006-01-05 Ajay Kumar Method and apparatus for photomask plasma etching
JP4480660B2 (ja) * 2005-10-27 2010-06-16 Ｎｅｃエンジニアリング株式会社 基板貼り合わせ装置
US20090041568A1 (en) * 2006-01-31 2009-02-12 Tokyo Electron Limited Substrate processing apparatus, substrate placing table used for same, and member exposed to plasma
KR20080002323A (ko) 2006-06-30 2008-01-04 엘지.필립스 엘시디 주식회사 합착 스테이지와 그 제어 장치 및 방법
JP5160802B2 (ja) 2007-03-27 2013-03-13 東京エレクトロン株式会社 プラズマ処理装置
TWI493609B (zh) 2007-10-23 2015-07-21 Semiconductor Energy Lab 半導體基板、顯示面板及顯示裝置的製造方法
KR100961871B1 (ko) 2008-04-02 2010-06-09 에이피시스템 주식회사 기판 접합 장치
WO2010019430A2 (en) 2008-08-12 2010-02-18 Applied Materials, Inc. Electrostatic chuck assembly
KR101359070B1 (ko) 2009-03-03 2014-02-05 도쿄엘렉트론가부시키가이샤 탑재대 구조, 성막 장치 및 원료 회수 방법
JP5482282B2 (ja) * 2009-03-03 2014-05-07 東京エレクトロン株式会社 載置台構造及び成膜装置
KR101522633B1 (ko) 2009-04-08 2015-05-22 주식회사 원익아이피에스 진공처리장치
FR2961630B1 (fr) 2010-06-22 2013-03-29 Soitec Silicon On Insulator Technologies Appareil de fabrication de dispositifs semi-conducteurs
KR101145756B1 (ko) 2010-07-30 2012-05-16 이지스코 주식회사 고무 점착식 척킹기구 및 이를 이용한 기판 합착장치
JP5379171B2 (ja) * 2010-08-23 2013-12-25 東京エレクトロン株式会社 接合システム、基板処理システム、接合方法、プログラム及びコンピュータ記憶媒体
CN103620744B (zh) * 2011-05-31 2017-09-29 应用材料公司 用于带有边缘、侧边及背面保护的干蚀刻的装置及方法
TWI585028B (zh) * 2013-01-30 2017-06-01 斯克林集團公司 剝離裝置及剝離方法

Also Published As

Publication number Publication date
US20150325463A1 (en) 2015-11-12
KR20150031435A (ko) 2015-03-24
TWI505939B (zh) 2015-11-01
KR20160088946A (ko) 2016-07-26
JP2014003245A (ja) 2014-01-09
KR101678352B1 (ko) 2016-11-21
TW201404598A (zh) 2014-02-01
WO2013190926A1 (ja) 2013-12-27
US9548232B2 (en) 2017-01-17

Similar Documents

Publication Publication Date Title
CN103026482B (zh) 利用临时载体处理衬底
TWI697938B (zh) 基板貼合裝置及基板貼合方法
JP6148532B2 (ja) 貼付装置及び貼付方法
TW201801136A (zh) 基板貼合裝置及基板貼合方法
JP5977592B2 (ja) 貼付装置
KR101747485B1 (ko) 시트 부착 장치 및 부착 방법
JP2008300414A (ja) 薄膜形成装置および薄膜形成方法
JP5639617B2 (ja) 貼付装置および貼付方法
JP6046926B2 (ja) 貼付装置
JP6055597B2 (ja) 貼付方法及び貼付装置
JP6291275B2 (ja) 貼付方法
TW201235197A (en) Substrate assembling device
JP6799988B2 (ja) 貼付装置
JP2001126851A (ja) 半導体ウエハーにおけるヒータ装置およびその製造方法
JP2010225924A (ja) 電子部品の実装装置及び実装方法
JP3348261B2 (ja) 基板の貼り合わせ方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150323

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150924

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20150924

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20151015

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20151020

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20151125

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20151222

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160122

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20160216

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160516

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20160526

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160719

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160722

R150 Certificate of patent or registration of utility model

Ref document number: 5977592

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250