JP2013540837A5 - - Google Patents
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- JP2013540837A5 JP2013540837A5 JP2013524129A JP2013524129A JP2013540837A5 JP 2013540837 A5 JP2013540837 A5 JP 2013540837A5 JP 2013524129 A JP2013524129 A JP 2013524129A JP 2013524129 A JP2013524129 A JP 2013524129A JP 2013540837 A5 JP2013540837 A5 JP 2013540837A5
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- 229920000642 polymer Polymers 0.000 claims description 91
- 239000000203 mixture Substances 0.000 claims description 83
- 239000002904 solvent Substances 0.000 claims description 14
- WZZPVFWYFOZMQS-UHFFFAOYSA-N bicyclo[2.2.1]heptane-3,4-diol Chemical compound C1CC2(O)C(O)CC1C2 WZZPVFWYFOZMQS-UHFFFAOYSA-N 0.000 claims description 12
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 claims description 11
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 10
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 9
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 claims description 8
- BXGYYDRIMBPOMN-UHFFFAOYSA-N 2-(hydroxymethoxy)ethoxymethanol Chemical compound OCOCCOCO BXGYYDRIMBPOMN-UHFFFAOYSA-N 0.000 claims description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical group CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 8
- 239000000178 monomer Substances 0.000 claims description 8
- 230000000707 stereoselective effect Effects 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 230000004907 flux Effects 0.000 claims description 7
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 claims description 6
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 6
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 claims description 6
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 5
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 5
- 235000019253 formic acid Nutrition 0.000 claims description 5
- 229920000515 polycarbonate Polymers 0.000 claims description 5
- 239000004417 polycarbonate Substances 0.000 claims description 5
- YWVYZMVYXAVAKS-UHFFFAOYSA-N pyridin-1-ium;trifluoromethanesulfonate Chemical compound C1=CC=[NH+]C=C1.[O-]S(=O)(=O)C(F)(F)F YWVYZMVYXAVAKS-UHFFFAOYSA-N 0.000 claims description 5
- VGZKCAUAQHHGDK-UHFFFAOYSA-M bis(4-tert-butylphenyl)iodanium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC(C(C)(C)C)=CC=C1[I+]C1=CC=C(C(C)(C)C)C=C1 VGZKCAUAQHHGDK-UHFFFAOYSA-M 0.000 claims description 4
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 claims description 4
- 229920000379 polypropylene carbonate Polymers 0.000 claims description 4
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical group CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 claims description 4
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 claims description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 3
- SJWNMXYJLKDWOG-UHFFFAOYSA-N [2-(4-methoxynaphthalen-1-yl)-2-oxoethyl]-dimethylsulfanium Chemical compound C1=CC=C2C(OC)=CC=C(C(=O)C[S+](C)C)C2=C1 SJWNMXYJLKDWOG-UHFFFAOYSA-N 0.000 claims description 3
- UCFVAGFTLWZIMC-UHFFFAOYSA-M benzyl-(4-methoxyphenyl)-dimethylazanium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC(OC)=CC=C1[N+](C)(C)CC1=CC=CC=C1 UCFVAGFTLWZIMC-UHFFFAOYSA-M 0.000 claims description 3
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 2
- JMMSLMMJRMCXPW-UHFFFAOYSA-N OC.OC.C1CC2CCC1C2 Chemical group OC.OC.C1CC2CCC1C2 JMMSLMMJRMCXPW-UHFFFAOYSA-N 0.000 claims 2
- DNFSNYQTQMVTOK-UHFFFAOYSA-N bis(4-tert-butylphenyl)iodanium Chemical compound C1=CC(C(C)(C)C)=CC=C1[I+]C1=CC=C(C(C)(C)C)C=C1 DNFSNYQTQMVTOK-UHFFFAOYSA-N 0.000 claims 2
- 125000002243 cyclohexanonyl group Chemical group *C1(*)C(=O)C(*)(*)C(*)(*)C(*)(*)C1(*)* 0.000 claims 2
- ANEFWEBMQHRDLH-UHFFFAOYSA-N tris(2,3,4,5,6-pentafluorophenyl) borate Chemical compound FC1=C(F)C(F)=C(F)C(F)=C1OB(OC=1C(=C(F)C(F)=C(F)C=1F)F)OC1=C(F)C(F)=C(F)C(F)=C1F ANEFWEBMQHRDLH-UHFFFAOYSA-N 0.000 claims 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- RDCRVCNPGSYUCY-UHFFFAOYSA-N [4-(hydroxymethyl)-3-bicyclo[2.2.1]heptanyl]methanol Chemical group C1CC2(CO)C(CO)CC1C2 RDCRVCNPGSYUCY-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 description 2
- 238000000197 pyrolysis Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US37121110P | 2010-08-06 | 2010-08-06 | |
| US37148910P | 2010-08-06 | 2010-08-06 | |
| US61/371,211 | 2010-08-06 | ||
| US61/371,489 | 2010-08-06 | ||
| PCT/US2011/046732 WO2012019092A1 (en) | 2010-08-06 | 2011-08-05 | Polymer composition for microelectronic assembly |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013540837A JP2013540837A (ja) | 2013-11-07 |
| JP2013540837A5 true JP2013540837A5 (enExample) | 2014-04-24 |
| JP5704495B2 JP5704495B2 (ja) | 2015-04-22 |
Family
ID=45555212
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013524128A Expired - Fee Related JP5837069B2 (ja) | 2010-08-06 | 2011-08-05 | 立体特異性多環式２，３−ジオールモノマーから誘導される繰り返し単位を有するポリカーボネートを含む犠牲ポリマー組成物 |
| JP2013524129A Expired - Fee Related JP5704495B2 (ja) | 2010-08-06 | 2011-08-05 | マイクロエレクトロニクス組立用のポリマー組成物 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013524128A Expired - Fee Related JP5837069B2 (ja) | 2010-08-06 | 2011-08-05 | 立体特異性多環式２，３−ジオールモノマーから誘導される繰り返し単位を有するポリカーボネートを含む犠牲ポリマー組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (4) | US8575248B2 (enExample) |
| EP (2) | EP2601239A1 (enExample) |
| JP (2) | JP5837069B2 (enExample) |
| KR (2) | KR101650893B1 (enExample) |
| CN (2) | CN103119082A (enExample) |
| WO (2) | WO2012019091A1 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5837069B2 (ja) | 2010-08-06 | 2015-12-24 | プロメラス， エルエルシー | 立体特異性多環式２，３−ジオールモノマーから誘導される繰り返し単位を有するポリカーボネートを含む犠牲ポリマー組成物 |
| US8535454B2 (en) * | 2010-11-23 | 2013-09-17 | Promerus, Llc | Polymer composition for microelectronic assembly |
| WO2014007231A1 (ja) * | 2012-07-04 | 2014-01-09 | 株式会社カネカ | ポジ型感光性組成物、薄膜トランジスタ及び化合物 |
| US9505948B2 (en) * | 2012-12-17 | 2016-11-29 | Promerus, Llc | Thermally decomposable polymer compositions for forming microelectronic assemblies |
| TW201446876A (zh) * | 2013-02-28 | 2014-12-16 | Promerus Llc | 具有聚環官能側基之高玻璃轉換溫度之光可成像聚碳酸酯類聚合物 |
| JP6612533B2 (ja) * | 2015-06-12 | 2019-11-27 | 三菱瓦斯化学株式会社 | 反応現像画像形成法、反応現像画像形成法に用いられる感光性樹脂組成物、および反応現像画像形成方法により製造された基板ならびに構造物 |
| JP6807226B2 (ja) * | 2016-12-09 | 2021-01-06 | 東京応化工業株式会社 | 基材上に平坦化膜又はマイクロレンズを形成するために用いられるエネルギー感受性組成物、硬化体の製造方法、硬化体、マイクロレンズの製造方法、及びｃｍｏｓイメージセンサ |
| KR101880151B1 (ko) * | 2017-07-12 | 2018-07-20 | 주식회사 삼양사 | 폴리노보넨-폴리카보네이트 공중합체 및 그 제조방법 |
| CN111848933B (zh) * | 2020-06-28 | 2022-08-23 | 吴君宇 | 一种可降解共聚酯的制备方法 |
| CN114161031A (zh) * | 2021-12-30 | 2022-03-11 | 广东芯聚能半导体有限公司 | 助焊剂、助焊膜、预制焊片及其应用 |
| JP2023135288A (ja) * | 2022-03-15 | 2023-09-28 | 旭化成株式会社 | メチレン鎖を含む脂環式ポリカーボネート樹脂 |
| JPWO2024042951A1 (enExample) * | 2022-08-23 | 2024-02-29 | ||
| JP2023052255A (ja) * | 2022-08-23 | 2023-04-11 | サンアプロ株式会社 | 酸発生剤、前記酸発生剤を含む硬化性組成物、及びその硬化物 |
| WO2025203788A1 (ja) * | 2024-03-26 | 2025-10-02 | リンテック株式会社 | 分解性フィルムの使用方法およびレジストパターンの作製方法 |
| JP7745814B1 (ja) * | 2024-03-26 | 2025-09-29 | リンテック株式会社 | 分解性フィルムの使用方法およびレジストパターンの作製方法 |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US3492330A (en) * | 1965-12-09 | 1970-01-27 | Union Carbide Corp | Norbornane diisocyanates |
| UST896033I4 (en) * | 1971-05-07 | 1972-03-14 | Defensive publication | |
| DE68924887D1 (de) | 1988-09-02 | 1996-01-04 | Kuraray Co | Polycarbonat- oder Polyestercarbonatharze. |
| JPH0269519A (ja) * | 1988-09-02 | 1990-03-08 | Kuraray Co Ltd | ポリカーボネート系樹脂 |
| US5004508A (en) | 1989-12-12 | 1991-04-02 | International Business Machines Corporation | Thermally dissipated soldering flux |
| US5004509A (en) | 1990-05-04 | 1991-04-02 | Delco Electronics Corporation | Low residue soldering flux |
| US4994119A (en) | 1990-05-09 | 1991-02-19 | International Business Machines Corporation | Water soluble soldering flux |
| US5122200A (en) | 1990-09-17 | 1992-06-16 | Motorola, Inc. | Method of cleaning printed circuit boards using formic acid |
| US5177134A (en) * | 1990-12-03 | 1993-01-05 | Motorola, Inc. | Tacking agent |
| JP2957777B2 (ja) * | 1991-09-11 | 1999-10-06 | 株式会社クラレ | 縮合環含有化合物 |
| US5129962A (en) | 1991-10-22 | 1992-07-14 | International Business Machines Corporation | Tacky, no-clean thermally dissipated soldering flux |
| JP2859038B2 (ja) * | 1992-06-09 | 1999-02-17 | 株式会社クラレ | ポリカーボネート系樹脂のフィルムまたはシート |
| DE4338225A1 (de) | 1993-11-09 | 1995-05-11 | Linde Ag | Verfahren zum Wellenlöten mit bleifreien Lotmaterialien |
| US5615827A (en) | 1994-05-31 | 1997-04-01 | International Business Machines Corporation | Flux composition and corresponding soldering method |
| JP3989088B2 (ja) * | 1998-05-25 | 2007-10-10 | 住友ベークライト株式会社 | フォトレジスト用被膜形成材料、フォトレジスト組成物及びパターン形成方法 |
| US6217671B1 (en) | 1999-12-14 | 2001-04-17 | International Business Machines Corporation | Composition for increasing activity of a no-clean flux |
| TWI250968B (en) * | 2000-04-04 | 2006-03-11 | Asahi Kasei Corp | Coating composition for use in producing a silica insulating thin film and method for producing a silica insulating thin film |
| KR100812891B1 (ko) * | 2000-04-28 | 2008-03-11 | 메르크 파텐트 게엠베하 | 무기물 표면용 에칭 페이스트 |
| EP1330327B1 (de) | 2000-10-06 | 2010-03-17 | Pac Tech - Packaging Technologies GmbH | Verfahren zum flussmittelfreien aufbringen eines lötmittels auf ein substrat oder einen chip |
| GB2380964B (en) | 2001-09-04 | 2005-01-12 | Multicore Solders Ltd | Lead-free solder paste |
| US6592090B1 (en) | 2002-08-23 | 2003-07-15 | Chin-Chu Li | Object supporting structure |
| US7799516B2 (en) * | 2002-10-16 | 2010-09-21 | Georgia Tech Research Corporation | Polymers, methods of use thereof, and methods of decomposition thereof |
| EP1567580A4 (en) * | 2002-11-01 | 2008-04-30 | Georgia Tech Res Inst | OCCUPANCY COMPOSITIONS, METHOD FOR THEIR USE AND METHOD FOR THE DISASSEMBLY OF THE SAME |
| US7157025B2 (en) * | 2003-03-27 | 2007-01-02 | Toda Kogyo Corporation | Transparent coloring composition and color filter |
| EP1758814A4 (en) * | 2004-03-15 | 2010-12-15 | Georgia Tech Res Inst | CAPACITY FOR ELECTRO-MECHANICAL MICROSYSTEMS AND MANUFACTURING METHOD THEREFOR |
| WO2006066026A1 (en) * | 2004-12-15 | 2006-06-22 | E. I. Du Pont De Nemours And Company | Durable coating compositions containing novel aspartic amine compounds |
| EP1893355A1 (en) * | 2005-06-16 | 2008-03-05 | Advanced Technology Materials, Inc. | Dense fluid compositions for removal of hardened photoresist, post-etch residue and/or bottom anti-reflective coating layers |
| US20090071837A1 (en) * | 2005-11-18 | 2009-03-19 | Mikael Fredenberg | Master electrode and method of forming it |
| US7601482B2 (en) * | 2006-03-28 | 2009-10-13 | Az Electronic Materials Usa Corp. | Negative photoresist compositions |
| US8110015B2 (en) | 2007-05-30 | 2012-02-07 | Illinois Tool Works, Inc. | Method and apparatus for removing contaminants from a reflow apparatus |
| JP5433945B2 (ja) * | 2007-12-12 | 2014-03-05 | 三菱化学株式会社 | ポリカーボネートからなる車両用ランプレンズ |
| US20090294515A1 (en) * | 2008-05-30 | 2009-12-03 | Prack Edward R | Mounting integrated circuit components on substrates |
| US7971347B2 (en) | 2008-06-27 | 2011-07-05 | Intel Corporation | Method of interconnecting workpieces |
| US8575245B2 (en) | 2008-12-23 | 2013-11-05 | Novomer, Inc. | Tunable polymer compositions |
| JP5339355B2 (ja) | 2009-03-31 | 2013-11-13 | Ｙｋｋ Ａｐ株式会社 | 門 |
| TWI479259B (zh) * | 2009-06-15 | 2015-04-01 | Sumitomo Bakelite Co | A temporary fixing agent for a semiconductor wafer, and a method of manufacturing the semiconductor device using the same |
| KR101071401B1 (ko) * | 2010-07-07 | 2011-10-07 | 주식회사 엘지화학 | 광반응성 노보넨계 공중합체, 이의 제조 방법 및 이를 포함하는 배향막 |
| JP5837069B2 (ja) * | 2010-08-06 | 2015-12-24 | プロメラス， エルエルシー | 立体特異性多環式２，３−ジオールモノマーから誘導される繰り返し単位を有するポリカーボネートを含む犠牲ポリマー組成物 |
-
2011
- 2011-08-05 JP JP2013524128A patent/JP5837069B2/ja not_active Expired - Fee Related
- 2011-08-05 EP EP11749044.1A patent/EP2601239A1/en not_active Withdrawn
- 2011-08-05 KR KR1020137005707A patent/KR101650893B1/ko not_active Expired - Fee Related
- 2011-08-05 WO PCT/US2011/046729 patent/WO2012019091A1/en not_active Ceased
- 2011-08-05 JP JP2013524129A patent/JP5704495B2/ja not_active Expired - Fee Related
- 2011-08-05 CN CN2011800459816A patent/CN103119082A/zh active Pending
- 2011-08-05 KR KR1020137005706A patent/KR101729065B1/ko not_active Expired - Fee Related
- 2011-08-05 US US13/204,036 patent/US8575248B2/en not_active Expired - Fee Related
- 2011-08-05 US US13/204,044 patent/US8575297B2/en not_active Expired - Fee Related
- 2011-08-05 EP EP11745659.0A patent/EP2601238B1/en not_active Not-in-force
- 2011-08-05 CN CN201180045991.XA patent/CN103154081B/zh not_active Expired - Fee Related
- 2011-08-05 WO PCT/US2011/046732 patent/WO2012019092A1/en not_active Ceased
-
2013
- 2013-09-27 US US14/038,858 patent/US8729215B2/en not_active Expired - Fee Related
- 2013-09-27 US US14/039,433 patent/US8729166B2/en not_active Expired - Fee Related
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