JP2013534547A5 - - Google Patents
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- Publication number
- JP2013534547A5 JP2013534547A5 JP2013513788A JP2013513788A JP2013534547A5 JP 2013534547 A5 JP2013534547 A5 JP 2013534547A5 JP 2013513788 A JP2013513788 A JP 2013513788A JP 2013513788 A JP2013513788 A JP 2013513788A JP 2013534547 A5 JP2013534547 A5 JP 2013534547A5
- Authority
- JP
- Japan
- Prior art keywords
- silicon substrate
- emitter
- phosphorus
- silicon
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 9
- 229910052710 silicon Inorganic materials 0.000 claims 9
- 239000010703 silicon Substances 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 7
- 229910052698 phosphorus Inorganic materials 0.000 claims 6
- 239000011574 phosphorus Substances 0.000 claims 6
- 238000000034 method Methods 0.000 claims 3
- 230000005661 hydrophobic surface Effects 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000005368 silicate glass Substances 0.000 claims 2
- 230000003667 anti-reflective effect Effects 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 230000005670 electromagnetic radiation Effects 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US35283110P | 2010-06-09 | 2010-06-09 | |
| US61/352,831 | 2010-06-09 | ||
| PCT/IB2011/052418 WO2011154875A1 (en) | 2010-06-09 | 2011-06-01 | Aqueous alkaline etching and cleaning composition and method for treating the surface of silicon substrates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013534547A JP2013534547A (ja) | 2013-09-05 |
| JP2013534547A5 true JP2013534547A5 (enExample) | 2014-07-10 |
Family
ID=45097599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013513788A Pending JP2013534547A (ja) | 2010-06-09 | 2011-06-01 | 水性アルカリ性エッチング及び洗浄組成物、及びシリコン基材の表面を処理するための方法 |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US9076920B2 (enExample) |
| EP (1) | EP2580303B1 (enExample) |
| JP (1) | JP2013534547A (enExample) |
| KR (1) | KR101894603B1 (enExample) |
| CN (1) | CN103038311B (enExample) |
| ES (1) | ES2699223T3 (enExample) |
| MY (1) | MY160091A (enExample) |
| PH (1) | PH12012502385A1 (enExample) |
| SG (1) | SG186108A1 (enExample) |
| TW (1) | TWI498421B (enExample) |
| WO (1) | WO2011154875A1 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120295447A1 (en) * | 2010-11-24 | 2012-11-22 | Air Products And Chemicals, Inc. | Compositions and Methods for Texturing of Silicon Wafers |
| CN103717687B (zh) * | 2011-08-09 | 2016-05-18 | 巴斯夫欧洲公司 | 处理硅基材表面的含水碱性组合物和方法 |
| CN102751384A (zh) * | 2012-07-07 | 2012-10-24 | 蚌埠玻璃工业设计研究院 | 一种晶体硅表面织构方法 |
| WO2014024414A1 (ja) * | 2012-08-10 | 2014-02-13 | 第一工業製薬株式会社 | テクスチャー形成用エッチング液およびそれを用いたテクスチャー形成方法 |
| KR102118964B1 (ko) * | 2012-12-05 | 2020-06-08 | 엔테그리스, 아이엔씨. | Iii-v 반도체 물질을 세척하기 위한 조성물 및 이를 사용하는 방법 |
| US9416095B2 (en) | 2013-07-16 | 2016-08-16 | Akzo Nobel Chemicals International B.V. | Salts, crystals, complexes, and derivatives of threonine diacetic acid, a process to prepare threonine diacetic acid, and the use thereof |
| WO2015033815A1 (ja) | 2013-09-05 | 2015-03-12 | 株式会社Ｋｉｔ | 水素製造装置、水素製造方法、水素製造用シリコン微細粒子、及び水素製造用シリコン微細粒子の製造方法 |
| JP2015189829A (ja) * | 2014-03-27 | 2015-11-02 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP6373029B2 (ja) * | 2014-03-27 | 2018-08-15 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| DE102014206675A1 (de) * | 2014-04-07 | 2015-10-08 | Gebr. Schmid Gmbh | Verfahren und Lösung zur Herstellung und Nachbehandlung von Wafern |
| JP6417612B2 (ja) * | 2014-12-01 | 2018-11-07 | メック株式会社 | エッチング剤およびその補給液、マグネシウム部品の表面粗化方法、ならびにマグネシウム−樹脂複合体の製造方法 |
| KR101765212B1 (ko) | 2015-07-17 | 2017-08-04 | 주식회사 위즈켐 | 천연계 태양광 웨이퍼 세정제 조성물 |
| KR102457249B1 (ko) * | 2015-09-18 | 2022-10-21 | 주식회사 이엔에프테크놀로지 | 식각 조성물 |
| CN105118898A (zh) * | 2015-09-23 | 2015-12-02 | 中利腾晖光伏科技有限公司 | 一种硅片表面钝化方法及基于其的n型双面电池的制作方法 |
| TWI675905B (zh) * | 2015-11-14 | 2019-11-01 | 日商東京威力科創股份有限公司 | 使用稀釋的氫氧化四甲基銨處理微電子基板的方法 |
| CN107164109A (zh) * | 2017-03-31 | 2017-09-15 | 吴江创源新材料科技有限公司 | 一种蓝宝石晶片退火前清洗液及其制备方法和清洗工艺 |
| KR102756186B1 (ko) | 2020-02-05 | 2025-01-17 | 삼성전자주식회사 | 반도체 패키지 및 패키지-온-패키지의 제조 방법 |
| CN112689886B (zh) * | 2020-06-16 | 2022-11-18 | 福建晶安光电有限公司 | 一种衬底加工方法及半导体器件制造方法 |
| CN119286525B (zh) * | 2024-12-10 | 2025-06-24 | 嘉兴市小辰光伏科技有限公司 | 一种用于解决TOPCon电池LPCVD双插正面绕扩印的添加剂及清洗工艺 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50158281A (enExample) | 1974-06-10 | 1975-12-22 | ||
| GB1573206A (en) | 1975-11-26 | 1980-08-20 | Tokyo Shibaura Electric Co | Method of trating surfaces of intermediate products obtained in the manufacture of semiconductor devices |
| FR2372904A1 (fr) | 1976-11-19 | 1978-06-30 | Ibm | Composition de decapage du silicium polycristallin contenant de l'hydroxyde de tetramethylammonium et procede d'application |
| JPS6348830A (ja) | 1986-08-19 | 1988-03-01 | Toshiba Corp | 半導体表面処理方法 |
| JPS63274149A (ja) | 1987-05-06 | 1988-11-11 | Mitsubishi Gas Chem Co Inc | 半導体処理剤 |
| US5129955A (en) | 1989-01-11 | 1992-07-14 | Dainippon Screen Mfg. Co., Ltd. | Wafer cleaning method |
| US5207866A (en) | 1991-01-17 | 1993-05-04 | Motorola, Inc. | Anisotropic single crystal silicon etching solution and method |
| US5179414A (en) | 1991-01-22 | 1993-01-12 | Compag Computer Corporation | Apparatus for developing an image on a photoconductive surface |
| TW263531B (enExample) | 1992-03-11 | 1995-11-21 | Mitsubishi Gas Chemical Co | |
| TW274630B (enExample) | 1994-01-28 | 1996-04-21 | Wako Zunyaku Kogyo Kk | |
| US5466389A (en) | 1994-04-20 | 1995-11-14 | J. T. Baker Inc. | PH adjusted nonionic surfactant-containing alkaline cleaner composition for cleaning microelectronics substrates |
| US5498293A (en) | 1994-06-23 | 1996-03-12 | Mallinckrodt Baker, Inc. | Cleaning wafer substrates of metal contamination while maintaining wafer smoothness |
| ES2328309T3 (es) | 1998-05-18 | 2009-11-11 | Mallinckrodt Baker, Inc. | Composiciones alcalinas que contienen silicato para limpiar sustratos microelectronicos. |
| US6417147B2 (en) | 2000-02-29 | 2002-07-09 | Showa Denko K.K. | Cleaning agent composition, method for cleaning and use thereof |
| US6599370B2 (en) | 2000-10-16 | 2003-07-29 | Mallinckrodt Inc. | Stabilized alkaline compositions for cleaning microelectronic substrates |
| JP3893104B2 (ja) * | 2002-12-20 | 2007-03-14 | 花王株式会社 | 銅配線半導体基板用ポリマー洗浄剤組成物 |
| PL1664935T3 (pl) | 2003-08-19 | 2008-01-31 | Avantor Performance Mat Inc | Kompozycje do usuwania powłok oraz czyszczenia dla mikroelektroniki |
| CN1546627A (zh) * | 2003-12-16 | 2004-11-17 | 上海华虹（集团）有限公司 | 解决湿法剥离氮化硅薄膜新的清洗溶液 |
| SG150509A1 (en) * | 2004-03-01 | 2009-03-30 | Mallinckrodt Baker Inc | Nanoelectronic and microelectronic cleaning compositions |
| EP1866957A1 (en) * | 2005-04-08 | 2007-12-19 | Sachem, Inc. | Selective wet etching of metal nitrides |
| US8685909B2 (en) | 2006-09-21 | 2014-04-01 | Advanced Technology Materials, Inc. | Antioxidants for post-CMP cleaning formulations |
| WO2008061258A2 (en) * | 2006-11-17 | 2008-05-22 | Sachem, Inc. | Selective metal wet etch composition and process |
| KR100964153B1 (ko) | 2006-11-22 | 2010-06-17 | 엘지전자 주식회사 | 태양전지의 제조방법 및 그에 의해 제조되는 태양전지 |
| KR101622862B1 (ko) | 2007-05-17 | 2016-05-19 | 엔테그리스, 아이엔씨. | Ｃｍｐ후 세정 제제용 신규한 항산화제 |
| CN100546627C (zh) * | 2007-06-29 | 2009-10-07 | 王芬 | 一种外用祛除黄褐斑的中药面膜 |
| WO2009044647A1 (ja) * | 2007-10-04 | 2009-04-09 | Mitsubishi Gas Chemical Company, Inc. | シリコンエッチング液およびエッチング方法 |
| US8809247B2 (en) | 2008-02-15 | 2014-08-19 | Lion Corporation | Cleaning composition and method for cleaning substrate for electronic device |
| US8623231B2 (en) * | 2008-06-11 | 2014-01-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for etching an ultra thin film |
| US9228148B2 (en) | 2008-12-04 | 2016-01-05 | Voestalpine Stahl Gmbh | Method for producing molded bodies from sheet steel galvanized on one or both sides |
| MY158452A (en) | 2009-09-21 | 2016-10-14 | Basf Se | Aqueous acidic etching solution and method for texturing the surface of single crystal and polycrystal silicon substrates |
-
2011
- 2011-06-01 ES ES11792023T patent/ES2699223T3/es active Active
- 2011-06-01 US US13/703,233 patent/US9076920B2/en not_active Expired - Fee Related
- 2011-06-01 CN CN201180037424.XA patent/CN103038311B/zh not_active Expired - Fee Related
- 2011-06-01 KR KR1020137000351A patent/KR101894603B1/ko not_active Expired - Fee Related
- 2011-06-01 SG SG2012087946A patent/SG186108A1/en unknown
- 2011-06-01 MY MYPI2012005135A patent/MY160091A/en unknown
- 2011-06-01 WO PCT/IB2011/052418 patent/WO2011154875A1/en not_active Ceased
- 2011-06-01 EP EP11792023.1A patent/EP2580303B1/en not_active Not-in-force
- 2011-06-01 PH PH1/2012/502385A patent/PH12012502385A1/en unknown
- 2011-06-01 JP JP2013513788A patent/JP2013534547A/ja active Pending
- 2011-06-09 TW TW100120249A patent/TWI498421B/zh not_active IP Right Cessation
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