KR20150031435A - 첩부 장치 - Google Patents

첩부 장치 Download PDF

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Publication number
KR20150031435A
KR20150031435A KR1020157000444A KR20157000444A KR20150031435A KR 20150031435 A KR20150031435 A KR 20150031435A KR 1020157000444 A KR1020157000444 A KR 1020157000444A KR 20157000444 A KR20157000444 A KR 20157000444A KR 20150031435 A KR20150031435 A KR 20150031435A
Authority
KR
South Korea
Prior art keywords
plate
support
substrate
plate member
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020157000444A
Other languages
English (en)
Korean (ko)
Inventor
준이치 가츠라가와
요시히로 이나오
시게루 가토
Original Assignee
도오꾜오까고오교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도오꾜오까고오교 가부시끼가이샤 filed Critical 도오꾜오까고오교 가부시끼가이샤
Publication of KR20150031435A publication Critical patent/KR20150031435A/ko
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020157000444A 2012-06-20 2013-05-07 첩부 장치 Ceased KR20150031435A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2012-139213 2012-06-20
JP2012139213A JP5977592B2 (ja) 2012-06-20 2012-06-20 貼付装置
PCT/JP2013/062816 WO2013190926A1 (ja) 2012-06-20 2013-05-07 貼付装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020167019018A Division KR101678352B1 (ko) 2012-06-20 2013-05-07 첩부 장치

Publications (1)

Publication Number Publication Date
KR20150031435A true KR20150031435A (ko) 2015-03-24

Family

ID=49768532

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020157000444A Ceased KR20150031435A (ko) 2012-06-20 2013-05-07 첩부 장치
KR1020167019018A Active KR101678352B1 (ko) 2012-06-20 2013-05-07 첩부 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020167019018A Active KR101678352B1 (ko) 2012-06-20 2013-05-07 첩부 장치

Country Status (5)

Country Link
US (1) US9548232B2 (enExample)
JP (1) JP5977592B2 (enExample)
KR (2) KR20150031435A (enExample)
TW (1) TWI505939B (enExample)
WO (1) WO2013190926A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6855399B2 (ja) 2018-01-26 2021-04-07 株式会社スギノマシン ノズルの振れの測定方法及びその装置
JP7355709B2 (ja) * 2020-05-29 2023-10-03 株式会社 日立パワーデバイス 接合治具および半導体装置の製造方法
IT202100018458A1 (it) * 2021-07-13 2023-01-13 Amx Automatrix S R L Pressa di sinterizzazione

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3165453B2 (ja) 1991-01-31 2001-05-14 富士通株式会社 プラズマディスプレイパネルの製造方法
JPH07335512A (ja) * 1994-06-08 1995-12-22 Canon Inc 接合方法および接合装置および接合物
JPH09316399A (ja) * 1996-05-28 1997-12-09 Canon Inc 基板貼合せ装置及び基板貼合せ方法
JP2980073B2 (ja) 1997-08-29 1999-11-22 日本電気株式会社 熱圧着装置及びその制御方法
US6081414A (en) 1998-05-01 2000-06-27 Applied Materials, Inc. Apparatus for improved biasing and retaining of a workpiece in a workpiece processing system
JP2002192394A (ja) 2000-12-28 2002-07-10 Mitsubishi Gas Chem Co Inc 無機基板のプレス加工法およびプレス装置
JP3487833B2 (ja) * 2001-04-24 2004-01-19 株式会社 日立インダストリイズ 基板貼り合わせ方法及び貼り合わせ装置
JP2003241157A (ja) * 2002-02-21 2003-08-27 Shibaura Mechatronics Corp 基板貼り合わせ装置、基板貼り合わせ方法、及び液晶表示パネルの製造装置、並びに製造方法
JP2003347360A (ja) * 2002-05-31 2003-12-05 Sumitomo Electric Ind Ltd ボンディングステージ
KR100511854B1 (ko) 2002-06-18 2005-09-02 아네르바 가부시키가이샤 정전 흡착 장치
JP4245138B2 (ja) * 2003-03-11 2009-03-25 富士通株式会社 基板貼合せ装置及び基板貼合せ方法
JP4031732B2 (ja) * 2003-05-26 2008-01-09 京セラ株式会社 静電チャック
JP4513329B2 (ja) * 2004-01-16 2010-07-28 東京エレクトロン株式会社 処理装置
US20060000802A1 (en) * 2004-06-30 2006-01-05 Ajay Kumar Method and apparatus for photomask plasma etching
JP4480660B2 (ja) * 2005-10-27 2010-06-16 Ｎｅｃエンジニアリング株式会社 基板貼り合わせ装置
WO2007088894A1 (ja) * 2006-01-31 2007-08-09 Tokyo Electron Limited 基板処理装置、ならびにそれに用いられる基板載置台およびプラズマに曝される部材
KR20080002323A (ko) 2006-06-30 2008-01-04 엘지.필립스 엘시디 주식회사 합착 스테이지와 그 제어 장치 및 방법
JP5160802B2 (ja) 2007-03-27 2013-03-13 東京エレクトロン株式会社 プラズマ処理装置
TWI493609B (zh) * 2007-10-23 2015-07-21 Semiconductor Energy Lab 半導體基板、顯示面板及顯示裝置的製造方法
KR100961871B1 (ko) 2008-04-02 2010-06-09 에이피시스템 주식회사 기판 접합 장치
EP2321846A4 (en) 2008-08-12 2012-03-14 Applied Materials Inc ELECTROSTATIC FODDER ASSEMBLY
JP5482282B2 (ja) * 2009-03-03 2014-05-07 東京エレクトロン株式会社 載置台構造及び成膜装置
CN102341902A (zh) 2009-03-03 2012-02-01 东京毅力科创株式会社 载置台结构、成膜装置和原料回收方法
KR101522633B1 (ko) 2009-04-08 2015-05-22 주식회사 원익아이피에스 진공처리장치
FR2961630B1 (fr) 2010-06-22 2013-03-29 Soitec Silicon On Insulator Technologies Appareil de fabrication de dispositifs semi-conducteurs
KR101145756B1 (ko) 2010-07-30 2012-05-16 이지스코 주식회사 고무 점착식 척킹기구 및 이를 이용한 기판 합착장치
JP5379171B2 (ja) * 2010-08-23 2013-12-25 東京エレクトロン株式会社 接合システム、基板処理システム、接合方法、プログラム及びコンピュータ記憶媒体
CN103620744B (zh) * 2011-05-31 2017-09-29 应用材料公司 用于带有边缘、侧边及背面保护的干蚀刻的装置及方法
TWI585028B (zh) * 2013-01-30 2017-06-01 斯克林集團公司 剝離裝置及剝離方法

Also Published As

Publication number Publication date
US9548232B2 (en) 2017-01-17
TWI505939B (zh) 2015-11-01
US20150325463A1 (en) 2015-11-12
KR101678352B1 (ko) 2016-11-21
TW201404598A (zh) 2014-02-01
WO2013190926A1 (ja) 2013-12-27
JP5977592B2 (ja) 2016-08-24
JP2014003245A (ja) 2014-01-09
KR20160088946A (ko) 2016-07-26

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