JP2019186265A5 - - Google Patents

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Publication number
JP2019186265A5
JP2019186265A5 JP2018071298A JP2018071298A JP2019186265A5 JP 2019186265 A5 JP2019186265 A5 JP 2019186265A5 JP 2018071298 A JP2018071298 A JP 2018071298A JP 2018071298 A JP2018071298 A JP 2018071298A JP 2019186265 A5 JP2019186265 A5 JP 2019186265A5
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JP
Japan
Prior art keywords
substrate
fluid
chuck
pressurizing mechanism
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018071298A
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English (en)
Japanese (ja)
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JP2019186265A (ja
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Publication date
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Priority to JP2018071298A priority Critical patent/JP2019186265A/ja
Priority claimed from JP2018071298A external-priority patent/JP2019186265A/ja
Priority to KR1020190027591A priority patent/KR20190116056A/ko
Publication of JP2019186265A publication Critical patent/JP2019186265A/ja
Publication of JP2019186265A5 publication Critical patent/JP2019186265A5/ja
Pending legal-status Critical Current

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JP2018071298A 2018-04-03 2018-04-03 基板処理システム、基板処理方法、プログラム及びコンピュータ記憶媒体 Pending JP2019186265A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018071298A JP2019186265A (ja) 2018-04-03 2018-04-03 基板処理システム、基板処理方法、プログラム及びコンピュータ記憶媒体
KR1020190027591A KR20190116056A (ko) 2018-04-03 2019-03-11 기판 처리 시스템, 기판 처리 방법 및 기억 매체

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018071298A JP2019186265A (ja) 2018-04-03 2018-04-03 基板処理システム、基板処理方法、プログラム及びコンピュータ記憶媒体

Publications (2)

Publication Number Publication Date
JP2019186265A JP2019186265A (ja) 2019-10-24
JP2019186265A5 true JP2019186265A5 (enExample) 2021-05-06

Family

ID=68171755

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018071298A Pending JP2019186265A (ja) 2018-04-03 2018-04-03 基板処理システム、基板処理方法、プログラム及びコンピュータ記憶媒体

Country Status (2)

Country Link
JP (1) JP2019186265A (enExample)
KR (1) KR20190116056A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7400360B2 (ja) * 2019-11-06 2023-12-19 富士電機株式会社 半導体素子の製造方法
KR102321016B1 (ko) * 2020-01-13 2021-11-03 (주)제이쓰리 반도체 웨이퍼 형상을 제어하는 웨이퍼 가공기술
JP7688605B2 (ja) * 2022-06-08 2025-06-04 タツモ株式会社 接合装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2848337B1 (fr) * 2002-12-09 2005-09-09 Commissariat Energie Atomique Procede de realisation d'une structure complexe par assemblage de structures contraintes
JP5528405B2 (ja) * 2011-09-07 2014-06-25 東京エレクトロン株式会社 接合方法、プログラム、コンピュータ記憶媒体及び接合システム
JP6082654B2 (ja) * 2013-05-22 2017-02-15 株式会社ディスコ 研削方法
JP6226774B2 (ja) 2014-02-25 2017-11-08 日本碍子株式会社 複合基板の製法及び複合基板
JP5816388B1 (ja) * 2015-05-07 2015-11-18 信越エンジニアリング株式会社 貼合デバイスの製造方法及び貼合デバイスの製造装置

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