JP2013530308A5 - - Google Patents
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- Publication number
- JP2013530308A5 JP2013530308A5 JP2013509562A JP2013509562A JP2013530308A5 JP 2013530308 A5 JP2013530308 A5 JP 2013530308A5 JP 2013509562 A JP2013509562 A JP 2013509562A JP 2013509562 A JP2013509562 A JP 2013509562A JP 2013530308 A5 JP2013530308 A5 JP 2013530308A5
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- target
- housing
- bearing
- respect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000005240 physical vapour deposition Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP10162560.6 | 2010-05-11 | ||
| EP10162560.6A EP2387063B1 (en) | 2010-05-11 | 2010-05-11 | Chamber for physical vapor deposition |
| PCT/EP2011/057626 WO2011141513A1 (en) | 2010-05-11 | 2011-05-11 | Chamber for physical vapor deposition |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016005561A Division JP6275755B2 (ja) | 2010-05-11 | 2016-01-14 | 物理的気相堆積用のチャンバ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013530308A JP2013530308A (ja) | 2013-07-25 |
| JP2013530308A5 true JP2013530308A5 (enExample) | 2014-06-26 |
Family
ID=42320179
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013509562A Ceased JP2013530308A (ja) | 2010-05-11 | 2011-05-11 | 物理的気相堆積用のチャンバ |
| JP2016005561A Expired - Fee Related JP6275755B2 (ja) | 2010-05-11 | 2016-01-14 | 物理的気相堆積用のチャンバ |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016005561A Expired - Fee Related JP6275755B2 (ja) | 2010-05-11 | 2016-01-14 | 物理的気相堆積用のチャンバ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8758579B2 (enExample) |
| EP (2) | EP2387063B1 (enExample) |
| JP (2) | JP2013530308A (enExample) |
| KR (1) | KR101667195B1 (enExample) |
| CN (1) | CN102918622B (enExample) |
| TW (1) | TWI537411B (enExample) |
| WO (1) | WO2011141513A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101913791B1 (ko) * | 2014-07-22 | 2018-11-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 타겟 어레인지먼트, 그를 구비한 프로세싱 장치 및 그의 제조 방법 |
| TWI700750B (zh) * | 2017-01-24 | 2020-08-01 | 美商應用材料股份有限公司 | 用於介電薄膜的選擇性沉積之方法及設備 |
| WO2020048846A1 (en) | 2018-09-03 | 2020-03-12 | Agc Glass Europe | Kit for mounting a surface treatment chamber |
| NL2023642B1 (en) | 2019-08-14 | 2021-02-24 | Leydenjar Tech B V | Silicon composition material for use as battery anode |
| WO2022058014A1 (en) * | 2020-09-17 | 2022-03-24 | Applied Materials, Inc. | Cathode assembly, deposition apparatus and method for sputter deposition |
| CN118401696A (zh) * | 2021-12-16 | 2024-07-26 | 应用材料公司 | 用于溅射沉积的阴极组件、沉积设备和方法 |
| NL2030360B1 (en) * | 2021-12-30 | 2023-07-06 | Leydenjar Tech B V | Plasma-enhanced Chemical Vapour Deposition Apparatus |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5924758U (ja) * | 1982-08-04 | 1984-02-16 | 株式会社徳田製作所 | スパツタリング装置 |
| US4519885A (en) * | 1983-12-27 | 1985-05-28 | Shatterproof Glass Corp. | Method and apparatus for changing sputtering targets in a magnetron sputtering system |
| US5591314A (en) * | 1995-10-27 | 1997-01-07 | Morgan; Steven V. | Apparatus for affixing a rotating cylindrical magnetron target to a spindle |
| US5824197A (en) * | 1996-06-05 | 1998-10-20 | Applied Materials, Inc. | Shield for a physical vapor deposition chamber |
| US6254745B1 (en) * | 1999-02-19 | 2001-07-03 | Tokyo Electron Limited | Ionized physical vapor deposition method and apparatus with magnetic bucket and concentric plasma and material source |
| JP4614037B2 (ja) * | 2000-09-08 | 2011-01-19 | Ａｇｃセラミックス株式会社 | 円筒状ターゲット |
| US20050051422A1 (en) * | 2003-02-21 | 2005-03-10 | Rietzel James G. | Cylindrical magnetron with self cleaning target |
| US7097744B2 (en) * | 2003-06-12 | 2006-08-29 | Applied Materials, Inc. | Method and apparatus for controlling darkspace gap in a chamber |
| US20050005846A1 (en) * | 2003-06-23 | 2005-01-13 | Venkat Selvamanickam | High throughput continuous pulsed laser deposition process and apparatus |
| JP2005213585A (ja) * | 2004-01-29 | 2005-08-11 | Konica Minolta Opto Inc | マグネトロンスパッタ装置 |
| JP4836956B2 (ja) * | 2004-10-18 | 2011-12-14 | ベーカート・アドヴァンスト・コーティングス | 回転可能なターゲットスパッタリング装置用エンドブロック |
| PL1799876T3 (pl) * | 2004-10-18 | 2009-07-31 | Bekaert Advanced Coatings | Płaski blok końcowy do podtrzymywania obrotowego targetu do napylania |
| DE102004060423B4 (de) * | 2004-12-14 | 2016-10-27 | Heraeus Deutschland GmbH & Co. KG | Rohrtarget und dessen Verwendung |
| EP1698715A1 (de) * | 2005-03-03 | 2006-09-06 | Applied Films GmbH & Co. KG | Anlage zum Beschichten eines Substrats und Einschubelement |
| CN1827545B (zh) * | 2005-03-03 | 2012-11-07 | 应用材料两合股份有限公司 | 涂敷基底的系统及插入元件 |
| JP5004942B2 (ja) * | 2005-03-11 | 2012-08-22 | ベーカート・アドヴァンスト・コーティングス | 単一の直角エンドブロック |
| US20070134500A1 (en) * | 2005-12-14 | 2007-06-14 | Klaus Hartig | Sputtering targets and methods for depositing film containing tin and niobium |
| US8500972B2 (en) * | 2008-04-14 | 2013-08-06 | Angstrom Sciences, Inc. | Cylindrical magnetron |
| US20100101949A1 (en) * | 2008-10-24 | 2010-04-29 | Applied Materials, Inc. | Rotatable sputter target backing cylinder, rotatable sputter target, method of producing a rotatable sputter target, and coating installation |
-
2010
- 2010-05-11 EP EP10162560.6A patent/EP2387063B1/en not_active Not-in-force
- 2010-05-11 EP EP13196091.6A patent/EP2709138B1/en not_active Not-in-force
- 2010-05-17 US US12/781,723 patent/US8758579B2/en not_active Expired - Fee Related
-
2011
- 2011-04-20 TW TW100113714A patent/TWI537411B/zh not_active IP Right Cessation
- 2011-05-11 JP JP2013509562A patent/JP2013530308A/ja not_active Ceased
- 2011-05-11 KR KR1020127032144A patent/KR101667195B1/ko not_active Expired - Fee Related
- 2011-05-11 CN CN201180026737.5A patent/CN102918622B/zh not_active Expired - Fee Related
- 2011-05-11 WO PCT/EP2011/057626 patent/WO2011141513A1/en not_active Ceased
-
2016
- 2016-01-14 JP JP2016005561A patent/JP6275755B2/ja not_active Expired - Fee Related
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