TWI505939B - 貼合裝置 - Google Patents
貼合裝置 Download PDFInfo
- Publication number
- TWI505939B TWI505939B TW102117203A TW102117203A TWI505939B TW I505939 B TWI505939 B TW I505939B TW 102117203 A TW102117203 A TW 102117203A TW 102117203 A TW102117203 A TW 102117203A TW I505939 B TWI505939 B TW I505939B
- Authority
- TW
- Taiwan
- Prior art keywords
- plate
- laminated body
- plate member
- substrate
- support
- Prior art date
Links
- 238000003825 pressing Methods 0.000 claims description 83
- 239000000758 substrate Substances 0.000 claims description 73
- 230000002093 peripheral effect Effects 0.000 claims description 43
- 239000012790 adhesive layer Substances 0.000 claims description 39
- 238000010438 heat treatment Methods 0.000 claims description 15
- 239000000919 ceramic Substances 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 12
- 238000010030 laminating Methods 0.000 claims description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 238000000034 method Methods 0.000 description 24
- 230000008602 contraction Effects 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 238000001514 detection method Methods 0.000 description 7
- 238000005452 bending Methods 0.000 description 6
- 229920005992 thermoplastic resin Polymers 0.000 description 6
- 238000000576 coating method Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000002648 laminated material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Fluid Mechanics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012139213A JP5977592B2 (ja) | 2012-06-20 | 2012-06-20 | 貼付装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201404598A TW201404598A (zh) | 2014-02-01 |
| TWI505939B true TWI505939B (zh) | 2015-11-01 |
Family
ID=49768532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102117203A TWI505939B (zh) | 2012-06-20 | 2013-05-15 | 貼合裝置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9548232B2 (enExample) |
| JP (1) | JP5977592B2 (enExample) |
| KR (2) | KR20150031435A (enExample) |
| TW (1) | TWI505939B (enExample) |
| WO (1) | WO2013190926A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6855399B2 (ja) | 2018-01-26 | 2021-04-07 | 株式会社スギノマシン | ノズルの振れの測定方法及びその装置 |
| JP7355709B2 (ja) * | 2020-05-29 | 2023-10-03 | 株式会社 日立パワーデバイス | 接合治具および半導体装置の製造方法 |
| IT202100018458A1 (it) * | 2021-07-13 | 2023-01-13 | Amx Automatrix S R L | Pressa di sinterizzazione |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07335512A (ja) * | 1994-06-08 | 1995-12-22 | Canon Inc | 接合方法および接合装置および接合物 |
| JP2003241157A (ja) * | 2002-02-21 | 2003-08-27 | Shibaura Mechatronics Corp | 基板貼り合わせ装置、基板貼り合わせ方法、及び液晶表示パネルの製造装置、並びに製造方法 |
| TW200417796A (en) * | 2003-03-11 | 2004-09-16 | Fujitsu Ltd | Apparatus and method for bonding substrates |
| JP2007121639A (ja) * | 2005-10-27 | 2007-05-17 | Nec Engineering Ltd | 基板貼り合わせ装置 |
| TW200933721A (en) * | 2007-10-23 | 2009-08-01 | Semiconductor Energy Lab | Method for manufacturing semiconductor substrate, display panel, and display device |
| TW201222695A (en) * | 2010-08-23 | 2012-06-01 | Tokyo Electron Ltd | Junction system, substrate processing system, junction method, and computer memory medium |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3165453B2 (ja) | 1991-01-31 | 2001-05-14 | 富士通株式会社 | プラズマディスプレイパネルの製造方法 |
| JPH09316399A (ja) * | 1996-05-28 | 1997-12-09 | Canon Inc | 基板貼合せ装置及び基板貼合せ方法 |
| JP2980073B2 (ja) | 1997-08-29 | 1999-11-22 | 日本電気株式会社 | 熱圧着装置及びその制御方法 |
| US6081414A (en) | 1998-05-01 | 2000-06-27 | Applied Materials, Inc. | Apparatus for improved biasing and retaining of a workpiece in a workpiece processing system |
| JP2002192394A (ja) | 2000-12-28 | 2002-07-10 | Mitsubishi Gas Chem Co Inc | 無機基板のプレス加工法およびプレス装置 |
| JP3487833B2 (ja) * | 2001-04-24 | 2004-01-19 | 株式会社 日立インダストリイズ | 基板貼り合わせ方法及び貼り合わせ装置 |
| JP2003347360A (ja) * | 2002-05-31 | 2003-12-05 | Sumitomo Electric Ind Ltd | ボンディングステージ |
| KR100511854B1 (ko) | 2002-06-18 | 2005-09-02 | 아네르바 가부시키가이샤 | 정전 흡착 장치 |
| JP4031732B2 (ja) * | 2003-05-26 | 2008-01-09 | 京セラ株式会社 | 静電チャック |
| JP4513329B2 (ja) * | 2004-01-16 | 2010-07-28 | 東京エレクトロン株式会社 | 処理装置 |
| US20060000802A1 (en) * | 2004-06-30 | 2006-01-05 | Ajay Kumar | Method and apparatus for photomask plasma etching |
| US20090041568A1 (en) * | 2006-01-31 | 2009-02-12 | Tokyo Electron Limited | Substrate processing apparatus, substrate placing table used for same, and member exposed to plasma |
| KR20080002323A (ko) | 2006-06-30 | 2008-01-04 | 엘지.필립스 엘시디 주식회사 | 합착 스테이지와 그 제어 장치 및 방법 |
| JP5160802B2 (ja) | 2007-03-27 | 2013-03-13 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| KR100961871B1 (ko) | 2008-04-02 | 2010-06-09 | 에이피시스템 주식회사 | 기판 접합 장치 |
| WO2010019430A2 (en) | 2008-08-12 | 2010-02-18 | Applied Materials, Inc. | Electrostatic chuck assembly |
| KR101359070B1 (ko) | 2009-03-03 | 2014-02-05 | 도쿄엘렉트론가부시키가이샤 | 탑재대 구조, 성막 장치 및 원료 회수 방법 |
| JP5482282B2 (ja) * | 2009-03-03 | 2014-05-07 | 東京エレクトロン株式会社 | 載置台構造及び成膜装置 |
| KR101522633B1 (ko) | 2009-04-08 | 2015-05-22 | 주식회사 원익아이피에스 | 진공처리장치 |
| FR2961630B1 (fr) | 2010-06-22 | 2013-03-29 | Soitec Silicon On Insulator Technologies | Appareil de fabrication de dispositifs semi-conducteurs |
| KR101145756B1 (ko) | 2010-07-30 | 2012-05-16 | 이지스코 주식회사 | 고무 점착식 척킹기구 및 이를 이용한 기판 합착장치 |
| CN103620744B (zh) * | 2011-05-31 | 2017-09-29 | 应用材料公司 | 用于带有边缘、侧边及背面保护的干蚀刻的装置及方法 |
| TWI585028B (zh) * | 2013-01-30 | 2017-06-01 | 斯克林集團公司 | 剝離裝置及剝離方法 |
-
2012
- 2012-06-20 JP JP2012139213A patent/JP5977592B2/ja active Active
-
2013
- 2013-05-07 US US14/408,903 patent/US9548232B2/en active Active
- 2013-05-07 KR KR1020157000444A patent/KR20150031435A/ko not_active Ceased
- 2013-05-07 WO PCT/JP2013/062816 patent/WO2013190926A1/ja not_active Ceased
- 2013-05-07 KR KR1020167019018A patent/KR101678352B1/ko active Active
- 2013-05-15 TW TW102117203A patent/TWI505939B/zh active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07335512A (ja) * | 1994-06-08 | 1995-12-22 | Canon Inc | 接合方法および接合装置および接合物 |
| JP2003241157A (ja) * | 2002-02-21 | 2003-08-27 | Shibaura Mechatronics Corp | 基板貼り合わせ装置、基板貼り合わせ方法、及び液晶表示パネルの製造装置、並びに製造方法 |
| TW200417796A (en) * | 2003-03-11 | 2004-09-16 | Fujitsu Ltd | Apparatus and method for bonding substrates |
| JP2007121639A (ja) * | 2005-10-27 | 2007-05-17 | Nec Engineering Ltd | 基板貼り合わせ装置 |
| TW200933721A (en) * | 2007-10-23 | 2009-08-01 | Semiconductor Energy Lab | Method for manufacturing semiconductor substrate, display panel, and display device |
| TW201222695A (en) * | 2010-08-23 | 2012-06-01 | Tokyo Electron Ltd | Junction system, substrate processing system, junction method, and computer memory medium |
Also Published As
| Publication number | Publication date |
|---|---|
| US20150325463A1 (en) | 2015-11-12 |
| KR20150031435A (ko) | 2015-03-24 |
| KR20160088946A (ko) | 2016-07-26 |
| JP2014003245A (ja) | 2014-01-09 |
| KR101678352B1 (ko) | 2016-11-21 |
| TW201404598A (zh) | 2014-02-01 |
| WO2013190926A1 (ja) | 2013-12-27 |
| US9548232B2 (en) | 2017-01-17 |
| JP5977592B2 (ja) | 2016-08-24 |
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